MSPM0G3507XPM

Part: MSPM0G3507

Type: Mixed-Signal Microcontroller

Description: A 32-bit Arm Cortex-M0+ MCU operating up to 80MHz, featuring up to 128KB Flash and 32KB SRAM, integrated high-performance analog peripherals including two 12-bit 4Msps ADCs, a 12-bit 1Msps DAC, two OPAs, three comparators, and a CAN-FD interface.

Operating Conditions:

• Supply voltage: 1.62V to 3.6V
• Operating temperature: -40°C to 125°C
• Max CPU frequency: 80MHz

Key Specs:

• CPU: Arm 32-bit Cortex-M0+
• Max CPU frequency: 80MHz
• Flash memory: Up to 128KB with ECC
• SRAM: Up to 32KB with ECC
• ADC: Two 12-bit 4Msps, up to 17 external channels
• DAC: One 12-bit 1Msps
• OPAs: Two zero-drift, zero-crossover chopper
• Comparators: Three high-speed with 8-bit reference DACs
• Communication interfaces: Four UARTs, two SPIs, two I2C, one CAN-FD
• GPIOs: Up to 60

Features:

• Arm 32-bit Cortex-M0+ CPU with Memory Protection Unit
• Wide supply voltage range: 1.62V to 3.6V
• Flash memory up to 128KB with Error Correction Code (ECC)
• SRAM up to 32KB protected by ECC with hardware parity
• Two 12-bit 4Msps simultaneous sampling Analog-to-Digital Converters (ADCs) with a total of up to 17 external channels
• Hardware averaging enables 14-bit effective resolution at 250ksps
• Two zero-drift, zero-crossover chopper Operational Amplifiers (OPAs)
• One 12-bit 1MSPS Digital-to-Analog Converter (DAC) with integrated output buffer
• One General Purpose Amplifier (GPAMP) with integrated programmable gain stage up to 32x
• Three high-speed Comparators (COMP) with 8-bit reference DACs (32ns propagation delay)
• Programmable analog connections between ADC, OPA, COMP, and DAC
• Supports low-power operating modes (as low as <1μA)
• Configurable 1.4V or 2.5V internal shared voltage reference (VREF)
• Integrated temperature sensor
• Low-power modes: Run (96μA/MHz), Sleep (458μA), Stop (47μA), Standby (1.5μA with RTC and SRAM retention), Shutdown (78nA)
• 7-channel DMA controller
• Seven timers supporting up to 22 PWM channels
• Math accelerator supporting DIV, SQRT, MAC, and TRIG calculations
• Two windowed watchdog timers
• RTC with alarm and calendar modes
• Four UART interfaces (one supports LIN, IrDA, DALI, Smart Card, Manchester)
• Two SPIs (one supports up to 32Mbit/s)
• Two I2C interfaces supporting FM+ (1Mbit/s), SMBus/PMBus, and wake-up from stop mode
• One Controller Area Network (CAN) interface supporting CAN 2.0 A or B and CAN-FD
• Internal 4MHz to 32MHz oscillator (SYSOSC) with up to ±1.2% accuracy
• Internal 32kHz low-frequency oscillator (LFOSC) with ±3% accuracy
• Phase-Locked Loop (PLL) up to 80MHz
• External 4MHz to 48MHz crystal oscillator (HFXT)
• External 32kHz crystal (LFXT)
• Cyclic Redundancy Checker (CRC-16, CRC-32)
• AES encryption using 128 or 256-bit keys
• True Random Number Generator (TRNG)
• Up to 60 GPIOs (two 5V tolerant, two high-drive with 20mA strength)
• 2-pin Serial Wire Debug (SWD)

Applications:

• Motor Control
• Uninterruptible Power Supplies and Inverters
• Home Appliances
• Electronic Point-of-Sale Systems
• Test and Measurement
• Medical and Healthcare
• Factory Automation and Control
• Grid Infrastructure
• Industrial Transportation
• Smart Metering
• Communication Modules
• Lighting

Package:

• 64-pin LQFP (12mm × 12mm)
• 48-pin LQFP (9mm × 9mm)
• 48-pin VQFN (7mm × 7mm)
• 32-pin VQFN (5mm × 5mm)
• 28-pin VSSOP (7.1mm × 3mm)

• Core
• -Arm ® 32-bit Cortex ® -M0+ CPU with Memory Protection Unit and frequency up to 80MHz
• Operating Characteristics
• -Operating temperature range: -40°C to 125°C
• Memory
• -Wide supply voltage range: 1.62V to 3.6V
• -Flash memory up to 128KB with Error Correction Code (ECC)

• Motor Control
• Uninterruptible Power Supplies and Inverters
• Home Appliances
• Electronic Point-of-Sale Systems
• Test and Measurement
• Medical and Healthcare
• Factory Automation and Control
• Grid Infrastructure
• Industrial Transportation

• Smart Metering
• Communication Modules

The System Configuration Tool provides a graphical interface for enabling, configuring, and generating the initialization code required for pin multiplexing and simplified pin setup. The pin diagrams shown in the datasheet illustrate the main peripheral functions, some integrated device features, and available clock signals for simplified device pinout.

For a complete description of pin functions, refer to the Pin Attributes and Signal Descriptions sections.

PLASTIC QUAD FLATPACK - NO LEAD

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.

PLASTIC QUAD FLATPACK - NO LEAD

NOTES: (continued)

1. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271).
2. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown on this view. It is recommended that vias under paste be filled, plugged or tented.

PLASTIC QUAD FLATPACK - NO LEAD

NOTES: (continued)

1. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations.

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