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EFM8BB31F32I

8-bit Microcontroller

The EFM8BB31F32I is a 8-bit microcontroller from Silicon Labs. View the full EFM8BB31F32I datasheet below including key specifications, electrical characteristics, absolute maximum ratings.

EFM8BB31F32I shares its datasheet with EFM8BB31F32G-A-QFN32R, whose page lists every part number it covers.

Official EFM8BB31F32I datasheet (PDF) — the source this page was extracted from.

EFM8BB31F32I Key Specifications

ParameterValue
ADC12/10-bit, up to 20 channels
RAM2304 bytes
CorePipelined CIP-51 8051, up to 50 MHz
DACs2 x 12-bit
GPIOUp to 29 (device-dependent by package)
TimersSix 16-bit timers, 6-channel PCA
Flash Memory32 kB
QualificationAEC-Q100
Supply Voltage2.2V to 3.6V
Analog Comparators2
Internal Oscillators49 MHz, 24.5 MHz (±2%), 80 kHz
Operating Temperature-40 to 85 °C or -40 to 125 °C
Communication Interfaces2x UART (up to 3 Mbaud), SPI (up to 12 Mbps), SMBus/I2C (up to 400 kbps), I2C High-Speed Slave (up to 3.4 Mbps)

EFM8BB31F32I Overview

Part: EFM8BB31F32G-A-QFN32R — Silicon Labs

Type: 8-bit Microcontroller

Description: A performance line 8-bit microcontroller with a pipelined 8051 core operating at up to 50 MHz, featuring 32 kB Flash, 2304 bytes RAM, 12-bit ADC, two 12-bit DACs, and various communication interfaces, ideal for general-purpose embedded applications.

Operating Conditions:

  • Supply voltage: 2.2–3.6 V
  • Operating temperature: -40 to 85 °C
  • Max operating frequency: 50 MHz

Key Specs:

  • Core: Pipelined 8-bit CIP-51
  • Flash Memory: 32 kB (user-accessible)
  • RAM: 2304 bytes (including 256 bytes 8051 RAM and 2048 bytes XRAM)
  • ADC Resolution: 12-bit/10-bit
  • DACs: 2 x 12-bit
  • Digital I/O Pins: Up to 29 multifunction
  • Internal Oscillator Accuracy: ±2% (49 MHz and 24.5 MHz)
  • Max SPI Speed: 12 Mbps

Features:

  • Fully compatible with standard 8051 instruction set
  • In-system reprogrammable flash memory
  • Internal LDO regulator, Power-on reset, and brownout detectors
  • Up to 25 pins 5 V tolerant under bias
  • Flexible peripheral crossbar
  • Internal temperature sensor
  • 2 x UART, 1 x SPI, 1 x SMBus/I2C (Master/Slave)
  • I2C High-Speed Slave (up to 3.4 Mbps)
  • 4 Configurable Logic Units
  • 6-channel programmable counter array (PCA)
  • 6 x 16-bit general-purpose timers
  • Independent watchdog timer
  • On-chip, non-intrusive debugging
  • Pre-programmed UART bootloader
  • AEC-Q100 qualified (for A-grade variants)

Applications:

  • Consumer electronics
  • Precision instrumentation
  • Power management and control
  • Industrial control and automation
  • Smart sensors
  • Automotive control

Package:

  • QFN32-GI
  • QFP32
  • QFN24-GI
  • QSOP24
  • QFN32-AI
  • QFN24-AI

EFM8BB31F32I Features

  • Pipelined 8-bit 8051 MCU Core with 50 MHz operating frequency
  • Up to 29 multifunction I/O pins
  • One 12-bit/10-bit ADC
  • Four 12-bit DACs with synchronization and PWM capabilities
  • Two low-current analog comparators with built-in reference DACs
  • Internal temperature sensor
  • Internal 49 MHz and 24.5 MHz oscillators accurate to ±2%
  • Four channels of Configurable Logic
  • 6-channel PWM / PCA
  • Six 16-bit general-purpose timers
  • Industrial control and automation
  • Smart sensors
  • Automotive control

EFM8BB31F32I Electrical Characteristics

All electrical parameters in all tables are specified under the conditions listed in Table 4.1 Recommended Operating Conditions on page 19, unless stated otherwise.

EFM8BB31F32I Absolute Maximum Ratings

Stresses above those listed in Table 4.21 Absolute Maximum Ratings on page 40 may cause permanent damage to the device. This is a stress rating only and functional operation of the devices at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. For more information on the available quality and reliability data, see the Quality and Reliability Monitor Report at http://www.silabs.com/ support/quality/pages/default.aspx.

Table 4.21. Absolute Maximum Ratings

ParameterSymbolTest ConditionMinMaxUnit
Ambient Temperature Under BiasT BIAS-55125°C
Storage TemperatureT STG-65150°C
Voltage on VDDV DDGND-0.34.2V
Voltage on VIO 2V IOGND-0.3V DD +0.3V
Voltage on I/O pins or RSTb, excluding P2.0-P2.3 (QFN24 and QSOP24) or P3.0-P3.3 (QFN32 and QFP32)V INV IO > 3.3 VGND-0.35.8V
Voltage on I/O pins or RSTb, excluding P2.0-P2.3 (QFN24 and QSOP24) or P3.0-P3.3 (QFN32 and QFP32)V INV IO < 3.3 VGND-0.3V IO +2.5V
Voltage on P2.0-P2.3 (QFN24 and QSOP24) or P3.0-P3.3 (QFN32 and QFP32)V INGND-0.3V DD +0.3V
Total Current Sunk into Supply PinI VDD-200mA
Total Current Sourced out of Ground PinI GND200-mA
Current Sourced or Sunk by any I/O Pin or RSTbI IO-100100mA
Operating Junction TemperatureT JT A = -40 °C to 85 °C-40105°C
Operating Junction TemperatureT JT A = -40 °C to 125 °C (I-grade or A- grade parts only)-40130°C
  1. Exposure to maximum rating conditions for extended periods may affect device reliability.

  2. In certain package configurations, the VIO and VDD supplies are bonded to the same pin.

Table 4.1. Recommended Operating Conditions

ParameterSymbolTest ConditionMinTypMaxUnit
Operating Supply Voltage on VDDV DD2.2-3.6V
Operating Supply Voltage on VIO 2,V IO2.2-V DDV
System Clock Frequencyf SYSCLK0-50MHz
Operating Ambient TemperatureT AG-grade devices-40-85°C
Operating Ambient TemperatureI-grade or A-grade devices-40-125°C
  1. All voltages with respect to GND

  2. In certain package configurations, the VIO and VDD supplies are bonded to the same pin.

  3. I/O have reduced current drive/sink capabilities at lower VIO levels. See 4.1.16 Port I/O for additional information.

EFM8BB31F32I Package Information

Figure 7.1. Package Drawing

Table 7.1. Package Dimensions

DimensionMinTypMax
A0.450.500.55
A10.000.0350.05
b0.150.200.25
D4.00 BSC.4.00 BSC.4.00 BSC.
D22.802.903.00
e0.40 BSC.0.40 BSC.0.40 BSC.
E4.00 BSC.4.00 BSC.4.00 BSC.
E22.802.903.00
L0.200.300.40
aaa--0.10
bbb--0.10
ccc--0.08
ddd--0.10
eee--0.10
ggg--0.05
  1. All dimensions shown are in millimeters (mm) unless otherwise noted.
  2. Dimensioning and Tolerancing per ANSI Y14.5M-1994.
  3. This drawing conforms to JEDEC Solid State Outline MO-220.
  4. Recommended card reflow profile is per the JEDEC/IPC J-STD-020C specification for Small Body Components.

Min

Typ

Max

Variants on the same datasheet

These parts have exact links to the same datasheet. They are candidates to compare, not verified drop-in replacements; check package, pinout and electrical limits.

Part NumberManufacturerPackage
EFM8BB3Silicon Labs—
EFM8BB31F16ASilicon Labs—
EFM8BB31F16GSilicon Labs—
EFM8BB31F16ISilicon Labs—
EFM8BB31F32ASilicon Labs—
EFM8BB31F32GSilicon Labs—
EFM8BB31F32G-A-QFN32RSilicon LabsQFN-32 5x5mm
EFM8BB31F32G-DSilicon Labs—
EFM8BB31F32G-D-QFN24Silicon LabsQFN-24 3x3mm
EFM8BB31F32G-D-QFN32Silicon LabsQFN-32 4x4mm
EFM8BB31F32G-D-QFP32Silicon LabsQFP-32
EFM8BB31F64ASilicon LabsQFN-32 5x5mm
EFM8BB31F64GSilicon Labs—
EFM8BB31F64ISilicon Labs—

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