ICE40UP3K

Part: iCE40 UltraPlus Family — Lattice Semiconductor

Type: FPGA

Description: Ultra-low power FPGAs with up to 5.3K LUTs, 1 Mb SPRAM, 120 Kb EBR, 8 DSP blocks, integrated I2C/SPI IP, and high current RGB LED drivers, offering up to 125 MHz performance.

Operating Conditions:

• Supply voltage: Core VCC: 1.14–1.26 V; I/O VCCIO: 1.14–3.465 V
• Operating temperature: -40 to +100 °C (Junction)
• Max register-to-register performance:

•  Flexible Logic Architecture
•  Two devices with 2800 to 5280 LUTs
•  Offered in WLCS and QFN packages
•  Ultra-low Power Devices
•  Advanced 40 nm low power process



As low as 100 μA standby current typical

•  Embedded Memory
•  Up to 1024 kb Single Port SRAM
•  Up to 120 kb sysMEM™ Embedded Block RAM
•  Two Hardened I 2 C Interfaces
•  Two I/O pins to support I3C interface
•  Two Hardened SPI Interfaces
•  Two On-Chip Oscillators
•  Low Frequency Oscillator - 10 kHz
•  High Frequency Oscillator - 48 MHz
•  24 mA Current Drive RGB LED Outputs
•  Three drive outputs in each device
•  User selectable sink current up to 24 mA
•  On-chip DSP
•  Signed and unsigned 8-bit or 16-bit functions
•  Functions include Multiplier, Accumulator, and Multiply-Accumulate (MAC)
•  Flexible On-Chip Clocking
•  Eight low skew global signal resource, six can be directly driven from external pins
•  One PLL with dynamic interface per device
•  Flexible Device Configuration
•  SRAM is configured through:
•  Standard SPI Interface
•  Internal Nonvolatile Configuration Memory (NVCM)
•  Ultra-Small Form Factor
•  As small as 2.11 mm × 2.54 mm
•  Applications
•  Always-On Voice Recognition Application
•  Smartphones
•  Tablets and Consumer Handheld Devices
•  Handheld Commercial and Industrial Devices
•  Multi Sensor Management Applications
•  Sensor Pre-processing and Sensor Fusion
•  Always-On Sensor Applications
•  USB 3.1 Type C Cable Detect / Power Delivery Applications

Over recommended operating conditions.

Table 4.5. DC Electrical Characteristics