Part: LP5907 from Texas Instruments

Type: Low-Noise, Low-IQ LDO

Description: The LP5907 is a 2.2–5.5 V input, 250 mA low-noise LDO with high PSRR, low quiescent current, and low output voltage noise of < 6.5 μV RMS.

Operating Conditions:

• Supply voltage: 2.2–5.5 V
• Operating temperature: -40 to 125 °C (junction)
• Output voltage range: 1.2–4.5 V
• Max output current: 250 mA

Absolute Maximum Ratings:

• Max supply voltage: 6 V
• Max continuous current: 250 mA (from recommended operating conditions)
• Max junction/storage temperature: 150 °C

Key Specs:

• Output voltage tolerance: ±2%
• Maximum output current: 250 mA
• Quiescent current (enabled, 0mA load): 12 μA (typ)
• Dropout voltage: 120 mV (typ) at I_OUT = 250mA (DSBGA packages)
• Power-supply rejection ratio (PSRR): 82 dB (typ) at 1kHz, I_OUT = 20mA
• Output noise voltage: 6.5 μV_RMS (typ) over BW = 10Hz to 100kHz
• Thermal shutdown temperature: 160 °C (typ)
• Enable high input threshold: 1.2 V (min)

Features:

• Stable with 1-μF ceramic input and output capacitors
• No noise bypass capacitor required
• Remote output capacitor placement
• Thermal-overload and short-circuit protection
• Low dropout: 120mV (typical)

Applications:

• Smartphones
• Tablets
• Communications equipment
• Digital still cameras
• Factory automation

Package:

• DSBGA, 4-pin (YKE, YKG, YKM, YCR)
• SOT-23, 5-pin (DBV)
• X2SON, 4-pin (DQN)

• For a more updated portfolio device, see the TPS7A20
• Input voltage range: 2.2V to 5.5V • Output voltage range: 1.2V to 4.5V
• Stable with 1-μF ceramic input and output capacitors
• No noise bypass capacitor required
• Remote output capacitor placement
• Thermal-overload and short-circuit protection
• Operating junction temperature: –40°C to 125°C
• Low output voltage noise: < 6.5μVRMS
• PSRR: 82dB at 1kHz
• Output voltage tolerance: ±2%
• Very low IQ (enabled): 12μA
• Low dropout: 120mV (typical)
• Create a custom design using the LP5907 with the WEBENCH® Power Designer

• Smartphones
• Tablets
• Communications equipment
• Digital still cameras
• Factory automation

LP5907MFX-3.3/NOPB Pinout

Package: SOT-23-5

Notes:

• Pin 4 is No Connect (N/C) in the SOT-23-5 package variant.
• The LP5907MFX-3.3/NOPB is a fixed 3.3V output LDO regulator.
• Pin numbering extracted from the SOT-23 package diagram (Figure 4-3, top view).

V_IN = V_OUT(NOM) + 1V, V_EN = 1.2V, I_OUT = 1 mA, C_IN = 1 μ F, and C_OUT = 1 μ F (unless otherwise noted)^{(1) (2) (3)}

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over operating free-air temperature range (unless otherwise noted)(1) (3)

• (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under the Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
• (2) Abs Max VOUT is the lessor of VIN + 0.3V, or 6V.
• (3) All voltages are with respect to the GND pin.
• (4) Internal thermal shutdown circuitry protects the device from permanent damage.

over operating free-air temperature range (unless otherwise noted)(1) (2)

• (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
• (2) All voltages are with respect to the GND pin.
• (3) In applications where high power dissipation and poor package thermal resistance is present, the maximum ambient temperature can need to be derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP = 125°C), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to ambient thermal resistance of the device or package in the application (RθJA), as given by the following equation: TA-MAX = TJ-MAX-OP – (RθJA × PD-MAX). See the Application and Implementation section.

Product Folder Links: LP5907

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⁽¹⁾ For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application note.

The LP5907 is designed to meet the requirements of RF and analog circuits, by providing low noise, high PSRR, low quiescent current, and low line or load transient response figures. The device offers excellent noise performance without the need for a noise bypass capacitor and is stable with input and output capacitors with a value of 1μF. The LP5907 delivers this performance in industry standard packages such as DSBGA, X2SON, and SOT-23 which, for this device, are specified with an operating junction temperature (T^J ) of –40°C to 125°C.

• (1) For more information, see the Mechanical, Packaging, and Orderable Information.
• (2) The package size (length × width) is a nominal value and includes pins, where applicable.