MAX5394

Part: MAX5394 — Maxim Integrated

Type: Single, 256-Tap Volatile, SPI, Low-Voltage Linear Taper Digital Potentiometer

Description: A single, 256-tap volatile digital potentiometer offering 10kΩ, 50kΩ, and 100kΩ end-to-end resistance values, operating from a 1.7V to 5.5V supply with a SPI serial interface and an automotive temperature range of -40°C to +125°C.

Operating Conditions:

• Supply voltage: 1.7V to 5.5V
• Operating temperature: -40°C to +125°C
• H, W, L operating voltage: 0V to 5.25V (charge pump enabled)

Absolute Maximum Ratings:

• Max supply voltage: +6V
• Max continuous current into H, W, L: 5mA (MAX5394L)
• Max junction temperature: +150°C

Key Specs:

• Resolution: 256 Taps
• End-to-End Resistance: 10kΩ, 50kΩ, 100kΩ
• Integral Nonlinearity (INL): ±1.0 LSB (max)
• Differential Nonlinearity (DNL): ±0.5 LSB (max)
• End-to-End Resistor Tempco: 50 ppm/°C (typ)
• Wiper Resistance (R_WL): 25 Ω (typ, charge pump enabled)
• Supply Current (charge pump disabled): 1 μA (typ)
• SPI SCLK Frequency (2.6V < VDD < 5.5V): 50 MHz (max)

Features:

• Single Linear Taper 256-Tap Positions
• 10kΩ, 50kΩ, and 100kΩ End-to-End Resistance
• 1.7V to 5.5V Extended Single Supply
• 0V to 5.25V H, W, L Operating Voltage Independent of VDD
• 1μA (typ) Supply Current in Low-Power Mode
• ±1.0 LSB INL, ±0.5 LSB DNL (max) Wiper Accuracy
• Power-On Sets Wiper to Midscale
• 50ppm/°C End-to-End Temperature Coefficient
• SPI-Compatible Serial Interface

Applications:

• Portable Electronics
• System Calibration
• Battery-Powered Systems
• Automotive Electronics
• Mechanical Potentiometer Replacement

Package:

• 8-pin TDFN (2mm x 2mm)

• S Single Linear Taper 256-Tap Positions
• S 10k I , 50k I , and 100k I End-to-End Resistance
• S 1.7V to 5.5V Extended Single Supply
• S 0 to 5.25V H, W, L Operating Voltage Independent of V DD
• S 1μA (typ) Supply Current in Low-Power Mode
• S ±1.0 LSB INL, ±0.5 LSB DNL (max) Wiper Accuracy
• S Power-On Sets Wiper to Midscale
• S 50ppm/ N C End-to-End Temperature Coefficient
• S 5ppm/ N C Ratiometric Temperature Coefficient
• S -40 N C to +125 N C Operating Temperature Range
• S 2mm x 2mm, 8-Pin TDFN Package
• S SPI-Compatible Serial Interface

MAX5394 Pinout

Package: TDFN-8

Notes

• EP (Exposed Pad): Internally connected to GND; should be soldered to ground plane for thermal management.
• Pin 1 (I) and Pin 4 (DIN) are both data input pins; refer to device datasheet for specific protocol details.
• This is an 8-pin TDFN package with integrated digital potentiometer functionality.

(V DD = 1.7V to 5.5V, V H = V DD , V L = GND, T A = -40°C to +125°C, unless otherwise noted. Typical values are at V DD = 1.8V, T A = +25°C.) (Note 2)

(All voltages referenced to GND.)

V DD .........................................................................-0.3V to +6V

H, W, L (charge pump enabled) .........................-0.3V to +5.5V

H, W, L (charge pump disabled) ................ -0.3V to the lower of

(V DD + 0.3V) or +6V

All Other Pins .........................................................-0.3V to +6V

Continuous Current into H, W, and L

MAX5394L .........................................................................5mA

MAX5394M ........................................................................2mA

MAX5394N ........................................................................1mA

Maximum Current into Any Input .......................................50mA

Continuous Power Dissipation (T A = +70 N C)

TDFN (derate 11.9mW/

N

C above +70

N

C) .................953.5mW

Operating Temperature Range ....................... -40

N

C to +125

N

C

Storage Temperature Range ........................... -65

N

C to + 150

N

C

Junction Temperature .....................................................+150

N

C

Lead Temperature (soldering, 10s) .............................. + 300

N

C

Soldering Temperature (reflow) .....................................+260

N

C

Stresses beyond those listed under 'Absolute Maximum Ratings' may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.

TDFN

Junction-to-Ambient Thermal Resistance ( q JA ) .......83.9°C/W Junction-to-Case Thermal Resistance ( q JC ) ............37.0°C/W

Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial .

For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages . Note that a '+', '#', or '-' in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status.