MAX31865ATP
RTD-to-Digital ConverterThe MAX31865ATP is a rtd-to-digital converter from Analog Devices. View the full MAX31865ATP datasheet below including key specifications, electrical characteristics, absolute maximum ratings.
MAX31865ATP shares its datasheet with MAX31865, whose page lists every part number it covers.
Official MAX31865ATP datasheet (PDF) — the source this page was extracted from.
MAX31865ATP Key Specifications
| Parameter | Value |
|---|---|
| Interface | SPI (modes 1 and 3), up to 5MHz |
| Bias Voltage | 1.95V to 2.06V (2.00V typ) |
| ADC Resolution | 15 bits |
| Supported RTDs | 100 Ω to 1kΩ at 0°C (PT100 to PT1000) |
| Total Accuracy | 0.5°C max (0.05% of full scale) |
| Conversion Time | 21ms max (continuous, 50Hz notch) |
| Input Protection | ±45V |
| Reference Resistor | 350Ω to 10kΩ |
| Sensor Connections | 2-, 3-, and 4-wire |
| ESD Protection (HBM) | ±2kV |
| Supply Voltage (VDD) | 3.0V to 3.6V |
| Operating Temperature | -40°C to +125°C |
| Temperature Resolution | 0.03125°C (nominal) |
| 50/60Hz Noise Rejection | 82dB typ |
| Digital Supply Voltage (DVDD) | 3.0V to 3.6V |
| Supply Current (Active Conversion) | 2mA typ, 3.5mA max |
MAX31865ATP Overview
Part: MAX31865 — Maxim Integrated
Type: Resistance-to-Digital Converter
Description: 15-bit precision delta-sigma ADC resistance-to-digital converter optimized for PT100 to PT1000 platinum RTDs with ±45 V input fault protection and SPI-compatible interface.
Operating Conditions:
- Supply voltage: 3.0 to 3.6 V (VDD and DVDD)
- Operating temperature: -40 to +125 °C
- SCLK frequency: DC to 5.0 MHz
Absolute Maximum Ratings:
- Max supply voltage: 4.0 V (VDD relative to GND1, DVDD relative to DGND)
- Max continuous current: 2758.6 mW continuous power dissipation (TQFN, TA = +70 °C), 952.4 mW continuous power dissipation (SSOP, TA = +70 °C)
- Max junction/storage temperature: +150 °C junction, -65 to +150 °C storage
Key Specs:
- ADC Resolution: 15 Bits (no missing codes)
- Total Accuracy: 0.5 °C max (0.05% of full scale) over all operating conditions
- Bias Voltage (VBIAS): 1.95 V min, 2.00 V typ, 2.06 V max
- Bias Voltage Output Current: 0.2 mA min, 5.75 mA max
- Single Conversion Time: 52 ms typ, 55 ms max (60 Hz notch); 62.5 ms typ, 66 ms max (50 Hz notch)
- Continuous Conversion Time: 16.7 ms typ, 17.6 ms max (60 Hz notch); 20 ms typ, 21 ms max (50 Hz notch)
- Active Conversion Supply Current (IDD): 2 mA typ, 3.5 mA max (bias on, active conversion)
- Shutdown Supply Current (IDD Shutdown): 1.5 mA typ, 3 mA max (bias off, ADC off)
- 50/60 Hz Noise Rejection: 82 dB typ
Features:
- Supports 100 Ω to 1 kΩ (at 0 °C) platinum RTDs (PT100 to PT1000)
- Compatible with 2-, 3-, and 4-wire sensor configurations
- ±45 V overvoltage input protection on sensor terminals
- Integrated fault detection for open RTD, cable faults, and short circuits
- Fully differential VREF and analog inputs
- SPI-compatible serial interface
Applications:
- Industrial Equipment
- Medical Equipment
- Instrumentation
Package:
- 20-Pin TQFN
- 20-Pin SSOP
MAX31865ATP Features
- Integration Lowers System Cost, Simplifies Design Efforts, and Reduces Design Cycle Time
- Simple Conversion of Platinum RTD Resistance to Digital Value
- Handles 100 Ω to 1k Ω (at 0°C) Platinum RTDs (PT100 to PT1000)
- Compatible with 2-, 3-, and 4-Wire Sensor Connections
- SPI-Compatible Interface
- 20-Pin TQFN and SSOP Packages
- High Accuracy Facilitates Meeting Error Budgets
- 15-Bit ADC Resolution; Nominal Temperature Resolution 0.03125 N C (Varies Due to RTD Nonlinearity)
- Total Accuracy Over All Operating Conditions: 0.5 N C (0.05% of Full Scale) max
- Fully Differential V REF Inputs
- 21ms (max) Conversion Time
- Integrated Fault Detection Increases System Reliability
- ±45V Input Protection
- Fault Detection (Open RTD Element, RTD Shorted to Out-of-Range Voltage, or Short Across RTD Element)
MAX31865ATP Applications
- Industrial Equipment
- Medical Equipment
- Instrumentation
Ordering Information appears at end of data sheet.
MAX31865ATP Pin Configuration
│
MAX31865ATP Electrical Characteristics
(3.0V P V DD P 3.6V, T A = -40 N C to +125 N C, unless otherwise noted. Typical values are T A = +25 N C, V DD = V DVDD = 3.3V.) (Notes 2 and 3)
| PARAMETER | SYMBOL | CONDITIONS | MIN | TYP | MAX | UNITS |
|---|---|---|---|---|---|---|
| ADC Resolution | No missing codes | 15 | Bits | |||
| ADC Full-Scale Input Voltage (RTDIN+ - RTDIN-) | REFIN+ - REFIN- | V |
│
MAX31865ATP Absolute Maximum Ratings
| Parameter | Limit |
|---|---|
| Voltage Range on V DD Relative to GND1 | -0.3V to +4.0V |
| Voltage Range on BIAS, REFIN+, REFIN-, ISENSOR | -0.3V to (V DD + 0.3V) |
| Voltage Range on FORCE+, FORCE2, FORCE-, RTDIN+, RTDIN- Relative to GND1 | -50V to +50V |
| Voltage Range on DVDD Relative to DGND | -0.3V to +4.0V |
| Voltage Range on All Digital Pins Relative to DGND | -0.3V to (V DVDD + 0.3V) |
| Parameter | Limit |
|---|---|
| Continuous Power Dissipation (T A = +70 N C) | |
| TQFN (derate 34.5mW/ N C above +70 N C) | 2758.6mW |
| SSOP (derate 11.9mW/°C above +70° C) | 952.4mW |
| ESD Protection (all pins, Human Body Model) | ±2kV |
| Operating Temperature Range | -40 N C to +125 N C |
| Junction Temperature | +150 N C |
| Storage Temperature Range | -65 N C to +150 N C |
| Soldering Temperature (reflow) | +260 N C |
| Lead Temperature (soldering,10s) | +300 N C |
Stresses beyond those listed under 'Absolute Maximum Ratings' may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
MAX31865ATP Thermal Information
| TQFN | SSOP |
|---|---|
| Junction-to-Ambient Thermal Resistance ( q JA ) ..........29°C/W | Junction-to-Ambient Thermal Resistance ( q JA ) ..........84°C/W |
| Junction-to-Case Thermal Resistance ( q JC ) .................2°C/W | Junction-to-Case Thermal Resistance ( q JC ) ...............32°C/W |
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial .
MAX31865ATP Typical Application
MAX31865ATP Package Information
| PART | TEMP RANGE | PIN-PACKAGE |
|---|---|---|
| MAX31865AAP+ | -40 ° C to +125 ° C | 20 SSOP |
| MAX31865AAP+T | -40 ° C to +125 ° C | 20 SSOP |
| MAX31865ATP+ | -40 ° C to +125 ° C | 20 TQFN-EP* |
| MAX31865ATP+T | -40 ° C to +125 ° C | 20 TQFN-EP* |
- Denotes a lead(Pb)-free/RoHS-compliant package.
T = Tape and reel.
*EP = Exposed pad.
For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages . Note that a '+', '#', or '-' in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status.
| PACKAGE TYPE | PACKAGE CODE | OUTLINE NO. | LAND PATTERN NO. |
|---|---|---|---|
| 20 TQFN-EP | T2055+5 | 21-0140 | 90-0010 |
| 20 SSOP | A20+1 | 21-0056 | 90-0094 |
Variants on the same datasheet
These parts have exact links to the same datasheet. They are candidates to compare, not verified drop-in replacements; check package, pinout and electrical limits.
| Part Number | Manufacturer | Package |
|---|---|---|
| MAX31865 | Analog Devices | — |
| MAX31865AAP | Analog Devices | SSOP-20 |
| MAX31865ATP+T | Analog Devices | 20-WQFN Exposed Pad |
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