TJA1048TK

Part: TJA1048 — NXP Semiconductors

Type: Dual High-Speed CAN Transceiver

Description: The TJA1048 is a dual high-speed CAN transceiver providing an interface between a CAN protocol controller and the physical two-wire CAN bus, designed for automotive applications with data rates up to 5 Mbit/s, featuring low-current Standby mode with bus wake-up capability and direct interfacing to 3 V to 5 V microcontrollers.

Operating Conditions:

• Supply voltage (VCC): 4.5–5.5 V
• Supply voltage (VIO): 2.8–5.5 V
• Virtual junction temperature: -40 to +150 °C
• Data rates: up to 5 Mbit/s (CAN FD fast phase)

Absolute Maximum Ratings:

• Max supply voltage (VCC): +7 V (on any other pin)
• Max voltage on CANH/CANL pins: +58 V
• Max junction temperature: +150 °C
• Max storage temperature: +150 °C

Key Specs:

• Supply current (Standby mode): 0.5 μA (typ), 5 μA (max)
• Supply current (Normal mode, both channels recessive): 20 mA (max)
• Supply current (Normal mode, both channels dominant): 90 mA (typ), 140 mA (max)
• VCC undervoltage detection: 3.5 V (min), 4.5 V (max)
• VIO undervoltage detection: 1.3 V (min), 2.7 V (max)
• ESD voltage (CANH/CANL, IEC 61000-4-2): 6 kV
• ESD voltage (CANH/CANL, HBM): 6 kV
• Thermal resistance (HVSON14, junction to ambient): 42 K/W

Features:

• Two TJA1042/3 HS-CAN transceivers combined in a single package
• ISO 11898-2:2016 and SAE J2284-1 to SAE J2284-5 compliant
• Low ElectroMagnetic Emission (EME) and high ElectroMagnetic Immunity (EMI)
• VIO input allows for direct interfacing with 3 V to 5 V microcontrollers
• Very low-current Standby mode with host and bus wake-up capability
• High ESD handling capability on the bus pins
• Transmit Data (TXD) dominant time-out function
• Undervoltage detection on pins VCC and VIO
• Thermally protected

Applications:

• HS-CAN networks requiring low-power mode with wake-up capability
• Body Control units
• Gateway units

Package:

• SO14 (14 leads, body width 3.9 mm)
• HVSON14 (14 terminals, body 3 x 4.5 x 0.85 mm)

Table 3. Pin description

• [1] Pins 2 and 5 must be connected together externally in the application. HVSON14 package die supply ground is connected to both the GND pin and the exposed center pad. The GND pin must be soldered to board ground. For enhanced thermal and electrical performance, it is recommended that the exposed center pad also be soldered to board ground.

Values determined for free convection conditions on a JESD51-7 board.

Fig 10. Package outline SOT108 (SO14)