GD32VF103CX

Part: GD32VF103CBT6 — GigaDevice Semiconductor Inc.

Type: RISC-V 32-bit Microcontroller

Description: 32-bit RISC-V MCU operating at up to 108 MHz with zero-wait-state Flash execution, 128 KB Flash, and 32 KB SRAM.

Operating Conditions:

• Operating temperature: -40 to +85 °C

Absolute Maximum Ratings:

• Max supply voltage: VSS + 3.6 V
• Max continuous current: ±25 mA (GPIO pins)
• Max junction/storage temperature: 125 °C (junction) / -55 to +150 °C (storage)

Key Specs:

• Maximum CPU frequency: 108 MHz
• On-chip Flash: Up to 128 KB
• On-chip SRAM: Up to 32 KB
• External analog supply voltage (VDDA) absolute maximum: VSSA + 3.6 V
• External battery supply voltage (VBAT) absolute maximum: VSS + 3.6 V
• Input voltage on 5V tolerant pins absolute maximum: VDD + 3.6 V
• Maximum current per GPIO pin: ±25 mA

Features:

• RISC-V 32-bit processor core with zero-wait-state Flash access
• Enhancement Core-Local Interrupt Controller (ECLIC) and SysTick timer
• Advanced debug support
• Up to two 12-bit ADCs and up to two 12-bit DACs
• Up to four 16-bit general-purpose timers, two basic timers, and one PWM advanced timer
• Multiple communication interfaces including I2C, SPI, USART, I2S, CAN, and USBFS
• External memory controller (EXMC) support

Package:

• LQFP48
• LQFP100
• LQFP64
• QFN36

Part Number	Part Number	GD32VF103 - TB	GD32VF103 - T8	GD32VF103 - T6	GD32VF103 - T4	GD32VF103 - CB	GD32VF103 - C8	GD32VF103 - C6	GD32VF103 - C4
	Code area (KB)	128	64	32	16	128	64	32	16
	Data area (KB)	0	0	0	0	0	0	0	0
	Total (KB)	128	64	32	16	128	64	32	16
	SRAM (KB)	32	20	10	6	32	20	10	6
	General	4	4	2	2	4	4	2	2
	timer(16-bit)	(1-4)	(1-4)	(1-2)	(1-2)	(1-4)	(1-4)	(1-2)	(1-2)
	Advanced	1	1	1	1	1	1	1	1
	timer(16-bit)	(0)	(0)	(0)	(0)	(0)	(0)	(0)	(0)
	SysTick	1	1	1	1	1	1	1	1
	Basic	2	2	2	2	2	2	2	2
	timer(16-bit)	(5-6)	(5-6)	(5-6)	(5-6)	(5-6)	(5-6)	(5-6)	(5-6)
	Watchdog	2	2	2	2	2	2	2	2
	RTC	1	1	1	1	1	1	1	1
	U(S)ART	2	2	2	2	3	3	2	2
	I2C	1	1	1	1	2 (0-1)	2 (0-1)	1	1
	SPI/I2S	1/-	1/-	1/-	1/-	3/2 (0-2) / (1-2)	3/2 (0-2) / (1-2)	1/-	1/-
	CAN	2	2	2	2	2	2	2	2
	GPIO EXMC	26	26	26	26	37	37	37	37 -
		-	-	-	-	-	-	-
	EXTI	16	16	16	16	16	16	16	16
ADC	Units	2	2	2	2	2	2	2	2
ADC	Channels	10	10	10	10	10	10	10	10
		2 2 2 QFN36	2 2 2 QFN36	2 2 2 QFN36	2 2 2 QFN36	LQFP48	LQFP48	LQFP48	LQFP48

Table 4-23. ADC characteristics

Symbol	Parameter	Conditions	Min	Typ	Max	Unit
V DDA (1)	Operating voltage	-	2.6	3.3	3.6	V
V IN (1)	ADC input voltage range	-	0	-	V REF+	V
f ADC (1)	ADC clock	-	0.6	-	14	MHz
f S (1)	Sampling rate	12-bit	0.04	-	1	MSPS
f S (1)	Sampling rate	10-bit	0.05	-	1.17	MSPS
f S (1)	Sampling rate	8-bit	0.06	-	1.4	MSPS

Table 4-23. ADC characteristics

Symbol	Parameter	Conditions	Min	Typ	Max	Unit
		6-bit	0.08	-	1.75
V AIN (1)	Analog input voltage	16 external; 2 internal	0	-	V DDA	V
V REF+ (2)	Positive Reference Voltage	-	2.4	-	V DDA	V
V REF- (2)	Negative Reference Voltage	-	-	V SSA	-	V
R AIN (2)	External input impedance	See Equation 1	-	-	320	kΩ
R ADC (2)	Input sampling switch resistance	-	-	-	0.55	kΩ
C ADC (2)	Input sampling capacitance	No pin/pad capacitance included	-	-	5.5	pF
t s (2)	Sampling time	f ADC = 14 MHz	0.1	-	17.1	μs
t CONV (2)	Total conversion time(including sampling time)	12-bit	-	14	-	1/ f ADC
t CONV (2)	Total conversion time(including sampling time)	10-bit	-	12	-	1/ f ADC
t CONV (2)	Total conversion time(including sampling time)	8-bit	-	10	-	1/ f ADC
t CONV (2)	Total conversion time(including sampling time)	6-bit	-	8	-	1/ f ADC
t SU (2)	Startup time	-	-	-	1	μs

$$R_{\mathrm{AIN}} < \frac{T_{\mathrm{s}}}{f_{\mathrm{ADC}} * C_{\mathrm{ADC}} * \ln(2^{N+2})} - R_{\mathrm{ADC}}$$

The formula above (Equation 1) is used to determine the maximum external impedance allowed for an error below 1/4 of LSB. Here N = 12 (from 12-bit resolution).

Table 4-24. ADC RAIN max for fADC = 14 MHz (1)

• T s (cycles) t s (us) R AINmax (kΩ)
• 1.5 0.11 1.46
• 7.5 0.54 9.49
• 13.5 0.96 17.5
• 28.5 2.04 37.6
• 41.5 2.96 55
• 55.5 3.96 73.7
• 71.5 5.11 95
• 239.5 17.11 320

Table 4-24. ADC RAIN max for fADC = 14 MHz (1)

The maximum ratings are the limits to which the device can be subjected without permanently damaging the device. Note that the device is not guaranteed to operate properly at the maximum ratings. Exposure to the absolute maximum rating conditions for extended periods may affect device reliability.

Table 4-1. Absolute maximum ratings (1)(4)

Symbol	Parameter	Min	Max	Unit
V DD	External voltage range (2)	V SS - 0.3	V SS + 3.6	V
V DDA	External analog supply voltage	V SSA - 0.3	V SSA + 3.6	V
V BAT	External battery supply voltage	V SS - 0.3	V SS + 3.6	V
V IN	Input voltage on 5V tolerant pin (3)	V SS - 0.3	V DD + 3.6	V
V IN	Input voltage on other I/O	V SS - 0.3	3.6	V
|ΔV DDX |	Variations between different V DD power pins	-	50	mV
|V SSX -V SS |	Variations between different ground pins	-	50	mV
I IO	Maximum current for GPIO pins	-	±25	mA
T A	Operating temperature range	-40	+85	° C
T STG	Storage temperature range	-55	+150	° C
T J	Maximum junction temperature	-	125	° C

Figure 5-1. LQFP100 package outline

Table 5-1. LQFP100 package dimensions

Symbol	Min	Typ	Max
A	-	-	1.60
A1	0.05	-	0.15
A2	1.35	1.40	1.45
A3	0.59	0.64	0.69
D	15.80	16.0	16.20
D1	13.90	14.0	14.10
E	15.80	16.0	16.20
E1	13.90	14.0	14.10
θ	0°	3.5°	7°
c	0.13	-	0.17
c1	0.12	0.13	0.14
L	0.45	0.6	0.75
L1	-	1.0 REF	-

Table 5-1. LQFP100 package dimensions

Symbol	Min	Typ	Max
b	0.18	0.20	0.26
b1	0.17	0.20	0.23
eB	15.05	-	15.35
e	-	0.50 BSC	-

(Original dimensions are in millimeters)