STM32U575VG/I

Part: STM32U575xx

Type: 32-bit Microcontroller

Description: Ultra-low-power 32-bit Arm Cortex-M33 MCU operating up to 160 MHz with TrustZone, FPU, up to 2 MB Flash, and 786 KB SRAM.

Operating Conditions:

• Supply voltage: 1.71 to 3.6 V (IO_VDD_HSLV = 0)
• Operating temperature: -40 to +85 °C (suffix-dependent — see Table 32 for grade-specific ranges)
• Maximum AHB clock frequency: up to 160 MHz (Range 1)
• Analog supply voltage (VDDA): 1.62 to 3.6 V (ADC used)

Absolute Maximum Ratings:

• Max supply voltage: 4.0 V (VDDX - VSS)
• Max continuous current: 200 mA (total current into sum of all VDD lines)
• Max junction/storage temperature: 140 °C junction / -65 to +150 °C storage

Key Specs:

• Maximum CPU frequency: 160 MHz (Range 1)
• Flash memory: Up to 2 MB with ECC
• SRAM: Up to 786 KB (ECC OFF) or 722 KB (ECC ON)
• Core voltage (VCORE): 1.15 to 1.27 V (Range 1 typ. 1.21 V)
• Dynamic power consumption: 19.5 μA/MHz Run mode @ 3.3 V
• Low-power current (Shutdown mode): 160 nA
• Low-power current (Standby mode): 210 nA
• Analog-to-digital converters: 14-bit ADC at 2.5 Msps and 12-bit ADC at 2.5 Msps

Features:

• Arm 32-bit Cortex-M33 CPU with TrustZone, MPU, DSP, and FPU
• ART Accelerator with 8 KB instruction cache and 4 KB data cache
• Flexible power control with internal SMPS step-down converter and LDO
• Hardware math accelerators: CORDIC and FMAC
• Chrom-ART Accelerator (DMA2D) and digital camera interface
• Rich communication suite including USB Type-C / Power Delivery, USB OTG full-speed, Octo-SPI, CAN FD, SDMMC, and I2C Fast-mode Plus
• Up to 136 fast I/Os, most 5V-tolerant, with independent supply down to 1.08 V

Applications:

• Ultra-low-power connected IoT endpoints
• Smart metering and sensor hubs
• Wearables and portable medical devices
• Industrial automation and motor control

Package:

• LQFP48 (7 x 7 mm)
• UFQFPN48 (7 x 7 mm)
• LQFP64 (10 x 10 mm)
• WLCSP90 (4.2 x 3.95 mm)
• LQFP100 (14 x 14 mm)
• UFBGA132 (7 x 7 mm)
• LQFP144 (20 x 20 mm)
• UFBGA169 (7 x 7 mm)

• Chrom-ART Accelerator (DMA2D) for enhanced graphic content creation
• 1 digital camera interface

Table 25. Legend/abbreviations used in the pinout table

Table 25. Legend/abbreviations used in the pinout table

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Pinout, pin description and alternate functions

Pinout, pin description and alternate functions

DS13737 Rev 10

1. PC13, PC14 and PC15 are supplied through the power switch (by V SW ). Since the switch only sinks a limited amount of current (3 mA), the use of PC13 to PC15 GPIOs in output mode is limited:

• PC13 speed must not exceed 2 MHz with a maximum load of 30 pF. Refer to FT_o electrical characteristics for PC14, PC15.
• These GPIOs must not be used as current sources (for example to drive a LED).

1. After a backup domain power-up, PC13, PC14 and PC15 operate as GPIOs. Their function depends then on the content of the RTC registers that are not reset by the system reset. For details on how to manage these GPIOs, refer to the backup domain and RTC register descriptions in the product reference manual.
2. After reset, a pull-down resistor (Rd = 5.1 k Ω from UCPD peripheral) can be activated on PA15 and PB15 (UCPD1_CC1, UCPD1_CC2). The pull-down on PA15 (UCPD1_CC1) is activated by high level on PB5 (UCPD1_DBCC1). The pull-down on PB15 (UCPD1_CC2) is activated by high level on PB14 (UCPD1_DBCC2). This pull-down control (dead battery support on UCPD) can be disabled by setting UCPD_DBDIS = 1 in the PWR_UCPDR register.
3. After reset, this pin is configured as JTAG/SWD alternate functions. The internal pull-up on PA15, PA13, PB4 pins and the internal pull-down on PA14 pin are activated.

The definition and values of output AC characteristics are given in Figure 37: Output AC characteristics definition and in the table below respectively.

Unless otherwise specified, the parameters given are derived from tests performed under the ambient temperature and supply voltage conditions summarized in Table 32 .

Table 96. Output AC characteristics, HSLV OFF (all I/Os except FT_c, FT_t in V BAT mode and FT_o I/Os (1) ) (2)(3)(4)

Table 96. Output AC characteristics, HSLV OFF (all I/Os except FT_c, FT_t in V BAT mode and FT_o I/Os (1) ) (2)(3)(4)

305

Stresses above the absolute maximum ratings listed in Table 29 , Table 30 and Table 31 may cause permanent damage to the device. These are stress ratings only and the functional operation of the device at these conditions is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. Device mission profile (application conditions) is compliant with JEDEC JESD47 qualification standard, extended mission profiles are available on demand.

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Table 29. Voltage characteristics (1)(2)

1. The I/O structure options listed in this table can be a concatenation of options including the option explicitly listed. For instance TT_a refers to any TT I/O with _a option. TT_xx refers to any TT I/O and FT_xx refers to any FT I/O.
2. VDDIO1 or V DDIO2 or V SW , V DDIO1 = V DD .
3. VIN maximum must always be respected. Refer to Table 30 for the maximum allowed injected current values.
4. To sustain a voltage higher than 4 V, the internal pull-up/pull-down resistors must be disabled.
5. This formula has to be applied only on the power supplies related to the I/O structure described in the pin definition table.
6. Including VREF- pin.

Table 30. Current characteristics

Table 30. Current characteristics

1. This current consumption must be correctly distributed over all I/Os and control pins. The total output current must not be sunk/sourced between two consecutive power supply pins, referring to high pin count QFP packages.
2. Positive injection (when V IN > V DDIOx ) is not possible on these I/Os and does not occur for input voltages lower than the specified maximum value.
3. A negative injection is induced by V IN < V SS . I INJ(PIN) must never be exceeded. Refer also to Table 29 for the minimum allowed input voltage values.
4. When several inputs are submitted to a current injection, the maximum ∑ |I INJ(PIN) is the absolute sum of the negative injected currents (instantaneous values).

Table 31. Thermal characteristics

Table 31. Thermal characteristics

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The maximum chip-junction temperature, T J max, in degrees Celsius, can be calculated using the following equation:

$$T_J\text{ max} = T_A\text{ max} + (P_D\text{ max} \times \Theta_{JA})$$

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com . ECOPACK is an ST trademark.