LMZ14201EXTTZ

Part: LMZ14201EXT, Texas Instruments

Type: SIMPLE SWITCHER® Power Module

Key Specs:

• Output Current: Up to 1A
• Input Voltage Range: 6V to 42V
• Output Voltage Range: 0.8V to 6V
• Efficiency: Up to 90%
• Maximum Total Output Power: 6W
• Junction Temperature Range: -55°C

• such as Input UVLO and Output Short Circuit soldering.

• • Single Exposed Pad and Standard Pinout for The LMZ14201EXT can accept an input voltage rail

• • • – LMZ12003/2/1 (20V Max 3A, 2A, 1A) frequency up to 1 MHz.

• • Fully Enabled for Webench® Power Designer

• • Point of Load Conversions from 12V and 24V • Up to 1A Output Current Input Rail • Input Voltage Range 6V to 42V

• • Space Constrained / High Thermal • Efficiency up to 90% Requirement Applications

• • Negative Output Voltage Applications (See AN- PERFORMANCE BENEFITS 2027 SNVA425)

1

Figure 1. Easy To Use 7 Pin Package PFM 7 Pin Package 10.16 x 13.77 x 4.57 mm (0.4 x 0.542 x 0.18 in) θJA = 20°C/W, θJC = 1.9°C/W RoHS Compliant

Check for Samples: LMZ14201EXT

Simplified Application Schematic

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

• APPLICATIONS • 6W Maximum Total Output Power

• • Time Critical Projects • Output Voltage Range 0.8V to 6V

• • Low Radiated Emissions / High Radiated Immunity

• • Passes Vibration Standard MIL-STD-883 Method 2007.2 Condition A JESD22–B103B Condition 1

• • Passes Drop Standard MIL-STD-883 Method 2002.3 Condition B JESD22–B110 Condition B

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For the design case of VIN = 24V, V^O = 3.3V, I^O = 1A, TAMB(MAX) = 85°C , and TJUNCTION = 125°C, the device must see a thermal resistance from case to ambient of less than:mathfrak{G}_mathsf{Cmathsf{A}} lhd (mathsf{T}_mathsf{Lmathsf{A}mathsf{W}mathsf{A}} - mathsf{T}_mathsf{Amathsf{A}mathsf{B}(mathsf{W}mathsf{A}mathsf{X})}) / mathsf{P}_mathsf{Cmathsf{L}mathsf{C}mathsf{B}mathsf{S}} · mathfrak{G}_mathsf{Lmathsf{C}}tag{15}

Given the typical thermal resistance from junction to case to be 1.9 °C/W. Use the 85°C power dissipation curves in the Typical Performance Characteristics section to estimate the PIC-LOSS for the application being designed. In this application it is 0.52W.

θCA = (125 — 85) / 0.52W — 1.9 = 75

To reach θCA = 75, the PCB is required to dissipate heat effectively. With no airflow and no external heat, a good estimate of the required board area covered by 1 oz. copper on both the top and bottom metal layers is:

Board Area_cm² = 500°C x cm² /W / θJC (16)

As a result, approximately 6 square cm of 1 oz copper on top and bottom layers is required for the PCB design. Additional area will decrease die temperature proportionately. The PCB copper heat sink must be connected to the exposed pad. Approximately thirty six, 10mils (254 μm) thermal vias spaced 59mils (1.5 mm) apart must connect the top copper to the bottom copper. For an example of a high thermal performance PCB layout of approximately 31 square cm area. Refer to the Evaluation Board application note AN-2024 SNVA422. For more information on thermal design see AN-2020 SNVA419 and AN-2026 SNVA424.

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.