W25Q256JWPIQ

The W25Q256JWPIQ is an electronic component from Winbond. View the full W25Q256JWPIQ datasheet below including key specifications, electrical characteristics, absolute maximum ratings.

Manufacturer

Winbond

Key Specifications

Parameter	Value
Packaging	Tube
Standard Pack Qty	100

Overview

Part: W25Q256JV — Winbond

Type: Serial Flash Memory

Description: The W25Q256JV is a 256M-bit (32M-byte) Serial Flash memory operating from a 2.7V to 3.6V supply, supporting Standard, Dual, and Quad SPI interfaces with clock frequencies up to 133MHz, enabling equivalent data transfer rates of 532MHz for Quad I/O.

Operating Conditions:

Supply voltage: 2.7V to 3.6V
Operating temperature: -40°C to +85°C
Max SPI clock frequency: 133MHz

Key Specs:

Capacity: 256M-bit / 32M-byte
Page size: 256-bytes
Sector erase size: 4KB
Block erase sizes: 32KB, 64KB
Continuous data transfer rate: 66MB/S
Program-Erase cycles: Min. 100K per sector
Data retention: More than 20-year
Power-down current: <1μA (typ.)

Features:

Standard SPI: CLK, /CS, DI, DO
Dual SPI: CLK, /CS, IO0, IO1
Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3
3 or 4-Byte Addressing Mode
Software & Hardware Reset
266/532MHz equivalent Dual/Quad SPI
Quad Peripheral Interface
Allows true XIP (execute in place) operation
Uniform Sector/Block Erase (4K/32K/64K-Byte)
Program 1 to 256 byte per programmable page
Erase/Program Suspend & Resume
Software Write-Protect
Power Supply Lock-Down
Special OTP protection
Top/Bottom, Complement Array Protection

Package:

WSON 8x6-mm (8-Pad)
SOIC 300-mil (16-Pin)
TFBGA 8x6-mm (24-Ball, 5x5 or 6x4 Ball Array)

Features

Software Write-Protect
Power Supply Lock-Down
Special OTP protection
Top/Bottom, Complement array protection
Individual Block/Sector array protection
64-Bit Unique ID for each device
Discoverable Parameters (SFDP) Register
3X256-Bytes Security Registers with OTP locks
Volatile & Non-volatile Status Register Bits

Pin Configuration

W25Q256JV is offered in an 8-pad WSON 8x6-mm (package code E), a 16-pin SOIC 300-mil (package code F) and two 24-ball 8x6-mm TFBGA (package code B & C) packages as shown in Figure 1a-c respectively. Package diagrams and dimensions are illustrated at the end of this datasheet.

Electrical Characteristics

PARAMETER	SYMBOL	CONDITIONS	SPEC	SPEC	SPEC	UNIT
PARAMETER	SYMBOL	CONDITIONS	MIN	TYP	MAX	UNIT
Input Capacitance	CIN (1)	VIN = 0V			6	pF
Output Capacitance	Cout (1)	VOUT = 0V			8	pF
Input Leakage	I LI				±2	μA
I/O Leakage	ILO				±2	μA
Standby Current	ICC1	/CS = VCC, VIN = GND or VCC		10	60	μA
Power-down Current	ICC2	/CS = VCC, VIN = GND or VCC		1	20	μA
Current Read Data / Dual /Quad 50MHz (2)	ICC3	C = 0.1 VCC / 0.9 VCC DO = Open			15	mA
Current Read Data / Dual Output Read/Quad Output Read 104MHz (2)	ICC3	C = 0.1 VCC / 0.9 VCC DO = Open			20	mA
Current Write Status Register	ICC4	/CS = VCC		20	25	mA
Current Page Program	ICC5	/CS = VCC		20	25	mA
Current Sector/Block Erase	ICC6	/CS = VCC		20	25	mA
Current Chip Erase	ICC7	/CS = VCC		20	25	mA
Input Low Voltage	VIL		-0.5		VCC x 0.3	V
Input High Voltage	VIH		VCC x 0.7		VCC + 0.4	V
Output Low Voltage	VOL	IOL = 100 μA			0.2	V
Output High Voltage	VOH	IOH = -100 μA	VCC - 0.2			V

Tested on sample basis and specified through design and characterization data. TA = 25° C, VCC = 3.0V.
Checker Board Pattern.

80 - Revision B

Absolute Maximum Ratings

PARAMETERS	SYMBOL	CONDITIONS	RANGE	UNIT
Supply Voltage	VCC		-0.6 to +4.6	V
Voltage Applied to Any Pin	VIO	Relative to Ground	-0.6 to VCC+0.4	V
Transient Voltage on any Pin	VIOT	<20nS Transient Relative to Ground	-2.0 to VCC+2.0	V
Storage Temperature	TSTG		-65 to +150	°C
Lead Temperature	TLEAD		See Note (2)	°C
Electrostatic Discharge Voltage	VESD	Human Body Model (3)	-2000 to +2000	V

This device has been designed and tested for the specified operation ranges. Proper operation outside of these levels is not guaranteed. Exposure to absolute maximum ratings may affect device reliability. Exposure beyond absolute maximum ratings may cause permanent damage.
Compliant with JEDEC Standard J-STD-20C for small body Sn-Pb or Pb-free (Green) assembly and the European directive on restrictions on hazardous substances (RoHS) 2002/95/EU.
JEDEC Std JESD22-A114A (C1=100pF, R1=1500 ohms, R2=500 ohms).

Related Variants

The following components are covered by the same datasheet.

Part Number	Manufacturer	Package
W25Q256JV	Winbond	—
W25Q256JVBIQ	Winbond	—
W25Q256JVCIQ	Winbond	—
W25Q256JVEIQ	Winbond	—
W25Q256JVFIQ	Winbond	—
W25Q256JVPIQ	Winbond	8-pad WSON 8x6-mm

Data on this page is extracted from publicly available manufacturer datasheets using automated tools including AI. It may contain errors or omissions. Always verify specifications against the official manufacturer datasheet before making design or purchasing decisions. See our Terms of Service. Rights holders can submit a takedown request.

Get structured datasheet data via API

Get started free