LMR33630ADDA
Synchronous Buck ConverterThe LMR33630ADDA is a synchronous buck converter from Texas Instruments. View the full LMR33630ADDA datasheet below including key specifications, electrical characteristics, absolute maximum ratings.
Manufacturer
Texas Instruments
Category
Synchronous Buck Converter
Package
8-PowerSOIC (0.154", 3.90mm Width)
Key Specifications
| Parameter | Value |
|---|---|
| Output Current | 3A |
| Switching Frequency | 400kHz |
| Function | Step-Down |
| Mounting Type | Surface Mount |
| Number of Outputs | 1 |
| Operating Temperature | -40°C ~ 125°C (TJ) |
| Output Configuration | Positive |
| Output Type | Adjustable |
| Package / Case | 8-PowerSOIC (0.154", 3.90mm Width) |
| Supplier Device Package | 8-SO PowerPad |
| Synchronous Rectifier | Yes |
| Topology | Buck |
| Input Voltage (Max) | 36V |
| Input Voltage (Min) | 3.8V |
| Output Voltage (Max) | 24V |
| Output Voltage | 1V |
Overview
Part: LMR33630 SIMPLE SWITCHER® — Texas Instruments
Type: Synchronous Buck Converter
Description: A 3.8–36V input, 3A synchronous buck DC/DC converter designed for harsh industrial applications, offering excellent efficiency, small solution size, and output accuracy.
Operating Conditions:
- Supply voltage: 3.8V to 36V
- Operating temperature: -40 °C to 125 °C
- Output voltage range: 1V to 24V
- Output current: 0A to 3A
Absolute Maximum Ratings:
- Max supply voltage: 38V
- Max junction temperature: 150 °C
Key Specs:
- Input voltage range: 3.8V to 36V
- Output current: 3A
- Output voltage range: 1V to 24V
- Switching frequency: 400kHz, 1.4MHz, 2.1MHz
- MOSFET RDS-ON: -75mΩ / 50mΩ
- Minimum on-time: 68ns
- Peak efficiency: > 95%
- Operating quiescent current: 25μA
Features:
- Functional safety documentation available
- Designed for harsh industrial applications
- -75mΩ / 50mΩ RDS-ON power MOSFET
- Peak current mode control
- Low EMI and low switching noise
- Integrated compensation network
- HotRod™ package
- Parallel input current path
- Efficient power conversion at all loads
- Flexible system interface
- Power-good flag and precision enable
- WEBENCH® Power Designer support
Applications:
- Motor drive systems: drones, AC inverters, variable frequency drives, servo systems
- Factory and building automation systems: PLC CPU, HVAC control, elevator control
- General wide input voltage power supplies
Package:
- HSOIC (8-pin, 5.00mm × 4.00mm)
- VQFN (12-pin, 3.00mm × 2.00mm)
Pin Configuration
图 6-1. DDA Package 8-Pin HSOIC With PowerPAD ™ Top View
图 6-2. RNX Package 12-Pin VQFN Top View
表 6-1. Pin Functions
| PIN | PIN | PIN | TYPE | DESCRIPTION |
|---|---|---|---|---|
| HSOIC | VQFN | NAME | TYPE | DESCRIPTION |
| 1 | 1,11 | PGND | G | Power ground terminal. Connect to system ground and AGND. Connect to bypass capacitor with short wide traces. |
| 2 | 2,10 | VIN | P | Input supply to regulator. Connect a high-quality bypass capacitor or capacitors directly to this pin and PGND. |
| 3 | 9 | EN | A | Enable input to regulator. High = ON, low = OFF. Can be connected directly to VIN; Do not float . |
| 4 | 8 | PG | A | Open drain power-good flag output. Connect to suitable voltage supply through a current limiting resistor. High = power OK, low = power bad. Flag pulls low when EN = Low. Can be left open when not used. |
| 5 | 7 | FB | A | Feedback input to regulator. Connect to tap point of feedback voltage divider. Do not float. Do not ground . |
| 6 | 5 | VCC | P | Internal 5-V LDO output. Used as supply to internal control circuits. Do not connect to external loads. Can be used as logic supply for power-good flag. Connect a high- quality 1-μF capacitor from this pin to GND. |
| 7 | 4 | BOOT | P | Boot-strap supply voltage for internal high-side driver. Connect a high-quality 100-nF capacitor from this pin to the SW pin. On the VQFN package connect the SW pin to NC on the PCB. This simplifies the connection from the C BOOT capacitor to the SW pin. |
| 8 | 12 | SW | P | Regulator switch node. Connect to power inductor. On the VQFN package connect the SW pin to NC on the PCB. This simplifies the connection from the C BOOT capacitor to the SW pin. |
| THERMAL PAD | 6 | AGND | G | Analog ground for regulator and system. Ground reference for internal references and logic. All electrical parameters are measured with respect to this pin. Connect to system ground on PCB. For the HSOIC package, the pad on the bottom of the device serves as both the AGND connection and a thermal connection to the heat sink ground plane. This pad must be soldered to a ground plane to achieve good electrical and thermal performance. |
| - | 3 | NC | - | On the VQFN package the SW pin must be connected to NC on the PCB. This simplifies the connection from the C BOOT capacitor to the SW pin. This pin has no internal connection to the regulator. |
| A = Analog, P = Power, G = Ground | A = Analog, P = Power, G = Ground | A = Analog, P = Power, G = Ground | A = Analog, P = Power, G = Ground | A = Analog, P = Power, G = Ground |
表 6-1. Pin Functions
Electrical Characteristics
Limits apply over the operating junction temperature (T J ) range of -40°C to +125°C, unless otherwise stated. Minimum and maximum limits are specified through test, design or statistical correlation. Typical values represent the most likely parametric norm at TJ = 25°C, and are provided for reference purposes only. Unless otherwise stated, the following conditions apply:
= 4 V.
VIN = 12 V, V EN
| PARAMETER | PARAMETER | TEST CONDITIONS | MIN | TYP | MAX | UNIT |
|---|---|---|---|---|---|---|
| SUPPLY VOLTAGE | SUPPLY VOLTAGE | SUPPLY VOLTAGE | SUPPLY VOLTAGE | SUPPLY VOLTAGE | SUPPLY VOLTAGE | SUPPLY VOLTAGE |
| V IN | Minimum operating input voltage | 3.8 | V | |||
| I Q | Non-switching input current; measured at VIN pin (2) | V FB = 1.2 V | 24 | 34 | μA | |
| I SD | Shutdown quiescent current; measured at VIN pin | EN = 0 | 5 | 10 | μA | |
| ENABLE | ENABLE | ENABLE | ENABLE | ENABLE | ENABLE | ENABLE |
| V EN-VCC-H | EN input level required to turn on internal LDO | Rising threshold | 1 | V | ||
| V EN-VCC-L | EN input level required to turn off internal LDO | Falling threshold | 0.3 | V | ||
| V EN-H | EN input level required to start switching | Rising threshold | 1.2 | 1.231 | 1.26 | V |
| V EN-HYS | Hysteresis below V EN-H | Hysteresis below V EN-H ; falling | 100 | mV | ||
| I LKG-EN | Enable input leakage current | V EN = 3.3 V | 0.2 | nA | ||
| INTERNAL SUPPLIES | INTERNAL SUPPLIES | INTERNAL SUPPLIES | INTERNAL SUPPLIES | INTERNAL SUPPLIES | INTERNAL SUPPLIES | INTERNAL SUPPLIES |
| VCC | Internal LDO output voltage appearing at the VCC pin | 6 V ≤ V IN ≤ 36 V | 4.75 | 5 | 5.25 | V |
| V BOOT-UVLO | Bootstrap voltage undervoltage lock-out threshold (3) | 2.2 | V | |||
| VOLTAGE REFERENCE (FB PIN) | VOLTAGE REFERENCE (FB PIN) | VOLTAGE REFERENCE (FB PIN) | VOLTAGE REFERENCE (FB PIN) | VOLTAGE REFERENCE (FB PIN) | VOLTAGE REFERENCE (FB PIN) | VOLTAGE REFERENCE (FB PIN) |
| V FB | Feedback voltage; ADJ option | 0.985 | 1 | 1.015 | V | |
| I FB | Current into FB pin; ADJ option | FB = 1 V | 0.2 | 50 | nA | |
| CURRENT LIMITS (4) | CURRENT LIMITS (4) | CURRENT LIMITS (4) | CURRENT LIMITS (4) | CURRENT LIMITS (4) | CURRENT LIMITS (4) | CURRENT LIMITS (4) |
| I SC | High-side current limit | LMR33630 | 3.85 | 4.5 | 5.05 | A |
| I LIMIT | Low-side current limit | LMR33630 | 2.9 | 3.5 | 4.1 | A |
| I PEAK-MIN | Minimum peak inductor current | LMR33630 | 0.69 | A |
Absolute Maximum Ratings
Over the recommended operating junction temperature range (1)
| PARAMETER | PARAMETER | MIN | MAX | UNIT |
|---|---|---|---|---|
| Voltages | VIN to PGND | - 0.3 | 38 | |
| Voltages | EN to AGND (2) | - 0.3 | V IN + 0.3 | |
| Voltages | FB to AGND | - 0.3 | 5.5 | V |
| Voltages | PG to AGND (2) | 0 | 22 | |
| Voltages | AGND to PGND | - 0.3 | 0.3 | |
| Voltages | SW to PGND | - 0.3 | V IN + 0.3 | V |
| Voltages | SW to PGND less than 100-ns transients | - 3.5 | 38 | V |
| Voltages | BOOT to SW | - 0.3 | 5.5 | V |
| Voltages | VCC to AGND (4) | - 0.3 | 5.5 | V |
| T J | Junction temperature (3) | - 40 | 150 | °C |
| T stg | Storage temperature | - 55 | 150 | °C |
- (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions . Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
- (2) The voltage on this pin must not exceed the voltage on the VIN pin by more than 0.3 V
- (3) Operating at junction temperatures greater than 125°C, although possible, degrades the lifetime of the device.
- (4) Under some operating conditions the VCC LDO voltage may increase beyond 5.5V.
Recommended Operating Conditions
Over the recommended operating temperature range of -40 °C to 125 °C (unless otherwise noted) (1)
| MIN | MAX | UNIT | ||
|---|---|---|---|---|
| Input voltage | VIN to PGND EN (2) | 3.8 0 | 36 V IN | V |
| PG (2) | 0 | 18 | V | |
| Adjustable output voltage | V OUT (3) | 1 | 24 | V |
| Output current | I OUT | 0 | 3 | A |
- (2) The voltage on this pin must not exceed the voltage on the VIN pin by more than 0.3 V.
(3) The maximum output voltage can be extended to 95% of VIN; contact TI for details. Under no conditions should the output voltage be allowed to fall below zero volts.
Thermal Information
The value of R θ JA given in this table is only valid for comparison with other packages and can not be used for design purposes. These values were calculated in accordance with JESD 51-7, and simulated on a 4-layer JEDEC board. They do not represent the performance obtained in an actual application. For design information see Maximum Ambient Temperature section.
| LMR336x0 | LMR336x0 | ||
|---|---|---|---|
| THERMAL METRIC (1) | (2) | DDA (HSOIC) | RNX (VQFN) |
| 8 PINS | 12 PINS | ||
| R θ JA | Junction-to-ambient thermal resistance | 42.9 (2) | 72.5 (2) |
| R θ JC(top) | Junction-to-case (top) thermal resistance | 54 | 35.9 |
| R θ JB | Junction-to-board thermal resistance | 13.6 | 23.3 |
| ψ JT | Junction-to-top characterization parameter | 4.3 | 0.8 |
| ψ JB | Junction-to-board characterization parameter | 13.8 | 23.5 |
| R θ JC(bot) | Junction-to-case (bottom) thermal resistance | 4.3 | N/A |
Typical Application
The LMR33630 step-down DC-to-DC converter is typically used to convert a higher DC voltage to a lower DC voltage with a maximum output current of 3 A. The following design procedure can be used to select components for the LMR33630. Alternately, the WEBENCH Design Tool can be used to generate a complete design. This tool utilizes an iterative design procedure and has access to a comprehensive database of components. This allows the tool to create an optimized design and allows the user to experiment with various options.
Related Variants
The following components are covered by the same datasheet.
| Part Number | Manufacturer | Package |
|---|---|---|
| LMR33630 | Texas Instruments | — |
| LMR33630-Q1 | Texas Instruments | — |
| LMR33630ADDAR | Texas Instruments | 8-PowerSOIC (0.154", 3.90mm Width) |
| LMR33630ARNX | Texas Instruments | — |
| LMR33630ARNXR | Texas Instruments | 12-PowerVFQFN |
| LMR33630ARNXT | Texas Instruments | — |
| LMR33630BDDA | Texas Instruments | 8-PowerSOIC (0.154", 3.90mm Width) |
| LMR33630BDDAR | Texas Instruments | 8-PowerSOIC (0.154", 3.90mm Width) |
| LMR33630BRNX | Texas Instruments | — |
| LMR33630BRNXR | Texas Instruments | 12-PowerVFQFN |
| LMR33630BRNXT | Texas Instruments | 12-PowerVFQFN |
| LMR33630CDDA | Texas Instruments | 8-PowerSOIC (0.154", 3.90mm Width) |
| LMR33630CDDAR | Texas Instruments | 8-PowerSOIC (0.154", 3.90mm Width) |
| LMR33630CRNX | Texas Instruments | — |
| LMR33630CRNXR | Texas Instruments | 12-PowerVFQFN |
| LMR33630CRNXT | Texas Instruments | — |
| LMR33630IS | Texas Instruments | — |
Get structured datasheet data via API
Get started free