TPS62304

Part: TPS623xx — Texas Instruments

Type: Synchronous Step-Down DC-DC Converter

Description: A high-frequency synchronous step-down dc-dc converter optimized for battery-powered portable applications, supporting up to 500-mA load current with 3-MHz fixed switching frequency and up to 93% peak efficiency.

Operating Conditions:

• Supply voltage: 2.7–6 V
• Operating temperature: -40 to 85 °C
• Output voltage range: 0.6–5.4 V

Absolute Maximum Ratings:

• Max supply voltage: 7 V
• Max continuous current: 500 mA
• Max junction/storage temperature: 150 °C

Key Specs:

• Input voltage range: 2.7 V to 6 V
• Output current: Up to 500 mA
• Oscillator frequency: 3 MHz (typ)
• Operating quiescent current: 86 μA (typ, IO = 0 mA, PFM mode)
• Shutdown current: 0.1 μA (typ, EN = GND)
• P-channel MOSFET on resistance: 420 mΩ (typ, VI = 3.6 V)
• N-channel MOSFET on resistance: 330 mΩ (typ, VI = 3.6 V)
• Adjustable output voltage range: 0.6 V to 5.4 V
• PWM DC voltage accuracy: -0.5% / +1.3% (over temperature)

Features:

• Up to 93% Efficiency at 3-MHz Operation
• Up to 500-mA Output Current at VI = 2.7 V
• 3-MHz Fixed Frequency Operation
• Power-Save Mode Operation at Light Load Currents
• Fixed and Adjustable Output Voltage
• Synchronizable On the Fly to External Clock Signal
• Integrated Active Power-Down Sequencing (TPS6232x only)

Applications:

• Cell Phones, Smart-Phones
• WLAN and Bluetooth™ Applications
• Micro DC-DC Converter Modules
• PDAs, Pocket PCs
• USB-Based DSL Modems
• Digital Cameras

Package:

• QFN-10 (3 x 3 mm)
• CSP-8 (NanoFree™, NanoStar™)

• 234 · Up to 93% Efficiency at 3-MHz Operation
• Up to 500-mA Output Current at VI = 2.7 V
• 3-MHz Fixed Frequency Operation
• Best in Class Load and Line Transient
• Complete 1-mm Component Profile Solution
• -0.5% / +1.3% PWM DC Voltage Accuracy Over Temperature
• 35-ns Minimum On-Time
• Power-Save Mode Operation at Light Load Currents
• Fixed and Adjustable Output Voltage
• Only 86μ A Quiescent Current
• 100% Duty Cycle for Lowest Dropout
• Synchronizable On the Fly to External Clock Signal
• Integrated Active Power-Down Sequencing (TPS6232x only)
• Available in a 10-Pin QFN (3 x 3 mm), 8-Pin NanoFree™, and NanoStar™ (CSP) Packaging

• Cell Phones, Smart-Phones
• WLAN and Bluetooth™ Applications
• Micro DC-DC Converter Modules
• PDAs, Pocket PCs
• USB-Based DSL Modems
• Digital Cameras

Figure 1. Smallest Solution Size Application (Fixed Output Voltage)

1

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

2 NanoFree, NanoStar, TMS320 are trademarks of Texas Instruments.

3

4

Bluetooth is a trademark of Bluetooth SIG, Inc. PowerPAD is a trademark of Texas Instsruments.

SLVS528E-JULY 2004-REVISED NOVEMBER 2007

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

VI = 3.6 V, VO = 1.6 V, EN = VI, MODE/SYNC = GND, L = 1 μ H, CO = 10 μ F, TA = -40 ° C to 85 ° C, typical values are at TA = 25 ° C (unless otherwise noted)

over operating free-air temperature range (unless otherwise noted) (1)

SLVS528E-JULY 2004-REVISED NOVEMBER 2007

SLVS528E-JULY 2004-REVISED NOVEMBER 2007

As soon as the junction temperature, TJ, exceeds typically 150 ° C, the device goes into thermal shutdown. In this mode, the P- and N-channel MOSFETs are turned off. The device continues its operation when the junction temperature falls below typically 130 ° C again.

SLVS528E-JULY 2004-REVISED NOVEMBER 2007

SLVS528E-JULY 2004-REVISED NOVEMBER 2007

The TPS6230x, TPS6231x, and TPS6232x are also available in an 8-bump chip scale package (YZD, YZ NanoFree™ and YED, NanoStar™). The package dimensions are given as:

• D = 1.970 ±0.05 mm
• E = 0.970 ±0.05 mm