STM32L053C6

Part: STM32L053C8T6 (STM32L053x6/x8 family) — STMicroelectronics

Type: Ultra-low-power ARM Cortex-M0+ MCU

Description: Ultra-low-power 32-bit Arm Cortex-M0+ MCU at up to 32 MHz with up to 64 KB Flash, 8 KB SRAM, 2 KB data EEPROM, LCD driver, USB 2.0, 12-bit ADC and DAC, operating from 1.65–3.6 V.

Operating Conditions:

• Supply voltage (VDD): 1.65–3.6 V (BOR disabled); 1.8–3.6 V at power-on with BOR enabled
• Operating temperature: -40 to 85 °C (range 6; range 7 is -40 to 105 °C and range 3 is -40 to 125 °C, suffix-dependent)
• Max CPU/bus clock (fHCLK, fPCLK1, fPCLK2): 32 MHz
• VDD_USB: 3.0–3.6 V when USB is used
• VDDA: 1.8–3.6 V for all analog features, 1.65–3.6 V if the DAC is not used

Absolute Maximum Ratings:

• Max supply voltage (VDD − VSS): 4.0 V
• Input voltage on FT/FTf pins: VDD + 4.0 V max
• Total current into all VDD lines: 105 mA
• Max current into each VDD pin: 100 mA
• I/O output current: 16 mA sunk (22 mA on FTf pins), -16 mA sourced per pin
• Storage temperature: -65 to +150 °C
• Max junction temperature: 150 °C

Key Specs:

• Core clock: 0–32 MHz
• Supply range: 1.65–3.6 V
• Power dissipation at TA = 85 °C: 444 mW (LQFP64), 363 mW (LQFP48), 327 mW (TFBGA64)
• Junction temperature range: -40 to 105 °C (range 6), up to 125 °C (range 7) and 130 °C (range 3)
• Input voltage on FT/FTf/RST pins: up to 5.5 V (2.0 V ≤ VDD ≤ 3.6 V)
• Run mode current: 88 μA/MHz
• Standby current: 0.27 μA (2 wakeup pins)
• Stop mode current: 0.4 μA

Features:

• Arm Cortex-M0+ core with MPU, 0.95 DMIPS/MHz
• Up to 64 KB Flash with ECC, 8 KB RAM, 2 KB data EEPROM with ECC
• 12-bit ADC at 1.14 Msps, up to 16 channels
• 12-bit DAC and 2 ultra-low-power comparators
• Up to 24 capacitive sensing channels
• USB 2.0 crystal-less, 2x USART, 1x low-power UART, up to 4x SPI, 2x I2C
• LCD driver for up to 8×28 segments
• 7-channel DMA, 9 timers, 2 watchdogs
• True RNG, CRC unit, 96-bit unique ID
• BOR with 5 selectable thresholds, POR/PDR, PVD
• Up to 51 fast I/Os (45 are 5 V tolerant)
• Serial wire debug, pre-programmed bootloader (USART, SPI)

Applications:

• Ultra-low-power battery-powered devices
• Touch-sensing and LCD user interfaces

Package:

• LQFP64 (10×10 mm)
• LQFP48 (7×7 mm)
• TFBGA64 (5×5 mm, 0.5 mm pitch)

• Ultra-low-power platform
• -1.65 V to 3.6 V power supply
• --40 to 125 °C temperature range
• -0.27 μA Standby mode (2 wakeup pins)
• -0.4 μA Stop mode (16 wakeup lines)
• -0.8 μA Stop mode + RTC + 8 KB RAM retention
• -88 μA/MHz in Run mode
• -3.5 μs wakeup time (from RAM)
• -5 μs wakeup time (from Flash memory)
• Core: Arm ® 32-bit Cortex ® -M0+ with MPU
• -From 32 kHz up to 32 MHz max.
• -0.95 DMIPS/MHz
• Memories
• -Up to 64 KB Flash memory with ECC
• -8KB RAM
• -2 KB of data EEPROM with ECC
• -20-byte backup register
• -Sector protection against R/W operation
• Up to 51 fast I/Os (45 I/Os 5V tolerant)
• Reset and supply management
• -Ultra-safe, low-power BOR (brownout reset) with 5 selectable thresholds
• -Ultra-low-power POR/PDR
• -Programmable voltage detector (PVD)
• Clock sources
• -1 to 25 MHz crystal oscillator
• -32 kHz oscillator for RTC with calibration
• -High speed internal 16 MHz factory-trimmed RC (+/- 1%)
• -Internal low-power 37 kHz RC
• -Internal multispeed low-power 65 kHz to 4.2 MHz RC
• All packages are ECOPACK ® 2
• -PLL for CPU clock
• Pre-programmed bootloader
• -USART, SPI supported
• Development support
• -Serial wire debug supported
• LCD driver for up to 8×28segments
• -Support contrast adjustment
• -Support blinking mode
• -Step-up converted on board

Figure 3. STM32L053x6/8 LQFP64 pinout - 10 x 10 mm

1. The above figure shows the package top view.
2. I/O pin supplied by VDD_USB.

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Figure 4. STM32L053x6/8 TFBGA64 ballout - 5x 5 mm

1. The above figure shows the package top view.
2. I/O pin supplied by VDD_USB.

Figure 5. STM32L053x6/8 LQFP48 pinout - 7 x 7 mm

1. The above figure shows the package top view.
2. I/O pin supplied by VDD_USB.

Table 14. Legend/abbreviations used in the pinout table

Table 14. Legend/abbreviations used in the pinout table

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Table 14. Legend/abbreviations used in the pinout table (continued)

The definition and values of input/output AC characteristics are given in Figure 23 and Table 60 , respectively.

Unless otherwise specified, the parameters given in Table 60 are derived from tests performed under ambient temperature and V DD supply voltage conditions summarized in Table 24 .

Table 60. I/O AC characteristics (1)

1. The maximum frequency is defined in Figure 23 .
2. When Fm+ configuration is set, the I/O speed control is bypassed. Refer to the line reference manual for a detailed description of Fm+ I/O configuration.

Figure 23. I/O AC characteristics definition

Stresses above the absolute maximum ratings listed in Table 21: Voltage characteristics , Table 22: Current characteristics , and Table 23: Thermal characteristics may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these conditions is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. Device mission profile (application conditions) is compliant with JEDEC JESD47 Qualification Standard. Extended mission profiles are available on demand.

Table 21. Voltage characteristics

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Table 22. Current characteristics

1. This current consumption must be correctly distributed over all I/Os and control pins. The total output current must not be sunk/sourced between two consecutive power supply pins referring to high pin count LQFP packages.
2. Positive current injection is not possible on these I/Os. A negative injection is induced by V IN <V SS . I INJ(PIN) must never be exceeded. Refer to Table 21 for maximum allowed input voltage values.
3. A positive injection is induced by V IN > V DD while a negative injection is induced by V IN < V SS . I INJ(PIN) must never be exceeded. Refer to Table 21: Voltage characteristics for the maximum allowed input voltage values.
4. When several inputs are submitted to a current injection, the maximum Σ I INJ(PIN) is the absolute sum of the positive and negative injected currents (instantaneous values).

Table 23. Thermal characteristics

Table 23. Thermal characteristics

The maximum chip-junction temperature, T J max, in degrees Celsius, may be calculated using the following equation:

T J max = T A max + (P D max × Θ JA )

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK ® packages, depending on their level of environmental compliance. ECOPACK ® specifications, grade definitions and product status are available at www.st.com. ECOPACK ® is an ST trademark.