XC2S100

Part: Spartan-II FPGA Family — Xilinx

Type: Field-Programmable Gate Array (FPGA)

Description: 2.5 V FPGA family delivering 15,000 to 200,000 system gates with up to 200 MHz system performance, dedicated block RAM, distributed RAM, and integrated DLLs.

Operating Conditions:

• Supply voltage: 2.5 V nominal (VCCINT)
• Operating temperature: 0 to +85 °C (Commercial), -40 to +100 °C (Industrial)
• Maximum system clock rate: Up to 200 MHz

Absolute Maximum Ratings:

• Max supply voltage: 3.0 V (VCCINT relative to GND), 4.0 V (VCCO relative to GND)
• Max junction/storage temperature: -65 to +150 °C (ambient storage), +125 °C (junction)

Key Specs:

• Core supply voltage (VCCINT): -0.5 V to 3.0 V (abs max)
• Output supply voltage (VCCO): -0.5 V to 4.0 V (abs max)
• Input reference voltage (VREF): -0.5 V to 3.6 V (abs max)
• Input voltage (VIN, 5V tolerant I/O): -0.5 V to 5.5 V
• Input voltage (VIN, no 5V tolerance): -0.5 V to VCCO + 0.5 V
• Output drive capability: Source up to 24 mA, sink up to 48 mA
• System gate density: 15,000 to 200,000 gates (432 to 5,292 logic cells)
• Block RAM: Up to 56K bits (4,096 bits per block)

Features:

• Advanced 0.18 micron process Virtex-based architecture
• SelectRAM+ hierarchical memory: 16 bits/LUT distributed RAM and 4K-bit synchronous block RAM
• Four dedicated Delay-Locked Loops (DLLs) for clock control and delay compensation
• Support for 16 selectable I/O standards including LVTTL, LVCMOS2, PCI, GTL, HSTL, and SSTL
• 5V tolerant I/O operation
• IEEE 1149.1 compatible Boundary Scan logic

Applications:

• High-volume ASIC replacement
• High-speed arithmetic and DSP implementations
• Compact PCI and PCI bus systems

Package:

• VQ100 / VQG100 (100-pin Very Thin QFP)
• TQ144 / TQG144 (144-pin Thin QFP)
• CS144 / CSG144 (144-ball Chip-Scale BGA)
• PQ208 / PQG208 (208-pin Plastic QFP)
• FG256 / FGG256 (256-ball Fine Pitch BGA)
• FG456 / FGG456 (456-ball Fine Pitch BGA)

• Second generation ASIC replacement technology
• -Densities as high as 5,292 logic cells with up to 200,000 system gates
• -Streamlined features based on Virtex architecture
• -Unlimited reprogrammability
• -Very low cost
• -Advanced 0.18 micron process

Table 1: Spartan-II FPGA Family Members

1. All user I/O counts do not include the four global clock/user input pins. See details in Table 2, page 3.

© 2004 Xilinx, Inc. All rights reserved. All Xilinx trademarks, registered trademarks, patents, and disclaimers are as listed at http://www.xilinx.com/legal.htm . All other trademarks and registered trademarks are the property of their respective owners. All specifications are subject to change without notice.

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Use the BUFGDLL macro as the simplest way to provide zero propagation delay for a high-fanout on-chip clock from an external input. This macro uses the IBUFG, CLKDLL and BUFG primitives to implement the most basic DLL application as shown in Figure 24.

Figure 24: BUFGDLL Schematic

This symbol does not provide access to the advanced clock domain controls or to the clock multiplication or clock division features of the DLL. This symbol also does not provide access to the RST, or LOCKED pins of the DLL. For access to these features, a designer must use the library DLL primitives described in the following sections.

1. With no output current loads, no active input pull-up resistors, all I/O pins 3-stated and floating.
2. The I/O leakage current specification applies only when the V CCINT and V CCO supply voltages have reached their respective minimum Recommended Operating Conditions.
3. Internal pull-up and pull-down resistors guarantee valid logic levels at unconnected input pins. These pull-up and pull-down resistors do not provide valid logic levels when input pins are connected to other circuits.

1. Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those listed under Operating Conditions is not implied. Exposure to Absolute Maximum Ratings conditions for extended periods of time may affect device reliability.
2. Power supplies may turn on in any order.
3. VIN should not exceed V CCO by more than 3.6V over extended periods of time (e.g., longer than a day).
4. Spartan-II I/Os are 5V Tolerant whenever the LVTTL, LVCMOS2, or PCI33_5 signal standard has been selected. With 5V Tolerant I/Os selected, the Maximum DC overshoot must be limited to either +5.5V or 10 mA, and undershoot must be limited to either -0.5V or 10 mA, whichever is easier to achieve. The Maximum AC conditions are as follows: The device pins may undershoot to -2.0V or overshoot to +7.0V, provided this over/undershoot lasts no more than 11 ns with a forcing current no greater than 100 mA.
5. Without 5V Tolerant I/Os selected, the Maximum DC overshoot must be limited to either V CCO + 0.5V or 10 mA, and undershoot must be limited to -0.5V or 10 mA, whichever is easier to achieve. The Maximum AC conditions are as follows: The device pins may undershoot to -2.0V or overshoot to V CCO + 2.0V, provided this over/undershoot lasts no more than 11 ns with a forcing current no greater than 100 mA.
6. For soldering guidelines, see the Packaging Information on the Xilinx web site: http://www.xilinx.com/publications/products/packaging/index.htm

© 2003 Xilinx, Inc. All rights reserved. All Xilinx trademarks, registered trademarks, patents, and disclaimers are as listed at http://www.xilinx.com/legal.htm . All other trademarks and registered trademarks are the property of their respective owners. All specifications are subject to change without notice.

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1. At junction temperatures above those listed as Operating Conditions, all delay parameters increase by 0.35% per °C.
2. Functional operation is guaranteed down to a minimum V CCINT of 2.25V (Nominal V CCINT - 10%). For every 50 mV reduction in VCCINT below 2.375V (nominal V CCINT - 5%), all delay parameters increase by 3%.
3. Minimum and maximum values for V CCO vary according to the I/O standard selected.
4. Input and output measurement threshold is ~50% of V CCO .
5. Supply voltages may be applied in any order desired.