STM32F446RET6

Part: STM32F446xx — STMicroelectronics

Type: ARM Cortex-M4 MCU

Description: 32-bit ARM Cortex-M4 CPU with FPU operating at up to 180 MHz, featuring up to 512 KB Flash, 128 KB SRAM, USB OTG HS/FS, 17 timers, 3 ADCs, and 20 communication interfaces.

Operating Conditions:

• Supply voltage: 1.7 V to 3.6 V
• Operating temperature: -40 to +105 °C
• Max CPU frequency: 180 MHz

Absolute Maximum Ratings:

• Max supply voltage: null
• Max continuous current: null
• Max junction/storage temperature: null

Key Specs:

• Core: ARM 32-bit Cortex-M4 CPU with FPU
• Max CPU frequency: 180 MHz
• Flash memory: Up to 512 KB
• SRAM: 128 KB
• Backup SRAM: Up to 4 KB
• ADC: 3x 12-bit, 2.4 MSPS (up to 7.2 MSPS in triple interleaved mode)
• DAC: 2x 12-bit
• DMIPS: 225 DMIPS / 1.25 DMIPS/MHz (Dhrystone 2.1)
• I/O ports: Up to 114 with interrupt capability, up to 112 5 V-tolerant

Features:

• Adaptive real-time accelerator (ART Accelerator™)
• Flexible external memory controller (SRAM, PSRAM, SDRAM/LPSDR SDRAM, Flash NOR/NAND)
• Dual mode Quad SPI interface
• LCD parallel interface, 8080/6800 modes
• USB 2.0 full-speed device/host/OTG controller with on-chip PHY
• USB 2.0 high-speed/full-speed device/host/OTG controller with dedicated DMA, on-chip full-speed PHY and ULPI
• 8- to 14-bit parallel camera interface up to 54 Mbytes/s
• Low-power modes: Sleep, Stop, Standby
• Debug interfaces: SWD & JTAG, Cortex-M4 Trace Macrocell™

Applications:

• Motor drive and application control
• Medical equipment
• Industrial applications: PLC, inverters, circuit breakers
• Printers, and scanners
• Alarm systems, video intercom, and HVAC
• Home audio appliances

Package:

• LQFP64 (64 pins)
• LQFP100 (100 pins)
• LQFP144 (144 pins)
• WLCSP81 (81 balls)
• UFBGA144 (144 balls)

• Core: ARM ® 32-bit Cortex ® -M4 CPU with FPU, Adaptive real-time accelerator (ART Accelerator™) allowing 0-wait state execution from Fl ash memory, frequency up to 180 MHz, MPU, 225 DMIPS/1.25 DMIPS/MHz (Dhrystone 2.1), and DSP instructions
• Memories
• -512 kB of Flash memory
• -128 KB of SRAM
• -Flexible external memory controller with up to 16-bit data bus: SRAM,PSRAM,SDRAM/LPSDR SDRAM, Flash NOR/NAND memories
• -Dual mode Quad SPI interface
• LCD parallel interface, 8080/6800 modes
• Clock, reset and supply management
• -1.7 V to 3.6 V application supply and I/Os
• -POR, PDR, PVD and BOR
• -4-to-26 MHz crystal oscillator
• -Internal 16 MHz factory-trimmed RC (1% accuracy)
• -32 kHz oscillator for RTC with calibration
• -Internal 32 kHz RC with calibration
• Low power
• -Sleep, Stop and Standby modes
• -VBAT supply for RTC, 20×32 bit backup registers + optional 4 KB backup SRAM
• 3×12-bit, 2.4 MSPS ADC: up to 24 channels and 7.2 MSPS in triple interleaved mode
• 2×12-bit D/A converters
• General-purpose DMA: 16-stream DMA controller with FIFOs and burst support
• Up to 17 timers: 2x watchdog, 1x SysTick timer and up to twelve 16-bit and two 32-bit timers up to 180 MHz, each with up to 4 IC/OC/PWM or pulse counter
• Debug mode
• -SWD & JTAG interfaces
• -Cortex ® -M4 Trace Macrocell™

Reference	Part number
STM32F446xx	STM32F446MC, STM32F446ME, STM32F446RC, STM32F446RE, STM32F446VC, STM32F446VE, STM32F446ZC, STM32F446ZE.

DocID026062 Rev 4

Figure 9. STM32F446xC/xE LQFP64 pinout

Figure 10. STM32F446xC/xE LQFP100 pinout

1. The above figure shows the package top view.

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Figure 11. STM32F446xC LQFP144 pinout

1. The above figure shows the package top view.

Figure 12. STM32F446xC/xE WLCSP81 ballout

Figure 12. STM32F446xC/xE WLCSP81 ballout

1. The above figure shows the package top view.

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Figure 13. STM32F446xC/xE UFBGA144 ballout

1. The above picture shows the package top view.

Table 9. Legend/abbreviations used in the pinout table

Name	Abbreviation	Definition
Pin name	Unless otherwise specified in brackets below the pin name, the pin function during and after reset is the same as the actual pin name	Unless otherwise specified in brackets below the pin name, the pin function during and after reset is the same as the actual pin name
Pin type	S	Supply pin
Pin type	I	Input only pin
Pin type	I/O	Input / output pin
I/O structure	FT	5 V tolerant I/O
I/O structure	TTa	3.3 V tolerant I/O directly connected to ADC
I/O structure	B	Dedicated BOOT0 pin
I/O structure	RST	Bidirectional reset pin with weak pull-up resistor
Notes	Unless otherwise specified by a note, all I/Os are set as floating inputs during and after reset	Unless otherwise specified by a note, all I/Os are set as floating inputs during and after reset
Alternate functions	Functions selected through GPIOx_AFR registers	Functions selected through GPIOx_AFR registers
Additional functions	Functions directly selected/enabled through peripheral registers	Functions directly selected/enabled through peripheral registers

Table 10. STM32F446xx pin and ball descriptions

Pin Number	Pin Number	Pin Number	Pin Number	Pin Number
LQFP64	LQFP100	WLCSP 81	UFBGA144	LQFP144
-	1	D7	A3	1
-	2	D6	A2	2
-	3	A9	B2	3
-	4	-	B3	4

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Table 10. STM32F446xx pin and ball descriptions (continued)

Pin Number	Pin Number	Pin Number	Pin Number	Pin Number
LQFP64	LQFP100	WLCSP 81	UFBGA144	LQFP144
-	5	-	B4	5
1	6	B9	C2	6
2	7	C8	A1	7
3	8	C9	B1	8
4	9	D9	C1	9
-	-	-	C3	10
-	-	-	C4	11
-	-	-	D4	12
-	-	-	E2	13
-	-	-	E3	14
-	-	-	E4	15
-	10	-	D2	16
-	11	-	D3	17
-	-	-	F3	18
-	-	-	F2	19
-	-	-	G3	20
-	-	-	G2	21
-	-	-	G1	22
5	12	E9	D1	23

Table 10. STM32F446xx pin and ball descriptions (continued)

Table 10. STM32F446xx pin and ball descriptions (continued)

Pin Number	Pin Number	Pin Number	Pin Number	Pin Number
LQFP64	LQFP100	WLCSP 81	UFBGA144	LQFP144
6	13	F9	E1	24
7	14	D8	F1	25
8	15	G9	H1	26
9	16	-	H2	27
10	17	E8	H3	28
11	18	F8	H4	29
-	19	H9	-	30
-	-	G8	-	-
12	20	F7	J1	31
-	-	-	K1	-
-	21	H8	L1	32
13	22	-	M1	33
14	23	J9	J2	34
15	24	G7	K2	35
16	25	E7	L2	36

Table 10. STM32F446xx pin and ball descriptions (continued)

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Table 10. STM32F446xx pin and ball descriptions (continued)

Pin Number	Pin Number	Pin Number	Pin Number	Pin Number
LQFP64	LQFP100	WLCSP 81	UFBGA144	LQFP144
17	26	E6	M2	37
18	27	-	G4	38
-	-	J8	H5	-
19	28	-	F4	39
20	29	H7	J3	40
21	30	F6	K3	41
22	31	G6	L3	42
23	32	E5	M3	43
24	33	J7	J4	44
25	34	-	K4	45

Table 10. STM32F446xx pin and ball descriptions (continued)

Table 10. STM32F446xx pin and ball descriptions (continued)

Pin Number	Pin Number	Pin Number	Pin Number	Pin Number
LQFP64	LQFP100	WLCSP 81	UFBGA144	LQFP144
26	35	F5	L4	46
27	36	H6	M4	47
28	37	J6	J5	48
-	-	-	M5	49
-	-	-	L5	50
-	-	-	-	51
-	-	-	G5	52
-	-	-	K5	53
-	-	-	M6	54
-	-	-	L6	55
-	-	-	K6	56
-	-	-	J6	57
-	38	J5	M7	58
-	39	H5	L7	59
-	40	G5	K7	60

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The maximum chip-junction temperature, T J max, in degrees Celsius, may be calculated using the following equation:

T J max = T A max + (P D max x Θ JA )

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK ® packages, depending on their level of environmental compliance. ECOPACK ® specifications, grade definitions and product status are available at: www.st.com . ECOPACK ® is an ST trademark.

Figure 15. LQFP64-10x10 mm 64 pin low-profile quad flat package outline

1. Drawing is not to scale

83

Table 13. LQFP64 - 10 x 10 mm low-profile quad flat package mechanical data

Symbol	millimeters	millimeters	millimeters	inches (1)	inches (1)	inches (1)
Symbol	Min	Typ	Max	Min	Typ	Max
A	-	-	1.600	-	-	0.0630
A1	0.050	-	0.150	0.0020	-	0.0059
A2	1.350	1.400	1.450	0.0531	0.0551	0.0571
b	0.170	0.220	0.270	0.0067	0.0087	0.0106
c	0.090	-	0.200	0.0035	-	0.0079
D	11.800	12.000	12.200	0.4646	0.4724	0.4803
D1	9.800	10.000	10.200	0.3858	0.3937	0.4016
D3	-	7.500	-	-	0.2953	-
E	11.800	12.000	12.200	0.4646	0.4724	0.4803
E1	9.800	10.000	10.200	0.3858	0.3937	0.4016
E3	-	7.500	-	-	0.2953	-
e	-	0.500	-	-	0.0197	-
L	0.450	0.600	0.750	0.0177	0.0236	0.0295
L1	-	1.000	-	-	0.0394	-
K	0°	3.5°	7°	0°	3.5°	7°
ccc	-	-	0.080	-	-	0.0031

Table 13. LQFP64 - 10 x 10 mm low-profile quad flat package mechanical data

Figure 16. LQFP100, 14 x 14 mm 100-pin low-profile quad flat package outline

Table 14. LQPF100, 14 x 14 mm 100-pin low-profile quad flat package mechanical data

Symbol	millimeters	millimeters	millimeters	inches (1)	inches (1)	inches (1)
Symbol	Min	Typ	Max	Min	Typ	Max
A	-	-	1.600	-	-	0.0630
A1	0.050	-	0.150	0.0020	-	0.0059
A2	1.350	1.400	1.450	0.0531	0.0551	0.0571
b	0.170	0.220	0.270	0.0067	0.0087	0.0106
c	0.090	-	0.200	0.0035	-	0.0079
D	15.800	16.000	16.200	0.6220	0.6299	0.6378
D1	13.800	14.000	14.200	0.5433	0.5512	0.5591
D3	-	12.000	-	-	0.4724	-
E	15.800	16.000	16.200	0.6220	0.6299	0.6378

Table 14. LQPF100, 14 x 14 mm 100-pin low-profile quad flat package mechanical data

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Table 14. LQPF100, 14 x 14 mm 100-pin low-profile quad flat package mechanical data (continued)

Symbol	millimeters	millimeters	millimeters	inches (1)	inches (1)	inches (1)
Symbol	Min	Typ	Max	Min	Typ	Max
E1	13.800	14.000	14.200	0.5433	0.5512	0.5591
E3	-	12.000	-	-	0.4724	-
e	-	0.500	-	-	0.0197	-
L	0.450	0.600	0.750	0.0177	0.0236	0.0295
L1	-	1.000	-	-	0.0394	-
k	0°	3.5°	7°	0°	3.5°	7°
ccc	-	-	0.080	-	-	0.0031

1. Values in inches are converted from mm and rounded to 4 decimal digits.
2. Dimensions are expressed in millimeters.
3. Drawing is not to scale.

Figure 17. LQPF100 recommended footprint

Figure 18. LQFP144, 20 x 20 mm, 144-pin low-profile quad flat package outline

1. Drawing is not to scale.

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Table 15. LQFP144, 20 x 20 mm, 144-pin low-profile quad flat package mechanical data

Symbol	millimeters	millimeters	millimeters	inches (1)	inches (1)	inches (1)
Symbol	Min	Typ	Max	Min	Typ	Max
A	-	-	1.600	-	-	0.0630
A1	0.050	-	0.150	0.0020	-	0.0059
A2	1.350	1.400	1.450	0.0531	0.0551	0.0571
b	0.170	0.220	0.270	0.0067	0.0087	0.0106
c	0.090	-	0.200	0.0035	-	0.0079
D	21.800	22.000	22.200	0.8583	0.8661	0.874
D1	19.800	20.000	20.200	0.7795	0.7874	0.7953
D3	-	17.500	-	-	0.689	-
E	21.800	22.000	22.200	0.8583	0.8661	0.8740
E1	19.800	20.000	20.200	0.7795	0.7874	0.7953
E3	-	17.500	-	-	0.6890	-
e	-	0.500	-	-	0.0197	-
L	0.450	0.600	0.750	0.0177	0.0236	0.0295
L1	-	1.000	-	-	0.0394	-
k	0°	3.5°	7°	0°	3.5°	7°
ccc	-	-	0.080	-	-	0.0031

Table 15. LQFP144, 20 x 20 mm, 144-pin low-profile quad flat package mechanical data

Figure 19. LQFP144 recommended footprint

Figure 19. LQFP144 recommended footprint

1. Dimensions are expressed in millimeters.

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Figure 20. UFBGA144, 7x7x0.60 R12x12 P 0.5mm, package outline

1. Dimensions are expressed in millimeters.

Table 16. UFBGA144, 7 x 7 x 0.60 R12x12 P 0.5 mm, 144-pin package mechanical data

Symbol	millimeters	millimeters	millimeters	inches (1)	inches (1)	inches (1)
Symbol	Typ	Min	Max	Typ	Min	Max
A	0.53	0.46	0.6	0.0209	0.0181	0.0236
A1	0.08	0.05	0.11	0.0031	0.002	0.0043
A2	0.45	0.4	0.5	0.0177	0.0157	0.0197
A3	0.13	0.08	0.18	0.0051	0.0031	0.0071
A4	0.32	0.27	0.37	0.0126	0.0106	0.0146
b	0.25	0.2	0.3	0.0098	0.0079	0.0118
D	7	6.95	7.05	0.2756	0.2736	0.2776
D1	5.5	5.45	5.55	0.2165	0.2146	0.2185
E	7	6.95	7.05	0.2756	0.2736	0.2776
E1	5.5	5.45	5.55	0.2165	0.2146	0.2185
e	0.5			0.0197
F	0.75	0.7	0.8	0.0295	0.0276	0.0315
ddd			0.1			0.0039

Table 16. UFBGA144, 7 x 7 x 0.60 R12x12 P 0.5 mm, 144-pin package mechanical data