MPQ4572

Part: MP6603GV-P — Monolithic Power Systems (MPS)

Type: Thermal design application note / webinar slides (not a component datasheet)

Description: The supplied document is an MPS webinar, "Understanding Datasheet Thermal Parameters and IC Junction Temperatures". It explains θJA, θJC, ΨJT and ΨJB, using the MPQ4572 DC switching power IC as the worked example. It contains no electrical specifications for MP6603GV-P.

Operating Conditions:

• Supply voltage: not applicable
• Operating temperature: not applicable

Absolute Maximum Ratings:

• No absolute maximum ratings for MP6603GV-P are given in this document

Key Specs:

• MPQ4572 θJA on a 4-layer JESD51-7 PCB (114.3 mm x 76.2 mm): 60 K/W
• MPQ4572 θJA on a 4-layer, 2 oz. copper MPS test PCB (8.9 cm x 8.9 cm): 45 K/W
• Example from the webinar: 1.1 W dissipation on the EVQ4572-QB-00A board at 25 °C gives an estimated TJ of 91 °C using θJA = 60 K/W
• Typical ΨJT: 0.8 to 2.0 °C/W
• TJ = ΨJT × PDEVICE + TSURFACE
• TJ = θJC × HeatflowJC + TC
• Example thermal conductivities: copper 388, silicon 180, mold compound 1, FR4 through-plane 0.2 to 0.4 W/(m·K)

Features:

• Electrical-to-thermal analogy tables and equations
• Explains why θJA and θJC are valid only for their defined test PCB
• Explains using ΨJT and ΨJB to estimate junction temperature on custom boards
• Thermal network calculation overview
• PCB layout recommendations for heat dissipation: short heat paths, large copper areas, thermal vias under pads, no thermal reliefs on SMT pads

Applications:

• Thermal design and junction temperature estimation for power ICs
• Automotive (AEC-Q100) power management designs

Package:

• No package information for MP6603GV-P is given

May 26 & 27, 2021

Ralf Ohmberger, Sr. Applications Engineer, MPS

For Customer Use Only