RT9080-33GJ5
RT9080
Manufacturer
Richtek USA Inc.
Overview
Part: RT9080 from Richtek Technology Corporation
Type: Low-Dropout Linear Regulator
Key Specs:
- Input Voltage Range: 1.2V to 5.5V
- Maximum Output Current: 600mA
- Quiescent Current (no load): 2A
- Disable Current: 0.1A
- Output Accuracy: 2%
- PSRR: 75dB at 1kHz
- Dropout Voltage: 0.31V at 600mA (when VOUT 3V)
- Supported Fixed Output Voltage Range: 0.8V to 3.3V
- Operating Junction Temperature Range: -40C to 125C
- Operating Ambient Temperature Range: -40C to 85C
Features:
- 2A Ground Current at no Load
- PSRR = 75dB at 1kHz
- Adjustable Output Voltage Available for Specific Applications
- 2% Output Accuracy
- 600mA (VIN 2.3V) Output Current
- Low (0.1A) Disable Current
- Operating Input Voltage: 1.2V to 5.5V
- Dropout Voltage: 0.31V at 600mA when VOUT 3V
- Support Fixed Output Voltage: 0.8V to 3.3V
- Stable with Ceramic or Tantalum Capacitor
- Current-Limit Protection
- Over-Temperature Protection
- Available in TSOT-23-5 and ZQFN-4L 1x1 (ZDFN-4L 1x1) Packages
Applications:
- Portable, Battery Powered Equipment
- Ultra Low Power Microcontrollers
- Notebook Computers
Package:
- TSOT-23-5
- ZQFN-4L 1x1 (ZDFN-4L 1x1)
Features
- ⚫ 2A Ground Current at no Load
- ⚫ PSRR = 75dB at 1kHz
- ⚫ Adjustable Output Voltage Available for Specific Applications
- ⚫ 2% Output Accuracy
- ⚫ 600mA (VIN 2.3V) Output Current
- ⚫ Low (0.1A) Disable Current
- ⚫ Operating Input Voltage: 1.2V to 5.5V
- ⚫ Dropout Voltage: 0.31V at 600mA when VOUT 3V
- ⚫ Support Fixed Output Voltage: 0.8V to 3.3V
- ⚫ Stable with Ceramic or Tantalum Capacitor
- ⚫ Current-Limit Protection
- ⚫ Over-Temperature Protection
- ⚫ Available in TSOT-23-5 and ZQFN-4L 1x1 (ZDFN-4L 1x1) Packages
Applications
- ⚫ Portable, Battery Powered Equipment
- ⚫ Ultra Low Power Microcontrollers
- ⚫ Notebook Computers
Pin Configuration
ZQFN-4L 1x1 (ZDFN-4L 1x1)
Electrical Characteristics
(VVOUT + 1 < VIN < 5.5V, TA = 25°C, unless otherwise specified.)
| Parameter | Symbol | Test | Condi | ions | Min | Typ | Max | Unit |
|---|---|---|---|---|---|---|---|---|
| Output Voltage | VVOUT | 0.8 | 3.3 | V | ||||
| Output Voltage Accuracy | VVOUT_ACC | ILOAD = 1mA | -2 | 2 | % | |||
| $0.8V \le VVOUT <$ | 1.05V | (TSOT-23-5) | ŀ | 1.05 | 1.33 | |||
| $0.8V \leq VVOUT <$ | 1.05V | (ZQFN-4L 1x1) | 1.05 | 1.63 | ||||
| 1.05V ≤ VVOUT | < 1.2V | 0.8 | 1.13 | |||||
| Dropout Voltage | $1.2V \le VVOUT <$ | 1.5V | 0.71 | 1.03 | ||||
| (ILOAD = 600mA) | VDROP | $1.5V \le VVOUT <$ | 1.8V | 0.57 | 0.93 | V | ||
| ( Note 6 ) | $1.8V \le VVOUT <$ | 2.1V | 0.57 | 0.83 | ||||
| 2.1V ≤ VVOUT < | 0.41 | 0.73 | ||||||
| 2.5V ≤ VVOUT < 3V | 0.36 | 0.63 | ||||||
| $3V \leq VVOUT$ | 0.31 | 0.53 | ||||||
| Quiescent Current | IQ | ILOAD = 0mA, VVOUT $\leq$ 5.5V VVIN $\geq$ VVOUT + VDROP | 2 | 4 | μΑ | |||
| Shutdown GND Current | leven | VEN = 0V | - | 0.1 | 0.5 | μΑ | ||
| ( Note 7 ) | ISHDN | VEN = 0V, VVOL | JT = 0\ | ' | 0.1 | 0.5 | μΑ | |
| EN Input Current | IEN | VEN = 5.5V | - | 0.1 | μΑ | |||
| 1.2V ≤ VVIN < 1.5V | 1 | 0.3 | 0.6 | |||||
| Line Regulation | VLINE_REG | ILOAD = 1mA | 1.5V ≤ VVIN < 1.8V | 0.15 | 0.3 | % | ||
| 1.8V | ≤ VVIN < 5.5V | 0.13 | 0.35 | |||||
| Load Regulation | VLOAD_REG | 1mA < ILOAD < 6 | 600mA | 0.5 | 1 | % | ||
| Power Supply Rejection Ratio | PSRR | VVIN = 3V, ILOAI COUT = 1μF, VV | 75 | dB | ||||
| COUT = 1μF, | VVOUT = 0.8V | 26 | ||||||
| ., | ILOAD = 150mA, | VVOUT = 1.2V | 37 | |||||
| Output Voltage Noise | Vn | BW = 10Hz to $100kHz$ , | VVOUT = 1.8V | 39 | μVRMS | |||
| VVIN = VVOUT + | · 1V | VVOUT = 3.3V | 42 | |||||
| Current Limit | ILIM | VVOUT = 90%V0 | OUT(No | rmal) | 610 | 1100 | - | mA |
| EN Input Voltage Rising Threshold | VEN_R | VVIN = 5V | 0.9 | V | ||||
| EN Input Voltage Falling Threshold | VEN_F | VVIN = 5V | 0.4 | V | ||||
| Over-Temperature Protection Threshold | TOTP | ILOAD = 30mA, VVIN ≥ 1.5V | 150 | °C | ||||
| Over-Temperature Protection Hysteresis | TOTP_HYS | 20 | °C | |||||
| Discharge Resistor | RDISCHG | EN = 0V, VVOU | Γ = 0.1 | V | 80 | Ω |
Note 6. The dropout voltage is defined as VVIN – VVOUT when VVOUT is 98% of the normal value of VVOUT.
Note 7. The specification is tested at wafer stage and guaranteed by design after assembly.
Absolute Maximum Ratings
(Note 1)
- ⚫ VIN, VOUT, SNS, EN to GND ------------------------------------------------------------------------------------------- −0.3V to 6.5V ⚫ VOUT to VIN-------------------------------------------------------------------------------------------------------------------- −6.5V to 0.3V ⚫ Lead Temperature (Soldering, 10 sec.) ------------------------------------------------------------------------------ 260C ⚫ Junction Temperature-------------------------------------------------------------------------------------------------------- 150C
- ⚫ Storage Temperature Range --------------------------------------------------------------------------------------------- −65C to 150C
Note 1. Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions may affect device reliability.
Recommended Operating Conditions
(Note 3)
⚫ Input Voltage, VIN ------------------------------------------------------------------------------------------------------------ 1.2V to 5.5V ⚫ Junction Temperature Range--------------------------------------------------------------------------------------------- −40C to 125C ⚫ Ambient Temperature Range--------------------------------------------------------------------------------------------- −40C to 85C
Note 3. The device is not guaranteed to function outside its operating conditions.
Thermal Information
(Note 4 and Note 5)
| Thermal Parameter | TSOT-23-5 | ZQFN-4L 1x1 (ZDFN-4L 1x1) | Unit | |
|---|---|---|---|---|
| JA | Junction-to-ambient thermal resistance (JEDEC standard) | 189.4 | 291.4 | C/W |
| JC(Top) | Junction-to-case (top) thermal resistance | 75.9 | 163 | C/W |
| JC(Bottom) | Junction-to-case (bottom) thermal resistance | 55.8 | 90.7 | C/W |
| JA(EVB) | Junction-to-ambient thermal resistance (specific EVB) | 100.7 | 236 | C/W |
| JC(Top) | Junction-to-top characterization parameter | 21.6 | 52.3 | C/W |
| JB | Junction-to-board characterization parameter | 67.2 | 189.1 | C/W |
Note 4. For more information about thermal parameter, see the Application and Definition of Thermal Resistances report, AN061.
Note 5. JA (EVB), JC(Top), and JB are measured on a high effective-thermal-conductivity four-layer test board which is in size of 70mm x 50mm; furthermore, all layers with 1 oz. Cu. Thermal resistance/parameter values may vary depending on the PCB material, layout, and test environmental conditions.
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