TPS62321DRC

Part: TPS62321DRVR (TPS62321 family, TPS623xx) — Texas Instruments

Type: Synchronous Step-Down (Buck) Converter

Description: 2.7–6 V input, 500 mA, 3 MHz fixed-frequency synchronous step-down converter with 1.5 V fixed output (TPS62321), 86 μA quiescent current and up to 93% efficiency.

Operating Conditions:

• Supply voltage: 2.7–6 V
• Operating temperature: -40 to 85 °C
• Switching frequency: 3 MHz (2.65–3.35 MHz); synchronizable to an external clock of 2.65–3.35 MHz
• Output current: up to 500 mA

Absolute Maximum Ratings:

• Voltage at VIN, AVIN, SW: -0.3 to 7 V
• Voltage at EN, MODE/SYNC: -0.3 V to VI + 0.3 V
• Voltage at FB, ADJ: -0.3 to 3.6 V
• Continuous output current: 500 mA
• Max operating junction temperature: 150 °C
• Storage temperature: -65 to 150 °C
• ESD (HBM): 2 kV (1 kV at VIN, SW); CDM 1.5 kV

Key Specs:

• Quiescent current (IO = 0 mA, PFM, TPS6232x): 86 μA typ, 105 μA max
• Shutdown current (EN = GND): 0.1 μA typ, 1 μA max
• UVLO threshold (TPS6232x): 2.40 V typ, 2.55 V max
• P-channel MOSFET rDS(on): 420 mΩ typ, 750 mΩ max (VI = 3.6 V)
• N-channel MOSFET rDS(on): 330 mΩ typ, 750 mΩ max (VI = 3.6 V)
• P-MOS current limit: 670 / 780 / 890 mA (min/typ/max)
• Fixed output voltage accuracy (TPS6232x, PWM mode): -0.5% to +1.8% over -40 to 85 °C
• Start-up time: 250 μs typ (IO = 200 mA)
• Minimum on-time: 35 ns typ
• Thermal shutdown: 150 °C, hysteresis 20 °C

Features:

• Up to 93% efficiency at 3 MHz operation
• Power-save mode at light load, forced PWM via MODE/SYNC
• 100% duty cycle for lowest dropout
• Synchronizable on the fly to an external clock
• Integrated active power-down sequencing (TPS6232x)
• Fixed and adjustable output voltage versions
• Complete 1 mm component profile solution

Applications:

• Cell phones, smart-phones
• WLAN and Bluetooth applications
• Micro DC-DC converter modules
• PDAs, pocket PCs
• USB-based DSL modems
• Digital cameras

Package:

• QFN-10 (3 x 3 mm, DRC)
• CSP-8 (YZD, YED; NanoFree/NanoStar)

• 234 · Up to 93% Efficiency at 3-MHz Operation
• Up to 500-mA Output Current at VI = 2.7 V
• 3-MHz Fixed Frequency Operation
• Best in Class Load and Line Transient
• Complete 1-mm Component Profile Solution
• -0.5% / +1.3% PWM DC Voltage Accuracy Over Temperature
• 35-ns Minimum On-Time
• Power-Save Mode Operation at Light Load Currents
• Fixed and Adjustable Output Voltage
• Only 86μ A Quiescent Current
• 100% Duty Cycle for Lowest Dropout
• Synchronizable On the Fly to External Clock Signal
• Integrated Active Power-Down Sequencing (TPS6232x only)
• Available in a 10-Pin QFN (3 x 3 mm), 8-Pin NanoFree™, and NanoStar™ (CSP) Packaging

• Cell Phones, Smart-Phones
• WLAN and Bluetooth™ Applications
• Micro DC-DC Converter Modules
• PDAs, Pocket PCs
• USB-Based DSL Modems
• Digital Cameras

Figure 1. Smallest Solution Size Application (Fixed Output Voltage)

1

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

2 NanoFree, NanoStar, TMS320 are trademarks of Texas Instruments.

3

4

Bluetooth is a trademark of Bluetooth SIG, Inc. PowerPAD is a trademark of Texas Instsruments.

SLVS528E-JULY 2004-REVISED NOVEMBER 2007

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

VI = 3.6 V, VO = 1.6 V, EN = VI, MODE/SYNC = GND, L = 1 μ H, CO = 10 μ F, TA = -40 ° C to 85 ° C, typical values are at TA = 25 ° C (unless otherwise noted)

over operating free-air temperature range (unless otherwise noted) (1)

SLVS528E-JULY 2004-REVISED NOVEMBER 2007

SLVS528E-JULY 2004-REVISED NOVEMBER 2007

As soon as the junction temperature, TJ, exceeds typically 150 ° C, the device goes into thermal shutdown. In this mode, the P- and N-channel MOSFETs are turned off. The device continues its operation when the junction temperature falls below typically 130 ° C again.

SLVS528E-JULY 2004-REVISED NOVEMBER 2007

SLVS528E-JULY 2004-REVISED NOVEMBER 2007

The TPS6230x, TPS6231x, and TPS6232x are also available in an 8-bump chip scale package (YZD, YZ NanoFree™ and YED, NanoStar™). The package dimensions are given as:

• D = 1.970 ±0.05 mm
• E = 0.970 ±0.05 mm