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LMR33630

Synchronous Buck Converter

The LMR33630 is a synchronous buck converter from Texas Instruments. View the full LMR33630 datasheet below including key specifications, electrical characteristics, absolute maximum ratings.

Official LMR33630 datasheet (PDF) — the source this page was extracted from.

LMR33630 Key Specifications

ParameterValue
Output Current3A
Switching Frequency400kHz
FunctionStep-Down
Mounting TypeSurface Mount
Number of Outputs1
Operating Temperature-40°C ~ 125°C (TJ)
Output ConfigurationPositive
Output TypeAdjustable
Package / Case8-PowerSOIC (0.154", 3.90mm Width)
Supplier Device Package8-SO PowerPad
Synchronous RectifierYes
TopologyBuck
Input Voltage (Max)36V
Input Voltage (Min)3.8V
Output Voltage (Max)24V
Output Voltage1V

LMR33630 Overview

Part: LMR33630ADDAR — Texas Instruments

Type: Synchronous Buck Converter

Description: 3.8–36 V input, 3 A synchronous buck converter with 75 mΩ/50 mΩ integrated MOSFETs, 400 kHz switching (A option), peak efficiency >95% and 25 μA operating quiescent current.

Operating Conditions:

  • Supply voltage (VIN): 3.8–36 V
  • Operating temperature: -40 to 125 °C (junction)
  • Output voltage range: 1–24 V (adjustable)
  • Output current: 0–3 A

Absolute Maximum Ratings:

  • Max supply voltage (VIN to PGND): 38 V
  • Max junction temperature: 150 °C
  • Storage temperature: -55 to 150 °C

Key Specs:

  • Input voltage range: 3.8–36 V
  • Output current: 3 A
  • Adjustable output voltage: 1–24 V
  • Switching frequency: 400 kHz (A option; B = 1.4 MHz, C = 2.1 MHz)
  • Minimum on-time: 68 ns
  • Power MOSFET RDS(on): 75 mΩ / 50 mΩ
  • Peak efficiency: >95%
  • Operating quiescent current: as low as 25 μA

Features:

  • Functional safety capable
  • Peak current mode control
  • Integrated compensation network
  • Low EMI and switching noise, HotRod™ package with parallel input current paths
  • Frequency foldback at light load for high efficiency
  • Power-good flag and precision enable
  • Thermal shutdown, input undervoltage lockout, cycle-by-cycle current limit, hiccup short-circuit protection
  • AEC-Q100 qualified versions available

Applications:

  • Motor drive systems: drones, AC inverters, variable frequency drives, servo systems
  • Factory and building automation: PLC CPU, HVAC control, elevator control
  • General wide-input-voltage power supplies

Package:

  • DDA 8-pin HSOIC with PowerPAD™ (5.00 mm × 4.00 mm)
  • RNX 12-pin VQFN (3.00 mm × 2.00 mm)

LMR33630 Pin Configuration

图 6-1. DDA Package 8-Pin HSOIC With PowerPAD ™ Top View

图 6-2. RNX Package 12-Pin VQFN Top View

表 6-1. Pin Functions

PIN - HSOICPIN - VQFNPIN - NAMETYPEDESCRIPTION
11,11PGNDGPower ground terminal. Connect to system ground and AGND. Connect to bypass capacitor with short wide traces.
22,10VINPInput supply to regulator. Connect a high-quality bypass capacitor or capacitors directly to this pin and PGND.
39ENAEnable input to regulator. High = ON, low = OFF. Can be connected directly to VIN; Do not float .
48PGAOpen drain power-good flag output. Connect to suitable voltage supply through a current limiting resistor. High = power OK, low = power bad. Flag pulls low when EN = Low. Can be left open when not used.
57FBAFeedback input to regulator. Connect to tap point of feedback voltage divider. Do not float. Do not ground .
65VCCPInternal 5-V LDO output. Used as supply to internal control circuits. Do not connect to external loads. Can be used as logic supply for power-good flag. Connect a high- quality 1-μF capacitor from this pin to GND.
74BOOTPBoot-strap supply voltage for internal high-side driver. Connect a high-quality 100-nF capacitor from this pin to the SW pin. On the VQFN package connect the SW pin to NC on the PCB. This simplifies the connection from the C BOOT capacitor to the SW pin.
812SWPRegulator switch node. Connect to power inductor. On the VQFN package connect the SW pin to NC on the PCB. This simplifies the connection from the C BOOT capacitor to the SW pin.
THERMAL PAD6AGNDGAnalog ground for regulator and system. Ground reference for internal references and logic. All electrical parameters are measured with respect to this pin. Connect to system ground on PCB. For the HSOIC package, the pad on the bottom of the device serves as both the AGND connection and a thermal connection to the heat sink ground plane. This pad must be soldered to a ground plane to achieve good electrical and thermal performance.
-3NC-On the VQFN package the SW pin must be connected to NC on the PCB. This simplifies the connection from the C BOOT capacitor to the SW pin. This pin has no internal connection to the regulator.
A = Analog, P = Power, G = GroundA = Analog, P = Power, G = GroundA = Analog, P = Power, G = GroundA = Analog, P = Power, G = GroundA = Analog, P = Power, G = Ground

表 6-1. Pin Functions

LMR33630 Electrical Characteristics

Limits apply over the operating junction temperature (T J ) range of -40°C to +125°C, unless otherwise stated. Minimum and maximum limits are specified through test, design or statistical correlation. Typical values represent the most likely parametric norm at TJ = 25°C, and are provided for reference purposes only. Unless otherwise stated, the following conditions apply:

= 4 V.

VIN = 12 V, V EN

PARAMETERPARAMETERTEST CONDITIONSMINTYPMAXUNIT
SUPPLY VOLTAGESUPPLY VOLTAGESUPPLY VOLTAGESUPPLY VOLTAGESUPPLY VOLTAGESUPPLY VOLTAGESUPPLY VOLTAGE
V INMinimum operating input voltage3.8V
I QNon-switching input current; measured at VIN pin (2)V FB = 1.2 V2434μA
I SDShutdown quiescent current; measured at VIN pinEN = 0510μA
ENABLEENABLEENABLEENABLEENABLEENABLEENABLE
V EN-VCC-HEN input level required to turn on internal LDORising threshold1V
V EN-VCC-LEN input level required to turn off internal LDOFalling threshold0.3V
V EN-HEN input level required to start switchingRising threshold1.21.2311.26V
V EN-HYSHysteresis below V EN-HHysteresis below V EN-H ; falling100mV
I LKG-ENEnable input leakage currentV EN = 3.3 V0.2nA
INTERNAL SUPPLIESINTERNAL SUPPLIESINTERNAL SUPPLIESINTERNAL SUPPLIESINTERNAL SUPPLIESINTERNAL SUPPLIESINTERNAL SUPPLIES
VCCInternal LDO output voltage appearing at the VCC pin6 V ≤ V IN ≤ 36 V4.7555.25V
V BOOT-UVLOBootstrap voltage undervoltage lock-out threshold (3)2.2V
VOLTAGE REFERENCE (FB PIN)VOLTAGE REFERENCE (FB PIN)VOLTAGE REFERENCE (FB PIN)VOLTAGE REFERENCE (FB PIN)VOLTAGE REFERENCE (FB PIN)VOLTAGE REFERENCE (FB PIN)VOLTAGE REFERENCE (FB PIN)
V FBFeedback voltage; ADJ option0.98511.015V
I FBCurrent into FB pin; ADJ optionFB = 1 V0.250nA
CURRENT LIMITS (4)CURRENT LIMITS (4)CURRENT LIMITS (4)CURRENT LIMITS (4)CURRENT LIMITS (4)CURRENT LIMITS (4)CURRENT LIMITS (4)
I SCHigh-side current limitLMR336303.854.55.05A
I LIMITLow-side current limitLMR336302.93.54.1A
I PEAK-MINMinimum peak inductor currentLMR336300.69A

LMR33630 Absolute Maximum Ratings

Over the recommended operating junction temperature range (1)

PARAMETERPARAMETERMINMAXUNIT
VoltagesVIN to PGND- 0.338
VoltagesEN to AGND (2)- 0.3V IN + 0.3
VoltagesFB to AGND- 0.35.5V
VoltagesPG to AGND (2)022
VoltagesAGND to PGND- 0.30.3
VoltagesSW to PGND- 0.3V IN + 0.3V
VoltagesSW to PGND less than 100-ns transients- 3.538V
VoltagesBOOT to SW- 0.35.5V
VoltagesVCC to AGND (4)- 0.35.5V
T JJunction temperature (3)- 40150°C
T stgStorage temperature- 55150°C
  • (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions . Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
  • (2) The voltage on this pin must not exceed the voltage on the VIN pin by more than 0.3 V
  • (3) Operating at junction temperatures greater than 125°C, although possible, degrades the lifetime of the device.
  • (4) Under some operating conditions the VCC LDO voltage may increase beyond 5.5V.

Over the recommended operating temperature range of -40 °C to 125 °C (unless otherwise noted) (1)

MINMAXUNIT
Input voltageVIN to PGND EN (2)3.8 036 V INV
PG (2)018V
Adjustable output voltageV OUT (3)124V
Output currentI OUT03A
  • (2) The voltage on this pin must not exceed the voltage on the VIN pin by more than 0.3 V.

(3) The maximum output voltage can be extended to 95% of VIN; contact TI for details. Under no conditions should the output voltage be allowed to fall below zero volts.

LMR33630 Thermal Information

The value of R θ JA given in this table is only valid for comparison with other packages and can not be used for design purposes. These values were calculated in accordance with JESD 51-7, and simulated on a 4-layer JEDEC board. They do not represent the performance obtained in an actual application. For design information see Maximum Ambient Temperature section.

LMR336x0LMR336x0
THERMAL METRIC (1)(2)DDA (HSOIC)
8 PINS
RNX (VQFN)
12 PINS
UNIT
R θ JAJunction-to-ambient thermal resistance42.9 (2)72.5 (2)°C/W
R θ JC(top)Junction-to-case (top) thermal resistance5435.9°C/W
R θ JBJunction-to-board thermal resistance13.623.3°C/W
ψ JTJunction-to-top characterization parameter4.30.8°C/W
ψ JBJunction-to-board characterization parameter13.823.5°C/W
R θ JC(bot)Junction-to-case (bottom) thermal resistance4.3N/A°C/W

LMR33630 Typical Application

The LMR33630 step-down DC-to-DC converter is typically used to convert a higher DC voltage to a lower DC voltage with a maximum output current of 3 A. The following design procedure can be used to select components for the LMR33630. Alternately, the WEBENCH Design Tool can be used to generate a complete design. This tool utilizes an iterative design procedure and has access to a comprehensive database of components. This allows the tool to create an optimized design and allows the user to experiment with various options.

Variants on the same datasheet

These parts have exact links to the same datasheet. They are candidates to compare, not verified drop-in replacements; check package, pinout and electrical limits.

Part NumberManufacturerPackage
LMR33630-Q1Texas Instruments—
LMR33630ADDATexas Instruments8-PowerSOIC (0.154", 3.90mm Width)
LMR33630ADDARTexas Instruments8-PowerSOIC (0.154", 3.90mm Width)
LMR33630ARNXTexas InstrumentsVQFN-12 3x2mm
LMR33630ARNXRTexas Instruments12-PowerVFQFN
LMR33630ARNXTTexas InstrumentsVQFN-HR-12 3x2mm
LMR33630BDDATexas Instruments8-PowerSOIC (0.154", 3.90mm Width)
LMR33630BDDARTexas Instruments8-PowerSOIC (0.154", 3.90mm Width)
LMR33630BRNXTexas InstrumentsVQFN-12 3x2mm
LMR33630BRNXRTexas Instruments12-PowerVFQFN
LMR33630BRNXTTexas Instruments12-PowerVFQFN
LMR33630CDDATexas Instruments8-PowerSOIC (0.154", 3.90mm Width)
LMR33630CDDARTexas Instruments8-PowerSOIC (0.154", 3.90mm Width)
LMR33630CRNXTexas InstrumentsVQFN-12 3x2mm
LMR33630CRNXRTexas Instruments12-PowerVFQFN
LMR33630CRNXTTexas InstrumentsVQFN-HR-12 3x2mm
LMR33630ISTexas Instruments—

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