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M24C64

Serial I²C bus EEPROM

The M24C64 is a serial i²c bus eeprom from STMicroelectronics. View the full M24C64 datasheet below including specifications and datasheet sections.

Manufacturer

STMicroelectronics

Category

Serial I²C bus EEPROM

Overview

Part: M24C64-W M24C64-R M24C64-F M24C64-DF — STMicroelectronics

Type: Serial I²C bus EEPROM

Description: 64-Kbit (8 Kbyte) I²C-compatible EEPROM with single supply voltage from 1.7 V to 5.5 V, supporting 1 MHz, 400 kHz, and 100 kHz bus modes, and offering more than 4 million write cycles and 200-years data retention.

Operating Conditions:

  • Supply voltage: 1.7 V to 5.5 V (M24C64-F, M24C64-DF over -40 °C / +85 °C)
  • Operating temperature: -40 to +85 °C
  • I²C bus clock frequency: up to 1 MHz

Absolute Maximum Ratings:

  • Max supply voltage: 6.5 V
  • Max junction/storage temperature: 150 °C

Key Specs:

  • Memory size: 64 Kbit (8 Kbyte)
  • Page size: 32 byte
  • Byte Write time: 5 ms
  • Page Write time: 5 ms
  • Write cycles: > 4 million
  • Data retention: > 200 years
  • Standby current (M24C64-F, Vcc=1.7V, Ta=25°C): 1 μA (max)
  • Read current (M24C64-F, Vcc=1.7V, Ta=25°C, fC=1MHz): 1.5 mA (max)

Features:

  • Compatible with all I²C bus modes: 1 MHz, 400 kHz, 100 kHz
  • Random and sequential Read modes
  • Write protect of the whole memory array
  • Enhanced ESD/Latch-Up protection
  • Additional Write lockable page (M24C64-D order codes)

Applications:

Package:

  • PDIP8
  • SO8 (150 mil width)
  • TSSOP8 (169 mil width)
  • UFDFPN8 (DFN8 - 2x3 mm)
  • WLCSP
  • UFDFPN5 (DFN5 - 1.7x1.4 mm)
  • Unsawn wafer

Features

  • Compatible with all I 2 C bus modes:
  • -1 MHz
  • -400 kHz
  • -100 kHz
  • Memory array:
  • -64 Kbit (8 Kbyte) of EEPROM
  • -Page size: 32 byte
  • -Additional Write lockable page (M24C64-D order codes)
  • Single supply voltage:
  • -1.7 V to 5.5 V over -40 °C / +85 °C
  • -1.6 V to 5.5 V over 0 °C / +85 °C
  • Write:
  • -Byte Write within 5 ms
  • -Page Write within 5 ms
  • Random and sequential Read modes
  • Write protect of the whole memory array
  • Enhanced ESD/Latch-Up protection
  • More than 4 million Write cycles
  • More than 200-years data retention

Package Information

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK ® packages, depending on their level of environmental compliance. ECOPACK ® specifications, grade definitions and product status are available at: www.st.com . ECOPACK ® is an ST trademark.

For die information concerning the M24C64 delivered in unsawn wafer, please contact your nearest ST Sales Office.

Related Variants

The following components are covered by the same datasheet.

Part NumberManufacturerPackage
M24C64-125STMicroelectronics
M24C64-DSTMicroelectronics
M24C64-DFSTMicroelectronics
M24C64-FSTMicroelectronics
M24C64-RSTMicroelectronics
M24C64-RMN6TPSTMicroelectronicsPDIP8 (BN)
M24C64-WSTMicroelectronics
Data on this page is extracted from publicly available manufacturer datasheets using automated tools including AI. It may contain errors or omissions. Always verify specifications against the official manufacturer datasheet before making design or purchasing decisions. See our Terms of Service. Rights holders can submit a takedown request.

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