NRF7000

Part: nRF7000 — Nordic Semiconductor

Type: Wireless Companion IC

Description: A low-power dual-band Wi-Fi companion IC for passive and active Wi-Fi scanning, compatible with IEEE 802.11ax and earlier standards, operating on 2.4 GHz and 5 GHz bands with SPI or QSPI host interface.

Operating Conditions:

• Supply voltage: 2.9–4.5 V
• Operating temperature: -40° C to 85° C
• Host interface: SPI or QSPI
• Max QSPI clock frequency: 32 MHz

Absolute Maximum Ratings:

Key Specs:

• Max output power: 21 dBm
• TX current (2.4 GHz, max output power, 1DSSS): 252 mA
• TX current (5 GHz, max output power, 6Mbps): 260 mA
• RX current (2.4 GHz): 60 mA
• RX current (5 GHz): 56 mA
• Antenna port: Single-ended 50 Ω
• Wi-Fi carrier frequency accuracy: ± 20 ppm (in 5 GHz)

Features:

• Companion IC with integrated RF for passive and active Wi-Fi scanning
• Compatible with IEEE 802.11ax and earlier standards (IEEE 802.11 a/b/g/n/ac)
• Dual-band 2.4 GHz and 5 GHz operation
• SPI or QSPI host interface
• 3-wire or 4-wire coexistence interface
• On-the-fly encryption and decryption for QSPI

Applications:

• Wi-Fi locationing based on SSID scanning
• Asset tracking
• Indoor navigation
• Biking and sports tracking

Package:

• 6x6 mm QFN48 package

Key features	Applications
• Companion IC with integrated RF for passive and active Wi-Fi ® scanning	• Wi-Fi locationing based on SSID scanning
• Compatible with IEEE 802.11 ax and earlier standards (IEEE 802.11 a/b/g/n/ac)	• Asset tracking
• Maximum output power 21 dBm	• Indoor navigation
• Dual-band 2.4 GHz and 5 GHz operation	• Biking and sports tracking
• Single-ended 50 Ω antenna port
• 252 mA@maxoutput power, 2.4 GHz, 1DSSS
• 260 mA@maxoutput power, 5 GHz, 6Mbps
• 60 mARX 2.4 GHz, 56 mARX 5 GHz
• SPI or QSPI host interface, 3-wire or 4-wire coexistence interface
• Supply voltage range 2.9 - 4.5 V
• Operating temperature range -40° C to 85° C
• 6x6 mmQFN48 package

The pin assignment figure and tables describe the pinouts for the device. There are also recommendations for how the General-Purpose Input/Output (GPIO) pins should be configured, in addition to any usage restrictions.

Figure 16: Pin assignments

Figure 16: Pin assignments

Pin	Name	Function	Description
1	OTPVDD	Power
2	N.C.		Do not connect
3	N.C.		Do not connect
4	N.C.		Do not connect
5	N.C.		Do not connect
6	N.C.		Do not connect
7	TXRF<1>	RF	5 GHz
8	PAVDD<1>	Power
9	TXRF<0>	RF	2.4 GHz
10	PAVDD<0>	Power
11	SXLDO	Power
12	PALDO	Power
13	VBAT	Power
14	RFVDD	Power
15	RFBUCKVDD	Power
16	XOLDO	Power
17	XOP	Analog input	40 MHz crystal (or TCXO output if using an external TCXO)
18	XON	Analog input	40 MHz crystal (or N.C. if using an external TCXO)
19	AFELDO	Power
20	AFEVBAT	Power
21	N.C.		Do not connect
22	N.C.		Do not connect
23	N.C.		Do not connect
24	N.C.		Do not connect
25	BUCKVBAT	Power
26	BUCKOUT	Power	DCDC output
27	BUCKVSS	Power	DCDC GND
28	BUCKVSS	Power	DCDC GND
29	BUCKVMID	Power	Voltage reference decoupling pin
30	BUCKEN	Digital I/O	PWR IP enable pin
31	BUCKVBATS	Power
32	PWRBUCKVDD	Power
33	DIGVDD	Power
34	PWRIOVDD	Power

Table 18: Pin assignments

Pin	Name	Function	Description
35	QSPI_CLK SPI_CLK	Digital I/O	QSPI Clock SPI Clock
36	QSPI_SS SPI_SS	Digital I/O	QSPI Slave select SPI Slave select
37	QSPI_DATA0 SPI_MOSI	Digital I/O	QSPI data SPI data
38	QSPI_DATA1 SPI_MISO	Digital I/O	QSPI data SPI data
39	QSPI_DATA2	Digital I/O	QSPI data
40	QSPI_DATA3	Digital I/O	QSPI data
41	COEX_STATUS0	Digital I/O	Coex interface
42	COEX_REQ	Digital I/O	Coex interface
43	COEX_GRANT	Digital I/O	Coex interface
44	SW_CTRL0	Digital I/O	External switch control
45	SW_CTRL1	Digital I/O	External switch control
46	HOST_IRQ	Digital I/O	Host processor interrupt request
47	VSS	Power
48	IOVDD	Power
49 (Die pad)	VSS	Power	Ground pad. Exposed die pad must be connected to ground (VSS) for proper device operation.

Maximum ratings are the extreme limits to which the chip can be exposed for a limited amount of time without permanently damaging it. Exposure to absolute maximum ratings for prolonged periods of time may affect the reliability of the device.

	Min.	Max.	Unit
Supply voltages
VBAT	-0.3	4.5	V
IOVDD	-0.3	3.6	V
I/O pin voltage
V I/O , IOVDD ≤3.3 V	-0.3	IOVDD + 0.3	V
V I/O , IOVDD >3.3 V	-0.3	3.6	V
BUCKEN	-0.3	VBAT + 0.3	V
Radio
RF input level		-10	dBm
Environmental QFN package
Storage temperature	-40	125	°C
Moisture Sensitivity Level (MSL)		2
ESD Human Body Model (HBM)		750	V
ESD Charged Device Model (CDM)		1000	V

Table 11: Absolute maximum ratings

The operating conditions are the physical parameters that the chip can operate within.

Symbol	Parameter	Min.	Nom.	Max.	Units
VBAT	VDD supply voltage	2.9	3.6	4.5	V
IOVDD	VDD supply voltage for IO pins	1.62	1.8	3.6	V
OTPVDD	VDD supply voltage for OTP memory (read mode)	1.62	1.8	1.98	V
OTPVDD	VDD supply voltage for OTP memory (write mode)	2.25	2.5	2.75	V
TA	Operating temperature	-40	25	85	°C

Table 10: Recommended operating conditions