NRF7000

Part: nRF7000 — Nordic Semiconductor

Type: Wireless Companion IC

Description: A low-power dual-band Wi-Fi companion IC for passive and active Wi-Fi scanning, compatible with IEEE 802.11ax and earlier standards, operating on 2.4 GHz and 5 GHz bands with SPI or QSPI host interface.

Operating Conditions:

• Supply voltage: 2.9–4.5 V
• Operating temperature: -40° C to 85° C
• Host interface: SPI or QSPI
• Max QSPI clock frequency: 32 MHz

Absolute Maximum Ratings:

Key Specs:

• Max output power: 21 dBm
• TX current (2.4 GHz, max output power, 1DSSS): 252 mA
• TX current (5 GHz, max output power, 6Mbps): 260 mA
• RX current (2.4 GHz): 60 mA
• RX current (5 GHz): 56 mA
• Antenna port: Single-ended 50 Ω
• Wi-Fi carrier frequency accuracy: ± 20 ppm (in 5 GHz)

Features:

• Companion IC with integrated RF for passive and active Wi-Fi scanning
• Compatible with IEEE 802.11ax and earlier standards (IEEE 802.11 a/b/g/n/ac)
• Dual-band 2.4 GHz and 5 GHz operation
• SPI or QSPI host interface
• 3-wire or 4-wire coexistence interface
• On-the-fly encryption and decryption for QSPI

Applications:

• Wi-Fi locationing based on SSID scanning
• Asset tracking
• Indoor navigation
• Biking and sports tracking

Package:

• 6x6 mm QFN48 package

Key features	Applications
• Companion IC with integrated RF for passive and active Wi-Fi ® scanning	• Wi-Fi locationing based on SSID scanning
• Compatible with IEEE 802.11 ax and earlier standards (IEEE 802.11 a/b/g/n/ac)	• Asset tracking
• Maximum output power 21 dBm	• Indoor navigation
• Dual-band 2.4 GHz and 5 GHz operation	• Biking and sports tracking
• Single-ended 50 Ω antenna port
• 252 mA@maxoutput power, 2.4 GHz, 1DSSS
• 260 mA@maxoutput power, 5 GHz, 6Mbps
• 60 mARX 2.4 GHz, 56 mARX 5 GHz
• SPI or QSPI host interface, 3-wire or 4-wire coexistence interface
• Supply voltage range 2.9 - 4.5 V
• Operating temperature range -40° C to 85° C
• 6x6 mmQFN48 package

NRF7000 Pinout

Package: QFN-48 (with exposed die pad)

Pin	Name	Function	Description
1	OTPVDD	Power	OTP supply voltage
2	N.C.	—	Do not connect
3	N.C.	—	Do not connect
4	N.C.	—	Do not connect
5	N.C.	—	Do not connect
6	N.C.	—	Do not connect
7	TXRF<1>	RF	5 GHz transmit RF
8	PAVDD<1>	Power	PA supply voltage (5 GHz)
9	TXRF<0>	RF	2.4 GHz transmit RF
10	PAVDD<0>	Power	PA supply voltage (2.4 GHz)
11	SXLDO	Power	Synthesizer LDO output
12	PALDO	Power	PA LDO output
13	VBAT	Power	Battery supply voltage
14	RFVDD	Power	RF supply voltage
15	RFBUCKVDD	Power	RF buck converter supply
16	XOLDO	Power	Crystal oscillator LDO output
17	XOP	Analog Input	40 MHz crystal positive (or TCXO output)
18	XON	Analog Input	40 MHz crystal negative (or N.C. if using external TCXO)
19	AFELDO	Power	AFE LDO output
20	AFEVBAT	Power	AFE battery supply
21	N.C.	—	Do not connect
22	N.C.	—	Do not connect
23	N.C.	—	Do not connect
24	N.C.	—	Do not connect
25	BUCKVBAT	Power	Buck converter battery input
26	BUCKOUT	Power	DCDC converter output
27	BUCKVSS	Power	DCDC converter ground
28	BUCKVSS	Power	DCDC converter ground
29	BUCKVMID	Power	Voltage reference decoupling pin
30	BUCKEN	Digital I/O	Buck converter enable pin
31	BUCKVBATS	Power	Buck converter battery supply sense
32	PWRBUCKVDD	Power	Power buck supply voltage
33	DIGVDD	Power	Digital supply voltage
34	PWRIOVDD	Power	Power I/O supply voltage
35	QSPI_CLK / SPI_CLK	Digital I/O	QSPI clock / SPI clock
36	QSPI_SS / SPI_SS	Digital I/O	QSPI slave select / SPI slave select
37	QSPI_DATA0 / SPI_MOSI	Digital I/O	QSPI data / SPI MOSI
38	QSPI_DATA1 / SPI_MISO	Digital I/O	QSPI data / SPI MISO
39	QSPI_DATA2	Digital I/O	QSPI data line 2
40	QSPI_DATA3	Digital I/O	QSPI data line 3
41	COEX_STATUS0	Digital I/O	Coexistence interface status
42	COEX_REQ	Digital I/O	Coexistence request
43	COEX_GRANT	Digital I/O	Coexistence grant
44	SW_CTRL0	Digital I/O	External switch control 0
45	SW_CTRL1	Digital I/O	External switch control 1
46	HOST_IRQ	Digital I/O	Host processor interrupt request
47	VSS	Power	Ground
48	IOVDD	Power	I/O supply voltage
49 (Die pad)	VSS	Power	Exposed die pad; must be connected to ground for proper operation

Notes

• Pin 49 is an exposed die pad (thermal/ground pad) on the bottom of the QFN package; it must be connected to VSS for proper device operation.
• Pins 2–6, 21–24 are marked "N.C." (Do not connect) and should be left floating or connected to ground per application requirements.
• Pins 35–38 support dual-mode operation: QSPI (quad SPI) or standard SPI (MOSI/MISO).
• Pin 18 (XON) can be left unconnected if using an external TCXO instead of a crystal oscillator.
• Multiple VSS (ground) pins (27, 28, 47) and multiple power pins should all be properly decoupled and connected to ground/power planes.

Maximum ratings are the extreme limits to which the chip can be exposed for a limited amount of time without permanently damaging it. Exposure to absolute maximum ratings for prolonged periods of time may affect the reliability of the device.

	Min.	Max.	Unit
Supply voltages
VBAT	-0.3	4.5	V
IOVDD	-0.3	3.6	V
I/O pin voltage
V I/O , IOVDD ≤3.3 V	-0.3	IOVDD + 0.3	V
V I/O , IOVDD >3.3 V	-0.3	3.6	V
BUCKEN	-0.3	VBAT + 0.3	V
Radio
RF input level		-10	dBm
Environmental QFN package
Storage temperature	-40	125	°C
Moisture Sensitivity Level (MSL)		2
ESD Human Body Model (HBM)		750	V
ESD Charged Device Model (CDM)		1000	V

Table 11: Absolute maximum ratings

The operating conditions are the physical parameters that the chip can operate within.

Symbol	Parameter	Min.	Nom.	Max.	Units
VBAT	VDD supply voltage	2.9	3.6	4.5	V
IOVDD	VDD supply voltage for IO pins	1.62	1.8	3.6	V
OTPVDD	VDD supply voltage for OTP memory (read mode)	1.62	1.8	1.98	V
OTPVDD	VDD supply voltage for OTP memory (write mode)	2.25	2.5	2.75	V
TA	Operating temperature	-40	25	85	°C

Table 10: Recommended operating conditions