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KSZ8081MNX/RNB28

Physical Layer Transceiver

The KSZ8081MNX/RNB28 is a physical layer transceiver from Microchip Technology. View the full KSZ8081MNX/RNB28 datasheet below including key specifications, electrical characteristics, absolute maximum ratings.

KSZ8081MNX/RNB28 shares its datasheet with KSZ8081MNX32, whose page lists every part number it covers.

Official KSZ8081MNX/RNB28 datasheet (PDF) — the source this page was extracted from.

Package

QFN-32 5x5mm

KSZ8081MNX/RNB28 Key Specifications

ParameterValue
Data Rates10/100 Mbps
Core Voltage1.2V (built-in regulator)
MAC InterfaceMII (KSZ8081MNX)
Supply Voltage3.3V (single supply)
Reference Clock25MHz crystal
VDD I/O Options1.8V, 2.5V, or 3.3V
Package Dimensions5mm x 5mm
Management InterfaceMDC/MDIO
Operating Temperature0°C to 70°C (commercial); -40°C to 85°C (industrial)

KSZ8081MNX/RNB28 Overview

Part: KSZ8081MNX/KSZ8081RNB — Micrel Inc.

Type: 10Base-T/100Base-TX Ethernet Physical Layer Transceiver

Description: Single-supply 10Base-T/100Base-TX Ethernet physical-layer transceiver with MII/RMII interface support, integrated 1.2V core regulator, and LinkMD TDR-based cable diagnostics.

Operating Conditions:

  • Supply voltage: Single 3.3V (VDD I/O options for 1.8V, 2.5V, or 3.3V)
  • Operating temperature: 0°C to 70°C (Commercial), -40°C to 85°C (Industrial)
  • Reference clock: 25MHz crystal input

Features:

  • Single-chip 10Base-T/100Base-TX IEEE 802.3 compliant Ethernet transceiver
  • MII interface support (KSZ8081MNX)
  • RMII v1.2 Interface support with a 50MHz reference clock output to MAC, and an option to input a 50MHz reference clock (KSZ8081RNB)
  • Back-to-back mode support for a 100Mbps copper repeater
  • MDC/MDIO management interface for PHY register configuration
  • Programmable interrupt output
  • LED outputs for link, activity, and speed status indication
  • On-chip termination resistors for the differential pairs
  • Baseline wander correction
  • HP Auto MDI/MDI-X to reliably detect and correct straight-through and crossover cable connections with disable and enable option
  • Auto-negotiation to automatically select the highest linkup speed (10/100Mbps) and duplex (half/full)
  • Power-down and power-saving modes
  • LinkMD TDR-based cable diagnostics to identify faulty copper cabling
  • Parametric NAND Tree support for fault detection between chip I/Os and the board
  • Loopback modes for diagnostics
  • Built-in 1.2V regulator for core

Applications:

  • Game console
  • IP phone
  • IP set-top box
  • IP TV
  • LOM
  • Printer

Package:

  • 32-pin (5mm x 5mm) QFN

KSZ8081MNX/RNB28 Features

  • Single-chip 10Base-T/100Base-TX IEEE 802.3 compliant Ethernet transceiver
  • MII interface support (KSZ8081MNX)
  • RMII v1.2 Interface support with a 50MHz reference clock output to MAC, and an option to input a 50MHz reference clock (KSZ8081RNB)
  • Back-to-back mode support for a 100Mbps copper repeater
  • MDC/MDIO management interface for PHY register configuration
  • Programmable interrupt output
  • LED outputs for link, activity, and speed status indication
  • On-chip termination resistors for the differential pairs
  • Baseline wander correction
  • HP Auto MDI/MDI-X to reliably detect and correct straight-through and crossover cable connections with disable and enable option
  • Auto-negotiation to automatically select the highest linkup speed (10/100Mbps) and duplex (half/full)
  • Power-down and power-saving modes
  • LinkMD TDR-based cable diagnostics to identify faulty copper cabling
  • Parametric NAND Tree support for fault detection between chip I/Os and the board

KSZ8081MNX/RNB28 Applications

  • Game console
  • IP phone
  • IP set-top box
  • IP TV
  • LOM
  • Printer

KSZ8081MNX/RNB28 Pin Configuration

32-Pin (5mm x 5mm) QFN

KSZ8081MNX/RNB28 Electrical Characteristics

SymbolParameterConditionMin.Typ.Max.Units
Supply Current (V DDIO , V DDA_3.3 = 3.3V) (4)Supply Current (V DDIO , V DDA_3.3 = 3.3V) (4)Supply Current (V DDIO , V DDA_3.3 = 3.3V) (4)Supply Current (V DDIO , V DDA_3.3 = 3.3V) (4)Supply Current (V DDIO , V DDA_3.3 = 3.3V) (4)Supply Current (V DDIO , V DDA_3.3 = 3.3V) (4)Supply Current (V DDIO , V DDA_3.3 = 3.3V) (4)
I DD1_3.3V10Base-TFull-duplex traffic @100% utilization41mA
I DD2_3.3V100Base-TXFull-duplex traffic @100% utilization47mA
I DD3_3.3VEDPD ModeEthernet cable disconnected (reg. 18h.11 = 0)20mA
I DD4_3.3VPower-Down ModeSoftware power-down (reg. 0h.11 = 1)4mA
CMOS Level InputsCMOS Level InputsCMOS Level InputsCMOS Level InputsCMOS Level InputsCMOS Level InputsCMOS Level Inputs
V IHInput High VoltageV DDIO = 3.3V2.0V
V IHInput High VoltageV DDIO = 2.5V1.8V
V IHInput High VoltageV DDIO = 1.8V1.3V
V ILInput Low VoltageV DDIO = 3.3V0.8V
V ILInput Low VoltageV DDIO = 2.5V0.7V
V ILInput Low VoltageV DDIO = 1.8V0.5V
\I IN \Input CurrentV IN = GND ~ VDDIO
CMOS Level OutputsCMOS Level OutputsCMOS Level OutputsCMOS Level OutputsCMOS Level OutputsCMOS Level OutputsCMOS Level Outputs
V OHOutput High VoltageV DDIO = 3.3V2.4V
V OHOutput High VoltageV DDIO = 2.5V2.0V
V OHOutput High VoltageV DDIO = 1.8V1.5V
V OLOutput Low VoltageV DDIO = 3.3V0.4V
V OLOutput Low VoltageV DDIO = 2.5V0.4V
V OLOutput Low VoltageV DDIO = 1.8V0.3V
\I oz \Output Tri-State Leakage
LED OutputLED OutputLED OutputLED OutputLED OutputLED OutputLED Output
I LEDOutput Drive CurrentEach LED pin (LED0, LED1)8mA

KSZ8081MNX/RNB28 Absolute Maximum Ratings

  • (V DD_1.2 ) .................................................. 0.5V to +1.8V
  • (V DDIO, V DDA_3.3 ) ....................................... 0.5V to +5.0V
  • Input Voltage (all inputs) .............................. 0.5V to +5.0V
  • Output Voltage (all outputs) ......................... 0.5V to +5.0V
  • Lead Temperature (soldering, 10sec.).......................260°C
  • Storage Temperature (T s ) .........................-55°C to +150°C

KSZ8081MNX/RNB28 Package Information

Figure 27. Recommended Land Pattern, 32-Pin (5mm x 5mm) QFN

Table 26. Compatible Single-Port 10/100 Magnetics

Red circles indicate thermal vias. They should be 0.350mm in diameter and be connected to the GND plane for maximum thermal performance.

Green rectangles (with shaded area) indicate solder stencil openings on the exposed pad area. They should be 0.87 x 0.87mm in size, 1.07mm pitch.

Variants on the same datasheet

These parts have exact links to the same datasheet. They are candidates to compare, not verified drop-in replacements; check package, pinout and electrical limits.

Part NumberManufacturerPackage
KSZ8081Microchip TechnologyVQFN-32 5x5mm
KSZ8081MNXMicrochip TechnologyQFN-32 5x5mm
KSZ8081MNX-EVALMicrochip Technology32-Pin QFN
KSZ8081MNX/RNBMicrochip TechnologyQFN-32 5x5mm
KSZ8081MNX32Microchip TechnologyQFN-32 5x5mm
KSZ8081MNXCAMicrochip Technology32-VFQFN Exposed Pad
KSZ8081MNXCCMicrochip Technology32-Pin QFN
KSZ8081MNXIAMicrochip Technology32-Pin QFN
KSZ8081MNXICMicrochip Technology32-Pin QFN
KSZ8081RNBMicrochip Technology32-Pin QFN
KSZ8081RNB-EVALMicrochip Technology32-Pin QFN
KSZ8081RNB33Microchip TechnologyQFN-32 5x5mm
KSZ8081RNBCAMicrochip Technology32-Pin QFN
KSZ8081RNBCCMicrochip Technology32-Pin QFN
KSZ8081RNBIAMicrochip Technology32-Pin QFN
KSZ8081RNBICMicrochip Technology32-Pin QFN

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All Interface ICs datasheetsAll Microchip Technology datasheets (599)

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