MCP1700-1802E/TO

Part: MCP1700-3302E — Microchip Technology

Type: Low Quiescent Current CMOS LDO Voltage Regulator

Description: 2.3–6.0 V input, 250 mA CMOS LDO with 1.6 μA typical quiescent current, 178 mV typical dropout at 250 mA (VOUT = 2.8 V), and ±0.4% typical output accuracy. The -3302 suffix denotes a 3.3 V output option.

Operating Conditions:

• Supply voltage: 2.3–6.0 V
• Operating junction temperature: -40 to +125 °C (specified ambient range -40 to +125 °C)
• Output voltage range: 1.2–5.0 V; output current 250 mA for VR ≥ 2.5 V, 200 mA for VR < 2.5 V

Absolute Maximum Ratings:

• Max supply voltage (VDD): +6.5 V
• Max junction temperature: 150 °C
• Storage temperature: -65 to +150 °C
• All inputs and outputs w.r.t. VSS: (VSS - 0.3 V) to (VIN + 0.3 V)
• ESD protection (HBM; MM): 4 kV; 400 V

Key Specs:

• Input quiescent current: 1.6 μA typ, 4 μA max (IL = 0 mA, VIN = VR + 1 V)
• Output voltage accuracy: VR ± 0.4% typ; ±2.0% max at 25 °C, ±3.0% max over -40 to +125 °C junction
• Dropout voltage (VR ≥ 2.5 V): 178 mV typ, 350 mV max at IL = 250 mA
• Line regulation: ±0.75 %/V typ (±1.0 %/V max), (VR + 1) V ≤ VIN ≤ 6 V
• Load regulation: ±1.0% typ (±1.5% max), IL = 0.1 mA to 250 mA (VR ≥ 2.5 V)
• Output short-circuit current: 408 mA typ (peak, measured 10 ms after short applied)
• PSRR: 44 dB typ at 100 Hz, IL = 50 mA, VR = 1.2 V
• Output noise: 3 μV/√Hz typ at 1 kHz, IL = 100 mA
• Output temperature coefficient: 50 ppm/°C typ
• Thermal shutdown: 140 °C typ

Features:

• AEC-Q100 qualified and PPAP capable
• Stable with 1.0 μF ceramic output capacitor
• Short-circuit protection
• Overtemperature protection
• Standard output voltages: 1.2 V, 1.8 V, 2.5 V, 2.8 V, 2.9 V, 3.0 V, 3.3 V, 5.0 V

Applications:

• Battery-powered devices and alarm circuits
• Smoke and CO2 detectors
• Pagers and cellular phones
• Smart battery packs
• Low quiescent current voltage reference
• PDAs and digital cameras
• Microcontroller power

Package:

• SOT-23
• SOT-89
• TO-92
• 2x2 DFN-6

• AEC-Q100 Qualified and PPAP Capable
• 1.6 μA Typical Quiescent Current
• Input Operating Voltage Range: 2.3V to 6.0V
• Output Voltage Range: 1.2V to 5.0V
• 250 mA Output Current for Output Voltages 2.5V
• 200 mA Output Current for Output Voltages < 2.5V
• Low Dropout (LDO) Voltage
• -178 mV Typical @ 250 mA for V OUT = 2.8V
• 0.4% Typical Output Voltage Tolerance
• Standard Output Voltage Options:
• -1.2V, 1.8V, 2.5V, 2.8V, 2.9V, 3.0V, 3.3V, 5.0V
• Stable with 1.0 μF Ceramic Output Capacitor
• Short Circuit Protection
• Overtemperature Protection

• Battery-Powered Devices
• Battery-Powered Alarm Circuits
• Smoke Detectors
• CO2 Detectors
• Pagers and Cellular Phones
• Smart Battery Packs
• Low Quiescent Current Voltage Reference
• PDAs
• Digital Cameras
• Microcontroller Power

The descriptions of the pins are listed in Table 3-1.

TABLE 3-1: PIN FUNCTION TABLE

Electrical Characteristics: Unless otherwise specified, all limits are established for V IN = V R + 1V, I LOAD = 100 μA, COUT = 1 μF (X7R), C IN = 1 μF (X7R), T A = +25°C. Boldface type applies for junction temperatures, T (Note 6) of -40°C to +125°C.

J

Note 1: The minimum V IN must meet two conditions: V IN 2.3V and V IN VR + 3.0% VDROPOUT .

• 2: VR is the nominal regulator output voltage. For example: V R = 1.2V, 1.5V, 1.8V, 2.5V, 2.8V, 2.9V, 3.0V, 3.3V, 4.0V, 5.0V. The input voltage V IN = V R + 1.0V; I OUT = 100 μA.
• 3: TCVOUT = (V OUT-HIGH - V OUT-LOW ) *10 6 / (V R * Temperature), V OUT-HIGH = highest voltage measured over the temperature range. V OUT-LOW = lowest voltage measured over the temperature range.
• 4: Load regulation is measured at a constant junction temperature using low duty cycle pulse testing. Changes in output voltage due to heating effects are determined using thermal regulation specification TCV OUT .
• 5: Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its measured value with a V R + 1V differential applied.
• 6: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction to air (i.e. T A , T J , JA ). Exceeding the maximum allowable power dissipation will cause the device operating junction temperature to exceed the maximum 150°C rating. Sustained junction temperatures above 150°C can impact the device reliability.
• 7: The junction temperature is approximated by soaking the device under test at an ambient temperature equal to the desired Junction temperature. The test time is small enough such that the rise in the Junction temperature over the ambient temperature is not significant.
• † Notice: Stresses above those listed under 'Maximum Ratings' may cause permanent damage to the device. This is a stress rating only, and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability.

There is an internal electrical connection between the Exposed Thermal Pad (EP) and the GND pin; they must be connected to the same potential on the Printed Circuit Board (PCB).