GD32VF103CX

Part: GD32VF103 RISC-V 32-bit MCU — GigaDevice Semiconductor Inc.

Type: RISC-V 32-bit MCU

Description: 32-bit RISC-V MCU with a Bumblebee core operating at up to 108 MHz, featuring up to 128 KB Flash, up to 32 KB SRAM, and extensive peripherals including ADC, DAC, I2C, SPI, USART, USBFS, and CAN.

Operating Conditions:

• Supply voltage: 2.6–3.6 V
• Operating temperature: -40 to +85 °C
• Max clock frequency: 108 MHz

Absolute Maximum Ratings:

• Max supply voltage: 4.0 V
• Max junction/storage temperature: +125 °C (junction), +150 °C (storage)

Key Specs:

• Core frequency: up to 108 MHz
• Flash memory size: up to 128 KB
• SRAM memory size: up to 32 KB
• ADC resolution: 12-bit
• DAC resolution: 12-bit
• I/O output voltage high (VOH): VDD-0.4 V (min) at IOH = -8 mA
• I/O output voltage low (VOL): 0.4 V (max) at IOL = 8 mA
• Run mode current consumption: 1.8 mA/MHz (typ) at VDD=3.3V, fHCLK=108MHz, TA=25°C
• Standby mode current consumption: 2 μA (typ) at VDD=3.3V, TA=25°C

Features:

• RISC-V 32-bit Bumblebee core
• Up to 108 MHz operating frequency
• Up to 128 KB Flash memory
• Up to 32 KB SRAM
• Multiple communication interfaces: I2C, SPI, I2S, USART, USBFS, CAN
• 12-bit ADC and DAC
• Multiple timers and PWM generation
• Real-time clock (RTC)
• Power saving modes

Package:

• LQFP100
• LQFP64
• LQFP48
• QFN36

		GD32VF103	GD32VF103	GD32VF103	GD32VF103	GD32VF103	GD32VF103	GD32VF103	GD32VF103
Part Number	Part Number	TB	T8	T6	T4	CB	C8	C6	C4
	Code area (KB)	128	64	32	16	128	64	32	16
	Data area (KB)	0	0	0	0	0	0	0	0
	Total (KB)	128	64	32	16	128	64	32	16
	SRAM (KB)	32	20	10	6	32	20	10	6
	General	4	4	2	2	4	4	2	2
	timer(16-bit)	(1-4)	(1-4)	(1-2)	(1-2)	(1-4)	(1-4)	(1-2)	(1-2)
	Advanced	1	1	1	1	1	1	1	1
	timer(16-bit)	(0)	(0)	(0)	(0)	(0)	(0)	(0)	(0)
	SysTick	1	1	1	1	1	1	1	1
	Basic	2	2	2	2	2	2	2	2
	timer(16-bit)	(5-6)	(5-6)	(5-6)	(5-6)	(5-6)	(5-6)	(5-6)	(5-6)
	Watchdog	2	2	2	2	2	2	2	2
	RTC	1	1	1	1	1	1	1	1
	U(S)ART	2	2	2	2	3	3	2	2
	I2C	1	1	1	1	2 (0-1)	2 (0-1)	1	1
	SPI/I2S	1/-	1/-	1/-	1/-	3/2 (0-2) / (1-2)	3/2 (0-2) / (1-2)	1/-	1/-
	CAN	2	2	2	2	2	2	2	2
	GPIO	26	26	26	26	37	37	37	37
	EXMC	-	-	-	-	-	-	-	-
	EXTI	16	16	16	16	16	16	16	16
ADC	Units	2	2	2	2	2	2	2	2
ADC	Channels	10	10	10	10	10	10	10	10
		2 2 2 QFN36	2 2 2 QFN36	2 2 2 QFN36	2 2 2 QFN36	2 2 2 LQFP48	2 2 2 LQFP48	2 2 2 LQFP48	2 2 2 LQFP48

Table 4-23. ADC characteristics

Symbol	Parameter	Conditions	Min	Typ	Max	Unit
V DDA (1)	Operating voltage	-	2.6	3.3	3.6	V
V IN (1)	ADC input voltage range	-	0	-	V REF+	V
f ADC (1)	ADC clock	-	0.6	-	14	MHz
f S (1)	Sampling rate	12-bit	0.04	-	1	MSPS
f S (1)	Sampling rate	10-bit	0.05	-	1.17	MSPS
f S (1)	Sampling rate	8-bit	0.06	-	1.4	MSPS

Table 4-23. ADC characteristics

Symbol	Parameter	Conditions	Min	Typ	Max	Unit
		6-bit	0.08	-	1.75
V AIN (1)	Analog input voltage	16 external; 2 internal	0	-	V DDA	V
V REF+ (2)	Positive Reference Voltage	-	2.4	-	V DDA	V
V REF- (2)	Negative Reference Voltage	-	-	V SSA	-	V
R AIN (2)	External input impedance	See Equation 1	-	-	320	kΩ
R ADC (2)	Input sampling switch resistance	-	-	-	0.55	kΩ
C ADC (2)	Input sampling capacitance	No pin/pad capacitance included	-	-	5.5	pF
t s (2)	Sampling time	f ADC = 14 MHz	0.1	-	17.1	μs
t CONV (2)	Total conversion time(including sampling time)	12-bit	-	14	-	1/ f ADC
t CONV (2)	Total conversion time(including sampling time)	10-bit	-	12	-	1/ f ADC
t CONV (2)	Total conversion time(including sampling time)	8-bit	-	10	-	1/ f ADC
t CONV (2)	Total conversion time(including sampling time)	6-bit	-	8	-	1/ f ADC
t SU (2)	Startup time	-	-	-	1	μs

The formula above (Equation 1) is used to determine the maximum external impedance allowed for an error below 1/4 of LSB. Here N = 12 (from 12-bit resolution).

Table 4-24. ADC RAIN max for fADC = 14 MHz (1)

• T s (cycles) t s (us) R AINmax (kΩ)
• 1.5 0.11 1.46
• 7.5 0.54 9.49
• 13.5 0.96 17.5
• 28.5 2.04 37.6
• 41.5 2.96 55
• 55.5 3.96 73.7
• 71.5 5.11 95
• 239.5 17.11 320

Table 4-24. ADC RAIN max for fADC = 14 MHz (1)

The maximum ratings are the limits to which the device can be subjected without permanently damaging the device. Note that the device is not guaranteed to operate properly at the maximum ratings. Exposure to the absolute maximum rating conditions for extended periods may affect device reliability.

Table 4-1. Absolute maximum ratings (1)(4)

Symbol	Parameter	Min	Max	Unit
V DD	External voltage range (2)	V SS - 0.3	V SS + 3.6	V
V DDA	External analog supply voltage	V SSA - 0.3	V SSA + 3.6	V
V BAT	External battery supply voltage	V SS - 0.3	V SS + 3.6	V
V IN	Input voltage on 5V tolerant pin (3)	V SS - 0.3	V DD + 3.6	V
V IN	Input voltage on other I/O	V SS - 0.3	3.6	V
\	ΔV DDX \		Variations between different V DD power pins	-
\	V SSX -V SS \		Variations between different ground pins	-
I IO	Maximum current for GPIO pins	-	±25	mA
T A	Operating temperature range	-40	+85	° C
T STG	Storage temperature range	-55	+150	° C
T J	Maximum junction temperature	-	125	° C

Figure 5-1. LQFP100 package outline

Table 5-1. LQFP100 package dimensions

Symbol	Min	Typ	Max
A	-	-	1.60
A1	0.05	-	0.15
A2	1.35	1.40	1.45
A3	0.59	0.64	0.69
D	15.80	16.0	16.20
D1	13.90	14.0	14.10
E	15.80	16.0	16.20
E1	13.90	14.0	14.10
θ	0°	3.5°	7°
c	0.13	-	0.17
c1	0.12	0.13	0.14
L	0.45	0.6	0.75
L1	-	1.0 REF	-

Table 5-1. LQFP100 package dimensions

Symbol	Min	Typ	Max
b	0.18	0.20	0.26
b1	0.17	0.20	0.23
eB	15.05	-	15.35
e	-	0.50 BSC	-

(Original dimensions are in millimeters)