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MAX31865ATP

RTD-to-Digital Converter

The MAX31865ATP is a rtd-to-digital converter from Analog Devices. View the full MAX31865ATP datasheet below including key specifications, electrical characteristics, absolute maximum ratings.

MAX31865ATP shares its datasheet with MAX31865, whose page lists every part number it covers.

Official MAX31865ATP datasheet (PDF) — the source this page was extracted from.

Manufacturer

Analog Devices

Package

TQFN-20-EP

MAX31865ATP Key Specifications

ParameterValue
InterfaceSPI (modes 1 and 3), up to 5MHz
Bias Voltage1.95V to 2.06V (2.00V typ)
ADC Resolution15 bits
Supported RTDs100 Ω to 1kΩ at 0°C (PT100 to PT1000)
Total Accuracy0.5°C max (0.05% of full scale)
Conversion Time21ms max (continuous, 50Hz notch)
Input Protection±45V
Reference Resistor350Ω to 10kΩ
Sensor Connections2-, 3-, and 4-wire
ESD Protection (HBM)±2kV
Supply Voltage (VDD)3.0V to 3.6V
Operating Temperature-40°C to +125°C
Temperature Resolution0.03125°C (nominal)
50/60Hz Noise Rejection82dB typ
Digital Supply Voltage (DVDD)3.0V to 3.6V
Supply Current (Active Conversion)2mA typ, 3.5mA max

MAX31865ATP Overview

Part: MAX31865 — Maxim Integrated

Type: Resistance-to-Digital Converter

Description: 15-bit precision delta-sigma ADC resistance-to-digital converter optimized for PT100 to PT1000 platinum RTDs with ±45 V input fault protection and SPI-compatible interface.

Operating Conditions:

  • Supply voltage: 3.0 to 3.6 V (VDD and DVDD)
  • Operating temperature: -40 to +125 °C
  • SCLK frequency: DC to 5.0 MHz

Absolute Maximum Ratings:

  • Max supply voltage: 4.0 V (VDD relative to GND1, DVDD relative to DGND)
  • Max continuous current: 2758.6 mW continuous power dissipation (TQFN, TA = +70 °C), 952.4 mW continuous power dissipation (SSOP, TA = +70 °C)
  • Max junction/storage temperature: +150 °C junction, -65 to +150 °C storage

Key Specs:

  • ADC Resolution: 15 Bits (no missing codes)
  • Total Accuracy: 0.5 °C max (0.05% of full scale) over all operating conditions
  • Bias Voltage (VBIAS): 1.95 V min, 2.00 V typ, 2.06 V max
  • Bias Voltage Output Current: 0.2 mA min, 5.75 mA max
  • Single Conversion Time: 52 ms typ, 55 ms max (60 Hz notch); 62.5 ms typ, 66 ms max (50 Hz notch)
  • Continuous Conversion Time: 16.7 ms typ, 17.6 ms max (60 Hz notch); 20 ms typ, 21 ms max (50 Hz notch)
  • Active Conversion Supply Current (IDD): 2 mA typ, 3.5 mA max (bias on, active conversion)
  • Shutdown Supply Current (IDD Shutdown): 1.5 mA typ, 3 mA max (bias off, ADC off)
  • 50/60 Hz Noise Rejection: 82 dB typ

Features:

  • Supports 100 Ω to 1 kΩ (at 0 °C) platinum RTDs (PT100 to PT1000)
  • Compatible with 2-, 3-, and 4-wire sensor configurations
  • ±45 V overvoltage input protection on sensor terminals
  • Integrated fault detection for open RTD, cable faults, and short circuits
  • Fully differential VREF and analog inputs
  • SPI-compatible serial interface

Applications:

  • Industrial Equipment
  • Medical Equipment
  • Instrumentation

Package:

  • 20-Pin TQFN
  • 20-Pin SSOP

MAX31865ATP Features

  • Integration Lowers System Cost, Simplifies Design Efforts, and Reduces Design Cycle Time
  • Simple Conversion of Platinum RTD Resistance to Digital Value
  • Handles 100 Ω to 1k Ω (at 0°C) Platinum RTDs (PT100 to PT1000)
  • Compatible with 2-, 3-, and 4-Wire Sensor Connections
  • SPI-Compatible Interface
  • 20-Pin TQFN and SSOP Packages
  • High Accuracy Facilitates Meeting Error Budgets
  • 15-Bit ADC Resolution; Nominal Temperature Resolution 0.03125 N C (Varies Due to RTD Nonlinearity)
  • Total Accuracy Over All Operating Conditions: 0.5 N C (0.05% of Full Scale) max
  • Fully Differential V REF Inputs
  • 21ms (max) Conversion Time
  • Integrated Fault Detection Increases System Reliability
  • ±45V Input Protection
  • Fault Detection (Open RTD Element, RTD Shorted to Out-of-Range Voltage, or Short Across RTD Element)

MAX31865ATP Applications

  • Industrial Equipment
  • Medical Equipment
  • Instrumentation

Ordering Information appears at end of data sheet.

MAX31865ATP Pin Configuration

│

MAX31865ATP Electrical Characteristics

(3.0V P V DD P 3.6V, T A = -40 N C to +125 N C, unless otherwise noted. Typical values are T A = +25 N C, V DD = V DVDD = 3.3V.) (Notes 2 and 3)

PARAMETERSYMBOLCONDITIONSMINTYPMAXUNITS
ADC ResolutionNo missing codes15Bits
ADC Full-Scale Input Voltage (RTDIN+ - RTDIN-)REFIN+ - REFIN-V

│

MAX31865ATP Absolute Maximum Ratings

ParameterLimit
Voltage Range on V DD Relative to GND1-0.3V to +4.0V
Voltage Range on BIAS, REFIN+, REFIN-, ISENSOR-0.3V to (V DD + 0.3V)
Voltage Range on FORCE+, FORCE2, FORCE-, RTDIN+, RTDIN- Relative to GND1-50V to +50V
Voltage Range on DVDD Relative to DGND-0.3V to +4.0V
Voltage Range on All Digital Pins Relative to DGND-0.3V to (V DVDD + 0.3V)
ParameterLimit
Continuous Power Dissipation (T A = +70 N C)
TQFN (derate 34.5mW/ N C above +70 N C)2758.6mW
SSOP (derate 11.9mW/°C above +70° C)952.4mW
ESD Protection (all pins, Human Body Model)±2kV
Operating Temperature Range-40 N C to +125 N C
Junction Temperature+150 N C
Storage Temperature Range-65 N C to +150 N C
Soldering Temperature (reflow)+260 N C
Lead Temperature (soldering,10s)+300 N C

Stresses beyond those listed under 'Absolute Maximum Ratings' may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.

MAX31865ATP Thermal Information

TQFNSSOP
Junction-to-Ambient Thermal Resistance ( q JA ) ..........29°C/WJunction-to-Ambient Thermal Resistance ( q JA ) ..........84°C/W
Junction-to-Case Thermal Resistance ( q JC ) .................2°C/WJunction-to-Case Thermal Resistance ( q JC ) ...............32°C/W

Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial .

MAX31865ATP Typical Application

MAX31865ATP Package Information

PARTTEMP RANGEPIN-PACKAGE
MAX31865AAP+-40 ° C to +125 ° C20 SSOP
MAX31865AAP+T-40 ° C to +125 ° C20 SSOP
MAX31865ATP+-40 ° C to +125 ° C20 TQFN-EP*
MAX31865ATP+T-40 ° C to +125 ° C20 TQFN-EP*
  • Denotes a lead(Pb)-free/RoHS-compliant package.

T = Tape and reel.

*EP = Exposed pad.

For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages . Note that a '+', '#', or '-' in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status.

PACKAGE TYPEPACKAGE CODEOUTLINE NO.LAND PATTERN NO.
20 TQFN-EPT2055+521-014090-0010
20 SSOPA20+121-005690-0094

Variants on the same datasheet

These parts have exact links to the same datasheet. They are candidates to compare, not verified drop-in replacements; check package, pinout and electrical limits.

Part NumberManufacturerPackage
MAX31865Analog Devices—
MAX31865AAPAnalog DevicesSSOP-20
MAX31865ATP+TAnalog Devices20-WQFN Exposed Pad

Other Integrated Circuits

All Integrated Circuits datasheetsAll Analog Devices datasheets (700)

Data on this page is extracted from publicly available manufacturer datasheets using automated tools including AI. It may contain errors or omissions. Always verify specifications against the official manufacturer datasheet before making design or purchasing decisions. See our Terms of Service. Rights holders can submit a takedown request.

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