RT9080-30GJ5

Part: RT9080 / RT9080N from Richtek

Type: Low-Dropout (LDO) Linear Regulator

Description: 1.2–5.5 V input, 600mA low-dropout linear regulator with 2 μA quiescent current, ±2% output accuracy, and over-temperature protection.

Operating Conditions:

• Supply voltage: 1.2V to 5.5V
• Operating temperature: -40°C to 125°C (Junction)
• Output current: 0mA to 600mA
• Fixed Output Voltage: 0.8V to 3.3V

Absolute Maximum Ratings:

• Max supply voltage: 6.5V (VIN, VOUT, SNS, EN to GND)
• Max continuous current: 600mA (output current)
• Max junction/storage temperature: 150°C (Junction), -65°C to 150°C (Storage)

Key Specs:

• Output Voltage Range: 0.8V to 3.3V
• Output Voltage Accuracy: ±2% (ILOAD = 1mA)
• Dropout Voltage: 0.31V (Typ, ILOAD = 600mA, VOUT ≥ 3V)
• Quiescent Current (IQ): 2 μA (Typ, ILOAD = 0mA)
• Shutdown GND Current (ISHDN): 0.1 μA (Typ, VEN = 0V)
• Power Supply Rejection Ratio (PSRR): 75dB (Typ, f = 1kHz)
• Current Limit (ILIM): 610mA (Min)
• Over-Temperature Protection Threshold: 150°C (Typ)

Features:

• 2 μA Ground Current at no Load
• PSRR = 75dB at 1kHz
• Adjustable Output Voltage Available for Specific Applications
• ±2% Output Accuracy
• 600mA (VIN ≥ 2.3V) Output Current
• Low (0.1 μA) Disable Current
• Operating Input Voltage: 1.2V to 5.5V
• Dropout Voltage: 0.31V at 600mA when VOUT ≥ 3V
• Support Fixed Output Voltage: 0.8V to 3.3V
• Stable with Ceramic or Tantalum Capacitor
• Current-Limit Protection
• Over-Temperature Protection
• Available in TSOT-23-5 and ZQFN-4L 1x1 (ZDFN4L 1x1) Packages

Applications:

• Portable, Battery Powered Equipment
• Ultra Low Power Microcontrollers
• Notebook Computers

Package:

• TSOT-23-5
• ZQFN-4L 1x1 (ZDFN-4L 1x1)

• ⚫ 2 A Ground Current at no Load
• ⚫ PSRR = 75dB at 1kHz
• ⚫ Adjustable Output Voltage Available for Specific Applications
• ⚫ 2% Output Accuracy
• ⚫ 600mA (VIN 2.3V) Output Current
• ⚫ Low (0.1 A) Disable Current
• ⚫ Operating Input Voltage: 1.2V to 5.5V
• ⚫ Dropout Voltage: 0.31V at 600mA when VOUT 3V
• ⚫ Support Fixed Output Voltage: 0.8V to 3.3V
• ⚫ Stable with Ceramic or Tantalum Capacitor
• ⚫ Current-Limit Protection
• ⚫ Over-Temperature Protection
• ⚫ Available in TSOT-23-5 and ZQFN-4L 1x1 (ZDFN4L 1x1) Packages

• ⚫ Portable, Battery Powered Equipment
• ⚫ Ultra Low Power Microcontrollers
• ⚫ Notebook Computers

(VVOUT + 1 < VIN < 5.5V, TA = 25 C, unless otherwise specified.)

Note 7 . The specification is tested at wafer stage and guaranteed by design after assembly.

6

For continuous operation, do not exceed absolute maximum junction temperature. The maximum power dissipation depends on the thermal resistance of the IC package, PCB layout, rate of surrounding airflow, and difference between junction and ambient temperature. The maximum power dissipation can be calculated by the f ollowing formula:

PD(MAX) = (TJ(MAX) -TA)/ JA

where TJ(MAX) is the maximum junction temperature, TA is the ambient temperature, and JA is the junction to ambient thermal resistance.

For recommended operating condition specifications, the maximum junction temperature is 125 C and TA is the ambient temperature. The junction to ambient thermal resistance, θJA(EVB), is highly package dependent. For TSOT-23-5 package, the thermal resistance, θJA(EVB), is 100.7 C/W on a standard JEDEC 51-7 four-layer thermal test board. For ZQFN-4L 1x1 (ZDFN-4L 1x1) package, the thermal resistance, θJA(EVB), is 236 C/W on a two-layer Richtek evaluation board. The maximum power dissipation at TA = 25 C can be calculated by the following formula:

PD(MAX) = (125 C -25 C)/(100.7 C/W) = 0.99W for TSOT-23-5 package

PD(MAX) = (125 C -25 C)/(236 C/W) = 0.42W for ZQFN-4L 1x1 (ZDFN-4L 1x1) package

The maximum power dissipation depends on the operating ambient temperature for fixed TJ(MAX) and thermal resistance, θJA(EVB). The derating curves in Figure 6 allow the designer to see the effect of rising ambient temperature on the maximum power dissipation.

Figure 6. Derating Curve of Maximum Power Dissipation