Part: MP1584 — Monolithic Power Systems, Inc. Type: High Frequency Step-Down Switching Regulator Description: A high frequency step-down switching regulator with an integrated internal high-side high voltage power MOSFET, providing 3A output with current mode control.

Operating Conditions:

• Supply voltage: 4.5V to 28V
• Output voltage: 0.8V to 25V
• Operating junction temperature: -20°C to +125°C

Absolute Maximum Ratings:

• Max supply voltage (V IN ): +30V
• Max switch voltage (V SW ): V IN + 0.3V
• Max continuous power dissipation (T A = +25°C): 2.5W
• Max junction temperature: 150°C
• Max storage temperature: -65°C to +150°C

Key Specs:

• Feedback Voltage (V FB ): 0.776V Min, 0.8V Typ, 0.824V Max (4.5V < V IN < 28V)
• Upper Switch On Resistance (R DS(ON) ): 150 mΩ Typ (V BST - V SW = 5V)
• Current Limit: 4.0A Min, 4.7A Typ
• Oscillator Frequency: 900 kHz Typ (R FREQ = 100k Ω)
• Shutdown Supply Current: 12 μA Typ, 20 μA Max (V EN = 0V)
• Quiescent Supply Current: 100 μA Typ, 125 μA Max (No load, V FB = 0.9V)
• Thermal Shutdown: 150 °C Typ
• EN Up Threshold: 1.35V Min, 1.5V Typ, 1.65V Max

Features:

• Wide 4.5V to 28V Operating Input Range
• Programmable Switching Frequency from 100kHz to 1.5MHz
• High-Efficiency Pulse Skipping Mode for Light Load
• Ceramic Capacitor Stable
• Internal Soft-Start
• Internally Set Current Limit without a Current Sensing Resistor

Applications:

• High Voltage Power Conversion
• Industrial Power Systems
• Automotive Systems
• Distributed Power Systems
• Battery Powered Systems

Package:

• SOIC8E

• Wide 4.5V to 28V Operating Input Range
• Programmable Switching Frequency from 100kHz to 1.5MHz
• High-Efficiency Pulse Skipping Mode for Light Load

The wide 4.5V to 28V input range accommodates a variety of step-down applications, including those in an automotive input environment. A 100μA operational quiescent current allows use in battery-powered applications.

• Ceramic Capacitor Stable
• Internal Soft-Start
• Internally Set Current Limit without a Current Sensing Resistor
• Available in SOIC8E Package.

• High Voltage Power Conversion
• Industrial Power Systems
• Automotive Systems
• Distributed Power Systems
• Battery Powered Systems

'MPS' and 'The Future of Analog IC Technology' are Registered Trademarks of Monolithic Power Systems, Inc.

REFR TO MP238

High power conversion efficiency over a wide load range is achieved by scaling down the switching frequency at light load condition to reduce the switching and gate driving losses. The frequency foldback helps prevent inductor current runaway during startup and thermal shutdown provides reliable, fault tolerant operation. By switching at 1.5MHz, the MP1584 is able to prevent EMI (Electromagnetic Interference) noise problems, such as those found in AM radio and ADSL applications. The MP1584 is available in a thermally enhanced SOIC8E package. TYPICAL APPLICATION T RECOMMEND FOR NEW DESIGN

3A, 1.5MHz, 28V Step-Down Converter

Part Number*	Package	Top Marking	Free Air Temperature (T A )
MP1584EN	SOIC8E	MP1584EN	-20 C to +85 C

Parameter	Limit
Supply Voltage (V IN )	-0.3V to +30V
Switch Voltage (V SW )	-0.3V to V IN + 0.3V
BST to SW	-0.3V to +6V
All Other Pins	-0.3V to +6V
Continuous Power Dissipation (T A = +25°C) (2)	2.5W
Junction Temperature	150 C Lead Temperature ....................................260 C NEW
Storage Temperature	-65°C to +150 C
Recommended Operating Conditions (3)
Supply Voltage V IN	4.5V to 28V
Output Voltage V OUT	0.8V to 25V

(4)

θ

JA

θ

JC

SOIC8E .................................. 50 ...... 10 ...

C/W

ORDERING INFORMATION * For Tape & Reel, add suffix -Z (e.g. MP1584EN-Z); For RoHS Compliant Packaging, add suffix -LF. (e.g. MP1584EN-LF-Z) PACKAGE REFERENCE TOP VIEW ABSOLUTE MAXIMUM RATINGS (1) Recommended Operating Conditions Operating Junct. Temp (TJ) ..... -20 C to +125 C Thermal Resistance Notes: 1) Exceeding these ratings may damage the device. 2) The maximum allowable power dissipation is a function of the maximum junction temperature TJ(MAX), the junction-toambient thermal resistance θ JA , and the ambient temperature TA. The maximum allowable continuous power dissipation at any ambient temperature is calculated by PD(MAX)=(TJ(MAX)TA)/ θ JA. Exceeding the maximum allowable power dissipation will cause excessive die temperature, and the regulator will go into thermal shutdown. Internal thermal shutdown circuitry protects the device from permanent damage. 3) The device is not guaranteed to function outside of its operating conditions. 4) Measured on JESD51-7, 4-layer PCB. OT RECOMMENDED FOR NEW DESIGNS REFER TO MP2338

Parameter	Symbol	Condition	Min	Typ	Max	Units
Feedback Voltage	V FB	4.5V < V IN < 28V	0.776	0.8	0.824	V
Upper Switch On Resistance	R DS(ON)	V BST - V SW = 5V		150		m Ω
Upper Switch Leakage		V EN = 0V, V SW = 0V, V IN = 28V		1		μ A
Current Limit			4.0	4.7		A
COMP to Current Sense Transconductance	G CS	RECOMMENDED		9		A/V
Error Amp Voltage Gain (5)				200		V/V
Error Amp Transconductance		I COMP = ±3μA	40	60	80	μA/V
Error Amp Min Source current		V FB = 0.7V		5		μA
Error Amp Min Sink current		V FB = 0.9V	MP2338	-5		μA
VIN UVLO Threshold			2.7	3	3.3	V
VIN UVLO Hysteresis				0.35		V
Soft-Start Time (5)		0V < V FB < 0.8V		1.5		ms
Oscillator Frequency		R FREQ = 100k Ω		900		kHz
Shutdown Supply Current		V EN = 0V		12	20	μA
Quiescent Supply Current		No load, V FB = 0.9V		100	125	μA
Thermal Shutdown		DESIGNS		150		C
Thermal Shutdown Hysteresis				15		C
Minimum Off Time (5)				100		ns
Minimum On Time (5)				100		ns
EN Up Threshold			1.35	1.5	1.65	V
EN Hysteresis				300		mV

ELECTRICAL CHARACTERISTICS VIN = 12V, V EN = 2.5V, VCOMP = 1.4V, TA= +25 C, unless otherwise noted. Note: 5) Guaranteed by design. OT RECOMMENDED FOR

NEW DESIGNS

REFER TO MP2338

SOIC Pin #	Name	Description
1	SW	Switch Node. This is the output from the high-side switch. A low forward drop Schottky diode to ground is required. The diode must be close to the SW pins to reduce switching spikes.
2	EN	Enable Input. Pulling this pin below the specified threshold shuts the chip down. Pulling it up above the specified threshold or leaving it floating enables the chip.
3	COMP	Compensation. This node is the output of the error amplifier. Control loop frequency compensation is applied to this pin.
4	FB	Feedback. This is the input to the error amplifier. The output voltage is set by a resistive divider connected between the output and GND which scales down V OUT equal to the internal +0.8V reference.
5	GND Exposed Pad	Ground. It should be connected as close as possible to the output capacitor to shorten the high current switch paths. Connect exposed pad to GND plane for optimal thermal performance.
6	FREQ	Switching Frequency Program Input. Connect a resistor from this pin to ground to set the switching frequency.
7	VIN	Input Supply. This supplies power to all the internal control circuitry, both BS regulators and the high-side switch. A decoupling capacitor to ground must be placed close to this pin to minimize switching spikes.
8	BST	Bootstrap. This is the positive power supply for the internal floating high-side MOSFET driver. Connect a bypass capacitor between this pin and SW pin.

MP1584 SOIC8E Pinout

Pin Number	Pin Name	Type	Description
1	SW	O	Switch node output; connection point for external diode and inductor
2	EN	I	Enable control; positive logic with 1.2V falling threshold, 1.5V rising threshold; internally pulled up to ~3.0V
3	COMP	O	Compensation pin; error amplifier output for external compensation network (0.9V–2.0V operating range)
4	FB	I	Feedback input; connected to resistive divider from output voltage for regulation
5	GND	P	Ground; power ground and signal ground reference
5 (Exposed Pad)	GND	P	Exposed pad; thermal ground connection to PCB
6	FREQ	I	Frequency setting pin; external resistor to ground sets switching frequency
7	VIN	P	Input supply voltage; wide input range supported
8	BST	P	Bootstrap pin; powered by external bootstrap capacitor for floating gate driver

Notes

• Exposed Pad (Pin 5): The exposed pad on the bottom of the SOIC8E package is connected to GND and serves as a thermal connection point. It should be soldered to a large copper area on the PCB for improved heat dissipation.
• COMP Pin Limits: COMP voltage is internally clamped between 0.9V and 2.0V during operation. Do not pull above 2.6V externally.
• EN Pin: When floating, EN is pulled up to approximately 3.0V by an internal 1 μA current source, enabling the device. Requires ~1 μA current capability to pull down below 1.2V for shutdown.
• Bootstrap Capacitor: BST is charged to approximately 5V by an internal regulator. An external bootstrap capacitor is required for proper floating gate driver operation.
• Frequency Setting: Oscillating frequency is programmed via external resistor R_freq connected from FREQ pin to ground, with formula: f(kHz) = 180000 / (1.1 × R_freq(kΩ)).

Part Number	Package	Temperature Range	Packing
MP1584EN	SOIC8E	-20 C to +85 C	Tray
MP1584EN-Z	SOIC8E	-20 C to +85 C	Tape & Reel
MP1584EN-LF	SOIC8E	-20 C to +85 C	RoHS Compliant
MP1584EN-LF-Z	SOIC8E	-20 C to +85 C	RoHS Compliant, Tape & Reel