TPS23753PWR

Part: TPS23753 — Texas Instruments

Type: IEEE 802.3 PoE Interface and Isolated Converter Controller

Description: A combined Power over Ethernet (PoE) powered device (PD) interface and current-mode dc/dc controller optimized for isolated converter designs, supporting IEEE 802.3at Type 1 PD requirements (13 W) with adapter ORing and a robust 100 V, 0.7 Ω hotswap MOSFET.

Operating Conditions:

• Supply voltage: 0–57 V
• Operating temperature: -40 to 125 °C
• V_C to RTN voltage range: 0–18 V
• RTN current: 350 mA (Tj ≤ 125°C)

Absolute Maximum Ratings:

• Max supply voltage (VDD, VDD1, DEN, RTN): 100 V
• Max GATE average sourcing or sinking current: 25 mA RMS
• Max junction temperature: Internally Limited °C

Key Specs:

• Hotswap MOSFET On resistance: 0.7 Ω (typ)
• Hotswap MOSFET Current limit: 450 mA (typ) at V_RTN = 1.5 V, V_DD = 48 V
• PoE Undervoltage lockout threshold (UVLO_R): 35 V (typ) V_DD rising
• PoE UVLO Hysteresis (UVLO_H): 4.55 V (typ)
• Switching frequency: 248 kHz (typ) with R_FRS = 60.4 kΩ
• Max duty cycle: 78.5 % (typ)
• V_C Undervoltage lockout (UVLO 1): 9 V (typ) V_C rising
• V_C UVLO Hysteresis (UVLO H): 3.5 V (typ)
• Thermal Shutdown Turn off temperature: 145 °C (typ)

Features:

• Optimized for Isolated Converters
• Complete PoE Interface
• Adapter ORing Support
• 12 V Adapter Support
• Programmable Frequency with Synch.
• Robust 100 V, 0.7 Ω Hotswap MOSFET
• Small TSSOP 14 Package
• 15 kV / 8 kV System Level ESD Capable
• -40°C to 125°C Junction Temperature Range

Applications:

• IEEE 802.3at Compliant Powered Devices
• VoIP Telephones
• Access Points
• Security Cameras

Package:

• PW (TSSOP-14)

• Optimized for Isolated Converters
• Complete PoE Interface
• Adapter ORing Support
• 12 V Adapter Support
• Programmable Frequency with Synch.
• Robust 100 V, 0.7 Ω Hotswap MOSFET
• Small TSSOP 14 Package
• 15 kV / 8 kV System Level ESD Capable
• -40°C to 125°C Junction Temperature Range
• Design Procedure Application Note - SLVA305
• Adapter ORing Application Note - SLVA306

• IEEE 802.3at Compliant Powered Devices
• VoIP Telephones
• Access Points
• Security Cameras

1

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

Refer to Figure 1 for component reference designators ® CS for example ), and the Electrical Characteristics table for values denoted by reference (VCSMAX for example). Electrical Characteristic values take precedence over any numerical values used in the following sections.

Unless otherwise noted: CS = APD = CTL = RTN, GATE open, RFRS = 60.4 k Ω , RBLNK = 249 k Ω , CVB = CVC = 0.1 μ F, RDEN = 24.9 k Ω , RCLS open, VVDD-VSS = 48 V, VVDD1-RTN = 48 V, 8.5 V ≤ VVC-RTN ≤ 18 V, -40°C ≤ TJ ≤ 125°C

Voltages are with respect to VSS (unless otherwise noted)

Voltage with respect to VSS (unless otherwise noted)

Sources of nearby local PCB heating should be considered during the thermal design. Typical calculations assume that the TPS23753 is the only heat source contributing to the PCB temperature rise. It is possible for a normally operating TPS23753 device to experience an OTSD event if it is excessively heated by a nearby device.