MCP1700

Part: MCP1700 — Microchip Technology Inc.

Type: Low Dropout (LDO) Voltage Regulator

Description: CMOS low dropout (LDO) voltage regulator family delivering up to 250 mA of current while consuming only 1.6 μA typical quiescent current, operating from 2.3V to 6.0V input, and offering output voltages from 1.2V to 5.0V.

Operating Conditions:

• Supply voltage: 2.3V to 6.0V
• Operating temperature: -40°C to +125°C (Junction Temperature)
• Output voltage range: 1.2V to 5.0V

Absolute Maximum Ratings:

• Max supply voltage: +6.5V (V DD)
• Max continuous current: Internally Limited (Peak Output Current)
• Max junction/storage temperature: 150°C (Maximum Junction Temperature), -65°C to +150°C (Storage Temperature)

Key Specs:

• Input Quiescent Current: 1.6 μA (Typ), 4 μA (Max) at I L = 0 mA, V IN = V R + 1V
• Maximum Output Current: 250 mA (for V R ≥ 2.5V), 200 mA (for V R < 2.5V)
• Output Voltage Regulation: V R ± 0.4% (Typ) at T A = +25°C, V R ± 3.0% (Max) for T J = -40°C to +125°C
• Dropout Voltage: 178 mV (Typ) at I L = 250 mA for V R ≥ 2.5V; 150 mV (Typ) at I L = 200 mA for V R < 2.5V
• Line Regulation: ±0.75 %/V (Typ) for (V R + 1)V ≤ V IN ≤ 6V
• Load Regulation: ±1.0 % (Typ) for I L = 0.1 mA to 250 mA (V R ≥ 2.5V) or 0.1 mA to 200 mA (V R < 2.5V)
• Output Noise: 3 μV/(Hz) 1/2 (Typ) at I L = 100 mA, f = 1 kHz
• Power Supply Ripple Rejection Ratio: 44 dB (Typ) at f = 100 Hz, I L = 50 mA, V R = 1.2V

Features:

• AEC-Q100 Qualified and PPAP Capable
• 1.6 μA Typical Quiescent Current
• Input Operating Voltage Range: 2.3V to 6.0V
• Output Voltage Range: 1.2V to 5.0V
• Stable with 1.0 μF Ceramic Output Capacitor
• Short Circuit Protection
• Overtemperature Protection

Applications:

• Battery-Powered Devices
• Battery-Powered Alarm Circuits
• Smoke Detectors
• CO2 Detectors
• Pagers and Cellular Phones
• Smart Battery Packs
• Low Quiescent Current Voltage Reference
• PDAs
• Digital Cameras
• Microcontroller Power

Package:

• SOT-23
• SOT-89
• TO-92
• 2x2 DFN-6

• AEC-Q100 Qualified and PPAP Capable
• 1.6 μA Typical Quiescent Current
• Input Operating Voltage Range: 2.3V to 6.0V
• Output Voltage Range: 1.2V to 5.0V
• 250 mA Output Current for Output Voltages 2.5V
• 200 mA Output Current for Output Voltages < 2.5V
• Low Dropout (LDO) Voltage
• -178 mV Typical @ 250 mA for V OUT = 2.8V
• 0.4% Typical Output Voltage Tolerance
• Standard Output Voltage Options:
• -1.2V, 1.8V, 2.5V, 2.8V, 2.9V, 3.0V, 3.3V, 5.0V
• Stable with 1.0 μF Ceramic Output Capacitor
• Short Circuit Protection
• Overtemperature Protection

• Battery-Powered Devices
• Battery-Powered Alarm Circuits
• Smoke Detectors
• CO2 Detectors
• Pagers and Cellular Phones
• Smart Battery Packs
• Low Quiescent Current Voltage Reference
• PDAs
• Digital Cameras
• Microcontroller Power

The descriptions of the pins are listed in Table 3-1.

TABLE 3-1: PIN FUNCTION TABLE

Electrical Characteristics: Unless otherwise specified, all limits are established for V IN = V R + 1V, I LOAD = 100 μA, COUT = 1 μF (X7R), C IN = 1 μF (X7R), T A = +25°C. Boldface type applies for junction temperatures, T (Note 6) of -40°C to +125°C.

J

Note 1: The minimum V IN must meet two conditions: V IN 2.3V and V IN VR + 3.0% VDROPOUT .

• 2: VR is the nominal regulator output voltage. For example: V R = 1.2V, 1.5V, 1.8V, 2.5V, 2.8V, 2.9V, 3.0V, 3.3V, 4.0V, 5.0V. The input voltage V IN = V R + 1.0V; I OUT = 100 μA.
• 3: TCVOUT = (V OUT-HIGH - V OUT-LOW ) *10 6 / (V R * Temperature), V OUT-HIGH = highest voltage measured over the temperature range. V OUT-LOW = lowest voltage measured over the temperature range.
• 4: Load regulation is measured at a constant junction temperature using low duty cycle pulse testing. Changes in output voltage due to heating effects are determined using thermal regulation specification TCV OUT .
• 5: Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its measured value with a V R + 1V differential applied.
• 6: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction to air (i.e. T A , T J , JA ). Exceeding the maximum allowable power dissipation will cause the device operating junction temperature to exceed the maximum 150°C rating. Sustained junction temperatures above 150°C can impact the device reliability.
• 7: The junction temperature is approximated by soaking the device under test at an ambient temperature equal to the desired Junction temperature. The test time is small enough such that the rise in the Junction temperature over the ambient temperature is not significant.
• † Notice: Stresses above those listed under 'Maximum Ratings' may cause permanent damage to the device. This is a stress rating only, and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability.

• All inputs and outputs w.r.t. ......... (V SS - 0.3V) to (V IN + 0.3V)
• Peak Output Current ....................................Internally Limited
• Storage Temperature ....................................-65°C to +150°C
• Maximum Junction Temperature...................................150°C
• Operating Junction Temperature...................-40°C to +125°C
• ESD protection on all pins (HBM;MM) 4 kV; 400V

There is an internal electrical connection between the Exposed Thermal Pad (EP) and the GND pin; they must be connected to the same potential on the Printed Circuit Board (PCB).