TLV755P

Part: TLV75518P — Texas Instruments

Type: Low-Dropout (LDO) Linear Regulator

Description: 500 mA, low-IQ (25 μA typ) LDO with 1.45–5.5 V input, fixed 0.6–5.0 V output options, ±1% typical accuracy, foldback current limit and active output discharge.

Operating Conditions:

• Input voltage: 1.45–5.5 V
• Output voltage: 0.6–5.0 V (fixed versions)
• Output current: 0 to 500 mA
• Operating junction temperature: -40 to 125 °C

Absolute Maximum Ratings:

• Max supply voltage (VIN): 6.0 V
• Max enable voltage (VEN): 6.0 V
• Max output voltage: VIN + 0.3 V
• Max junction temperature: 150 °C
• Storage temperature: -65 to 150 °C

Key Specs:

• Ground current (IOUT = 0 mA): 25 μA typ, 31 μA max at TJ = 25 °C; 40 μA max over -40 to 125 °C
• Shutdown current (VEN ≤ 0.4 V): 0.1 μA typ, 1 μA max
• Output accuracy: ±1% (-40 to 85 °C, DBV and DRV packages); ±1.5% (VOUT ≥ 1 V)
• Output current limit: 560 mA min, 720 mA typ, 865 mA max
• Short-circuit current limit: 355 mA typ (VOUT = 0 V)
• Dropout voltage (3.3 V ≤ VOUT < 5.0 V): 150 mV typ, 238 mV max (258 mV max for DYD package)
• PSRR: 46 dB at 100 kHz, 52 dB at 1 MHz (VIN = VOUT + 1 V, IOUT = 50 mA)
• Output noise: 71.5 μVRMS (10 Hz–100 kHz, VOUT = 1.2 V, IOUT = 50 mA)
• UVLO rising threshold: 1.3 V typ (1.21–1.44 V), 40 mV hysteresis
• Startup time: 550 μs typ
• Thermal shutdown: 165 °C typ
• Output pulldown resistance: 120 Ω typ

Features:

• Built-in soft-start with monotonic VOUT rise
• Foldback current limit
• Active output discharge
• Stable with a 1 μF ceramic output capacitor
• Integrated thermal shutdown and undervoltage lockout
• Enable pin (VHI ≥ 1 V, VLO ≤ 0.3 V)
• Thermally enhanced SOT-23-5 (DYD) option with RθJA of 60.3 °C/W

Applications:

• Set-top boxes, TV, and gaming consoles
• Portable and battery-powered equipment
• Desktops, notebooks, and ultrabooks
• Tablets and remote controls
• White goods and appliances
• Grid infrastructure and protection relays
• Camera modules and image sensors

Package:

• SOT-23-5 (DBV), 2.9 mm × 2.8 mm
• SOT-23-5 with thermal pad (DYD), 2.9 mm × 2.8 mm
• X2SON-4 (DQN), 1 mm × 1 mm
• WSON-6 (DRV), 2 mm × 2 mm

• SOT-23-5 package with 60.3°C/W RθJA available
• Input voltage range: 1.45V to 5.5V
• Low IQ: 25μA (typical)
• Low dropout:
• -238mV (maximum) at 500mA (3.3VOUT)
• Output accuracy: 1% (maximum at 85°C)
• Built-in soft-start with monotonic V OUT rise
• Foldback current limit
• Active output discharge
• High PSRR: 46dB at 100kHz
• Stable with a 1μF ceramic output capacitor
• Packages:
• -2.9mm × 2.8mm SOT-23-5 (DBV)
• -2.9mm × 2.8mm SOT-23-5 (DYD) with thermal pad
• -1mm × 1mm X2SON-4 (DQN)
• -2mm × 2mm WSON-6 (DRV)

• Set-top boxes, TV, and gaming consoles
• Portable and battery-powered equipment
• Desktops, notebooks, and ultrabooks
• Tablets and remote controls
• White goods and appliances
• Grid infrastructure and protection relays
• Camera modules and image sensors

Figure 4-1. DQN Package, 4-Pin X2SON (Top View)

Figure 4-3. DYD Package, 5-Pin SOT-23 With Exposed Thermal Pad (Top View)

Figure 4-2. DBV Package, 5-Pin SOT-23 (Top View)

NC = no internal connection.

Figure 4-4. DRV Package, 6-Pin WSON With Exposed Thermal Pad (Top View)

at operating temperature range (TJ =-40°C to 125°C), VIN=VOUT(NOM) + 0.5V or 2.0V (whichever is greater), IOUT = 1mA, VEN = VIN, and CIN = COUT = 1μF (unless otherwise noted); all typical values at T J = 25°C

over operating free-air temperature range (unless otherwise noted) (1)

over operating free-air temperature range (unless otherwise noted)

Start-Up Waveform

TLV755P

SBVS320D - NOVEMBER 2017 - REVISED SEPTEMBER 2024

• (1) For more information, see the Mechanical, Packaging, and Orderable Information .
• (2) The package size (length × width) is a nominal value and includes pins, where applicable.