CC2340R52E0RKPR

Part: CC2340R52E0RKPR — Texas Instruments

Type: 2.4 GHz Wireless MCU (Bluetooth LE / Zigbee / Thread / Proprietary)

Description: 48 MHz Arm Cortex-M0+ 2.4 GHz wireless MCU with 512 KB flash and 36 KB RAM, integrated balun, 1.71–3.8 V supply, and up to +8 dBm TX output power.

Operating Conditions:

• Supply voltage (VDDS): 1.71–3.8 V
• Operating temperature: -40 to 125 °C for E-suffix (125 °C) parts such as this one; the N-suffix parts are rated -40 to 85 °C
• Supply voltage slew rate: rising 0–100 mV/μs, falling 0–1 mV/μs
• CPU clock: 48 MHz

Absolute Maximum Ratings:

• Supply voltage (VDDS): -0.3 to 4.1 V
• Voltage on any digital pin: -0.3 to VDDS + 0.3 V, max 4.1 V
• Voltage on crystal oscillator pins X48P and X48N: -0.3 to 1.24 V
• Voltage on ADC input: 0 to VDDS V
• RF pin input level: 5 dBm max
• Storage temperature: -40 to 150 °C

Key Specs:

• Active mode: 2.6 mA running CoreMark (53 μA/MHz)
• Standby: < 710 nA (CC2340R52, RTC running, full RAM retention)
• Shutdown: 165 nA (wake-up on pin)
• Radio current: 5.3 mA RX, 5.1 mA TX at 0 dBm, < 11.0 mA TX at +8 dBm
• Sensitivity: -102 dBm (BLE LE Coded 125 kbps), -96.5 dBm (BLE 1 Mbps), -98 dBm (IEEE 802.15.4)
• Output power: up to +8 dBm with temperature compensation
• 12-bit ADC: 1.2 Msps with external reference, 267 ksps with internal reference, up to 12 external inputs
• Memory: 512 KB flash, 12 KB ROM, 36 KB SRAM on this variant

Features:

• Arm Cortex-M0+ at 48 MHz
• 2.4 GHz transceiver with integrated balun, supporting Bluetooth LE (qualified against Core 5.4), IEEE 802.15.4, Zigbee, Thread and proprietary modes
• Bluetooth LE features: LE 2M, LE Coded, Periodic and Extended Advertising, LE Secure Connections
• Over-the-air upgrade (OTA) support and serial wire debug (SWD)
• On-chip buck DC/DC converter
• Up to 26 I/O pads, including up to 22 analog-capable or digital DIOs
• Timers: up to 3 × 16-bit and 1 × 24-bit general-purpose timers
• Peripherals: 1× UART, 1× SPI, 1× I2C, 1× low-power comparator, RTC, watchdog timer, temperature and battery monitor
• AES 128-bit cryptographic accelerator and true random number generator
• Suitable for systems targeting EN 300 328, FCC CFR47 Part 15 and ARIB STD-T66 compliance

Applications:

• Medical (home healthcare, patient monitoring, personal care and fitness)
• Building automation (security, HVAC, fire safety)
• Lighting
• Factory automation and control
• Retail automation and electronic shelf labels
• Grid infrastructure and smart meters
• Personal electronics (connected peripherals, toys, wearables)

Package:

• RKP QFN40, 5 mm × 5 mm, 0.4 mm pitch (CC2340R52E0RKPR)
• Other family packages: RGE QFN24 (4 mm × 4 mm) and YBG WCSP (2.2 mm × 2.6 mm)

• Medical
• -Home healthcare-blood glucose monitors, blood pressure monitors, CPAP machines, electronic thermometers
• -Patient monitoring and diagnostics-medical sensor patches
• -Personal care and fitness-electric toothbrush, wearable fitness and activity monitor
• Building automation
• -Building security systems-motion detector, electronic smart lock, door and window sensor, garage door system, gateway
• -HVAC-thermostat, wireless environmental sensor
• -Fire safety system-smoke and heat detector
• -Video surveillance-IP network camera
• Lighting
• -LED luminaire
• -Lighting control-daylight sensor, lighting sensor, wireless control
• Factory automation and control

over operating free-air temperature range (unless otherwise noted) (1) (2)

• (1) Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions. If outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.
• (2) All voltage values are with respect to ground, unless otherwise noted.
• (3) Including analog capable DIOs.

over operating free-air temperature range (unless otherwise noted)

• (1) Operation at or near maximum operating temperature for extended durations will result in a reduction in lifetime.
• (2) For thermal resistance details, refer to Thermal Resistance Characteristics table in this document.

(3) For small coin-cell batteries, with high worst-case end-of-life equivalent source resistance, a 10μF VDDS input capacitor must be used to ensure compliance with this slew rate.

DSBGA - 0.5 mm max height

DIE SIZE BALL GRID ARRAY