ESP32-C6-MINI-1-N4

ESP32-C6-MINI-1 ESP32-C6-MINI-1U

Manufacturer

Espressif Systems

Overview

Part: ESP32-C6-MINI-1, ESP32-C6-MINI-1U

Type: Wi-Fi 6, Bluetooth LE, Zigbee, Thread Module with 32-bit RISC-V Microprocessor

Key Specs:

  • CPU: 32-bit RISC-V single-core

Features

CPU and On-Chip Memory

  • ESP32-C6FH4/ESP32-C6FH8 embedded, 32-bit RISC-V single-core microprocessor, up to 160 MHz
  • ROM: 320 KB
  • HP SRAM: 512 KB
  • LP SRAM: 16 KB
  • Flash up to 8 MB in chip package

Wi-Fi

  • 1T1R in 2.4 GHz band

  • Operating frequency: 2412 ~ 2484 MHz

  • IEEE 802.11ax-compliant

    • 20 MHz-only non-AP mode
    • MCS0 ~ MCS9
    • Uplink and downlink OFDMA, especially suitable for simultaneous connections in high-density environments
    • Downlink MU-MIMO (multi-user, multiple input, multiple output) to increase network capacity
    • Beamformee that improves signal quality
    • Channel quality indication (CQI)
    • DCM (dual carrier modulation) to improve link robustness
    • Spatial reuse to maximize parallel transmissions
  • Target wake time (TWT) that optimizes power saving mechanisms

  • Fully compatible with IEEE 802.11b/g/n protocol

    • 20 MHz and 40 MHz bandwidth
    • Data rate up to 150 Mbps
    • Wi-Fi Multimedia (WMM)
    • TX/RX A-MPDU, TX/RX A-MSDU
    • Immediate Block ACK
    • Fragmentation and defragmentation
    • Transmit opportunity (TXOP)
    • Automatic Beacon monitoring (hardware TSF)
    • 4 × virtual Wi-Fi interfaces
    • Simultaneous support for Infrastructure BSS in Station mode, SoftAP mode, Station + SoftAP mode, and promiscuous mode Note that when ESP32-C6 scans in Station mode, the SoftAP channel will change along with the Station channel
    • 802.11mc FTM

Bluetooth®

  • Bluetooth LE: Bluetooth 5.3 certified

  • Bluetooth mesh

  • High power mode (20 dBm)

  • Speed: 125 Kbps, 500 Kbps, 1 Mbps, 2 Mbps

  • Advertising extensions

  • Multiple advertisement sets

  • Channel selection algorithm #2

  • LE power control

  • Internal co-existence mechanism between Wi-Fi and Bluetooth to share the same antenna

IEEE 802.15.4

  • Compliant with IEEE 802.15.4-2015 protocol
  • OQPSK PHY in 2.4 GHz band
  • Data rate: 250 Kbps
  • Thread 1.3
  • Zigbee 3.0

Peripherals

GPIO, SPI, parallel IO interface, UART, I2C, I2S, RMT (TX/RX), pulse counter, LED PWM, USB Serial/JTAG controller, MCPWM, SDIO2.0 slave controller, GDMA, TWAI® controller, on-chip debug functionality via JTAG, event task matrix, ADC, temperature sensor, system timer, general-purpose timers, and watchdog timers

Integrated Components on Module

40 MHz crystal oscillator

Antenna Options

  • On-board PCB antenna (ESP32-C6-MINI-1)
  • External antenna via a connector (ESP32-C6-MINI-1U)

Operating Conditions

  • Operating voltage/Power supply: 3.0 ~ 3.6 V
  • Operating ambient temperature:
    • 85 °C version module: –40 ~ 85 °C
    • 105 °C version module: –40 ~ 105 °C

Certification

  • RF certification: See certificates
  • Green certification: RoHS/REACH

Test

HTOL/HTSL/uHAST/TCT/ESD

Applications

  • Smart Home

  • Industrial Automation

  • Health Care

  • Consumer Flectronics

  • Smart Agriculture

  • POS machines

  • Service robot

  • Audio Devices

  • Generic Low-power IoT Sensor Hubs

  • Generic Low-power IoT Data Loggers

<sup>3 The flash is integrated in the chip's package.

<sup>4 Ambient temperature specifies the recommended temperature range of the environment immediately outside the Espressif module.

<sup>5 For details, refer to Section 9.1 Physical Dimensions.

Pin Configuration

The module has 53 pins. See pin definitions in Table 3 Pin Description.

For peripheral pin configurations, please refer to ESP32-C6 Series Datasheet.

Table 3: Pin Definitions

NameNo.Type 1Function
GND1, 2, 11, 14, 36~53PGround
3V33PPower supply

Table 3 – cont'd from previous page

| Name | No. | Type1 | Function | |------|-----|-------|------------------------------------------------------|--| | NC | 4 | — | NC | | IO2 | 5 | I/O/T | GPIO2, LP_GPIO2, LP_UART_RTSN, ADC1_CH2, FSPIQ | | IO3 | 6 | I/O/T | GPIO3, LP_GPIO3, LP_UART_CTSN, ADC1_CH3 | | NC | 7 | — | NC | | | | | High: on, enables the chip. | | EN | 8 | I | Low: off, the chip powers off. | | | | | Note: Do not leave the EN pin floating. | | IO4 | 9 | I/O/T | MTMS, GPIO4, LP_GPIO4, LP_UART_RXD, ADC1_CH4, FSPIHD | | IO5 | 10 | I/O/T | MTDI, GPIO5, LP_GPIO5, LP_UART_TXD, ADC1_CH5, FSPIWP | | IO0 | 12 | I/O/T | GPIO0, XTAL_32K_P, LP_GPIO0, LP_UART_DTRN, ADC1_CH0 | | IO1 | 13 | I/O/T | GPIO1, XTAL_32K_N, LP_GPIO1, LP_UART_DSRN, ADC1_CH1 | | IO6 | 15 | I/O/T | MTCK, GPIO6, LP_GPIO6, LP_I2C_SDA, ADC1_CH6, FSPICLK | | IO7 | 16 | I/O/T | MTDO, GPIO7, LP_GPIO7, LP_I2C_SCL, FSPID | | IO12 | 17 | I/O/T | GPIO12, USB_D | | IO13 | 18 | I/O/T | GPIO13, USB_D+ | | IO14 | 19 | I/O/T | GPIO14 | | IO15 | 20 | I/O/T | GPIO15 | | NC | 21 | — | NC | | IO8 | 22 | I/O/T | GPIO8 | | IO9 | 23 | I/O/T | GPIO9 | | IO18 | 24 | I/O/T | GPIO18, SDIO_CMD, FSPICS2 | | IO19 | 25 | I/O/T | GPIO19, SDIO_CLK, FSPICS3 | | IO20 | 26 | I/O/T | GPIO20, SDIO_DATA0, FSPICS4 | | IO21 | 27 | I/O/T | GPIO21, SDIO_DATA1, FSPICS5 | | IO22 | 28 | I/O/T | GPIO22, SDIO_DATA2 | | IO23 | 29 | I/O/T | GPIO23, SDIO_DATA3 | | RXD0 | 30 | I/O/T | U0RXD, GPIO17, FSPICS1 | | TXD0 | 31 | I/O/T | U0TXD, GPIO16, FSPICS0 | | NC | 32 | — | NC | | NC | 33 | — | NC | | NC | 34 | — | NC | | NC | 35 | — | NC | 1 P: power supply; I: input; O: output; T: high impedance.

Electrical Characteristics

5.1 Absolute Maximum Ratings

Stresses above those listed in Table 11 Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under Table 12 Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

Table 11: Absolute Maximum Ratings

SymbolParameterMinMaxUnit
VDD33Power supply voltage–0.33.6V
TST OREStorage temperature–40105°C

Absolute Maximum Ratings

Stresses above those listed in Table 11 Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under Table 12 Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

Table 11: Absolute Maximum Ratings

SymbolParameterMinMaxUnit
VDD33Power supply voltage–0.33.6V
TST OREStorage temperature–40105°C

Recommended Operating Conditions

Table 12: Recommended Operating Conditions

SymbolParameterMinTypMaxUnit
VDD33Power supply voltage3.03.33.6V
IV DDCurrent delivered by external power supply0.5A
85 °C version85°C
TAOperating ambient temperature105 °C version–40
105
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