CC2652R1FRGZT
Multiprotocol 2.4 GHz Wireless MCUThe CC2652R1FRGZT is a multiprotocol 2.4 ghz wireless mcu from Texas Instruments. View the full CC2652R1FRGZT datasheet below including key specifications, electrical characteristics, absolute maximum ratings.
CC2652R1FRGZT shares its datasheet with CC2652, whose page lists every part number it covers.
Official CC2652R1FRGZT datasheet (PDF) — the source this page was extracted from.
Manufacturer
Texas InstrumentsCategory
RF / WirelessCC2652R1FRGZT Key Specifications
| Parameter | Value |
|---|---|
| Active mode RX | 6.9 mA |
| Active mode TX at 0 dBm | 7.0 mA |
| Active mode TX at 5 dBm | 9.2 mA |
| Active mode MCU at 48 MHz (CoreMark) | 3.4 mA (71 μA/MHz) |
| Standby | 0.94 μA (RTC on, 80 kB RAM and CPU retention) |
| Shutdown | 150 nA (wakeup on external events) |
| RX sensitivity | -100 dBm for 802.15.4 (2.4 GHz), -105 dBm for Bluetooth 125 kbps (LE Coded PHY) |
| CoreMark score | 148 |
CC2652R1FRGZT Overview
Part: CC2652R (CC2652R1FRGZ) — Texas Instruments
Type: Multiprotocol 2.4 GHz Wireless MCU (Arm Cortex-M4F)
Description: SimpleLink 2.4 GHz wireless MCU with a 48 MHz Arm Cortex-M4F, 352 kB flash and 80 kB ultra-low-leakage SRAM. It supports Bluetooth 5.2 LE, Thread, Zigbee and IEEE 802.15.4, with up to +5 dBm TX output power and a 0.94 μA standby current.
Operating Conditions:
- Supply voltage (VDDS): 1.8–3.8 V
- Operating junction temperature: -40 to 105 °C
- CPU clock: 48 MHz
- Supply voltage slew rate: rising 0–100 mV/μs, falling 0–20 mV/μs
Absolute Maximum Ratings:
- Max supply voltage (VDDS): 4.1 V
- Voltage on any digital pin: -0.3 V to VDDS + 0.3 V, max 4.1 V
- RF pin input level: 5 dBm
- Storage temperature: -40 to 150 °C
Key Specs:
- Active mode RX: 6.9 mA
- Active mode TX at 0 dBm: 7.0 mA
- Active mode TX at 5 dBm: 9.2 mA
- Active mode MCU at 48 MHz (CoreMark): 3.4 mA (71 μA/MHz)
- Standby: 0.94 μA (RTC on, 80 kB RAM and CPU retention)
- Shutdown: 150 nA (wakeup on external events)
- RX sensitivity: -100 dBm for 802.15.4 (2.4 GHz), -105 dBm for Bluetooth 125 kbps (LE Coded PHY)
- 12-bit ADC, 200 kSamples/s, 8 channels
- CoreMark score: 148
Features:
- 48 MHz Arm Cortex-M4F with 352 kB flash, 256 kB ROM, 8 kB cache SRAM and 80 kB parity-protected SRAM
- Ultra-low-power sensor controller with 4 kB SRAM
- Dedicated Arm Cortex-M0 radio controller
- 2.4 GHz transceiver for Bluetooth 5.2 LE and IEEE 802.15.4, with 3-wire, 2-wire and 1-wire PTA coexistence
- Peripherals: 2× UART, 2× SSI, I2C, I2S, 4× 32-bit timers (or 8× 16-bit), 2× comparators, RTC, capacitive sensing on up to 8 channels
- Hardware security: AES-128/256, ECC and RSA accelerators, SHA2 up to SHA-512, TRNG
- On-chip buck DC/DC converter
- cJTAG and JTAG debug, OTA update support
- Supported stacks: Thread, Zigbee, Bluetooth 5.2 LE, 6LoWPAN, TI 15.4-Stack, and the DMM driver for concurrent multiprotocol operation
Applications:
- Building automation (security, HVAC, fire safety, video surveillance, elevators)
- Grid infrastructure and smart meters
- Factory automation and control
- Medical
- Electronic shelf labels and point of sale
- Wired networking and communication equipment
- Personal electronics (remote controls, smart speakers, keyboards and pointing devices, toys, wearables)
- Asset tracking and energy harvesting
Package:
- VQFN-48 (RGZ), 7 mm × 7 mm, 31 GPIOs
CC2652R1FRGZT Features
- Microcontroller
- -Powerful 48 MHz Arm ® Cortex ® -M4F processor
- -EEMBC CoreMark ® score: 148
- -352 kB of in-system programmable flash
- -256 kB of ROM for protocols and library functions
- -8 kB of cache SRAM (alternatively available as general-purpose RAM)
- -80 kB of ultra-low leakage SRAM. The SRAM is protected by parity to ensure high reliability of operation.
- -2-pin cJTAG and JTAG debugging
- -Supports over-the-air (OTA) update
- Ultra-low power sensor controller with 4 kB of SRAM
- -Sample, store, and process sensor data
- -Operation independent from system CPU
- -Fast wake-up for low-power operation
- TI-RTOS, drivers, bootloader, Bluetooth ® 5.2 low energy controller, and IEEE 802.15.4 MAC in ROM for optimized application size
- RoHS-compliant package
- -7 mm × 7 mm RGZ VQFN48 (31 GPIOs)
- Peripherals
- -Digital peripherals can be routed to any GPIO
- -4× 32-bit or 8× 16-bit general-purpose timers
- -12-bit ADC, 200 kSamples/s, 8 channels
- -2× comparators with internal reference DAC (1× continuous time, 1× ultra-low power)
- -Programmable current source
- -2× UART
- -2× SSI (SPI, MICROWIRE, TI)
- -I 2 C and I 2 S
- -Real-time clock (RTC)
- -AES 128- and 256-bit cryptographic accelerator
- -ECC and RSA public key hardware accelerator
- -SHA2 accelerator (full suite up to SHA-512)
- -True random number generator (TRNG)
- -Capacitive sensing, up to 8 channels
- -Integrated temperature and battery monitor
- External system
- -On-chip buck DC/DC converter
- Low power
- -Active mode RX: 6.9 mA
- -Active mode TX 0 dBm: 7.0 mA
- -Active mode TX 5 dBm: 9.2 mA
- -Active mode MCU 48 MHz (CoreMark): 3.4 mA (71 μA/MHz)
- -Sensor controller, low power-mode, 2 MHz, running infinite loop: 30.1 μA
- -Sensor controller, active mode, 24 MHz, running infinite loop: 808 μA
- -Standby: 0.94 μA (RTC on, 80 kB RAM and CPU retention)
- -Shutdown: 150 nA (wakeup on external events)
- Radio section
- -2.4 GHz RF transceiver compatible with Bluetooth 5.2 Low Energy and earlier LE specifications and IEEE 802.15.4 PHY and MAC
- -3-wire, 2-wire, 1-wire PTA coexistence mechanisms
- -Excellent receiver sensitivity: -100 dBm for 802.15.4 (2.4 GHz), -105 dBm for Bluetooth 125 kbps (LE Coded PHY)
- -Output power up to +5 dBm with temperature compensation
- -Suitable for systems targeting compliance with worldwide radio frequency regulations
- EN 300 328, (Europe)
- EN 300 440 Category 2
- FCC CFR47 Part 15
- ARIB STD-T66 (Japan)
- Wireless protocols
- -Thread, Zigbee ® , Bluetooth ® 5.2 Low Energy, IEEE 802.15.4, IPv6-enabled smart objects (6LoWPAN), proprietary systems, SimpleLink ™ TI 15.4 stack (2.4 GHz), and dynamic multiprotocol manager (DMM) driver.
- Development Tools and Software
- -CC26x2R LaunchPad™ Development Kit
- -SimpleLink™ LOWPOWER F2 Software Development Kit (SDK)
- -SmartRF ™ Studio for simple radio configuration
- -Sensor Controller Studio for building low-power sensing applications
CC2652R1FRGZT Applications
- 2400 to 2480 MHz ISM and SRD systems 1 with down to 4 kHz of receive bandwidth
- Building automation
- -Building security systems - motion detector, electronic smart lock, door and window sensor, garage door system, gateway
- -HVAC - thermostat, wireless environmental sensor, HVAC system controller, gateway
- -Fire safety system - smoke and heat detector, fire alarm control panel (FACP)
- -Video surveillance - IP network camera
- -Elevators and escalators - elevator main control panel for elevators and escalators
- Grid infrastructure
- -Smart meters - water meter, gas meter, electricity meter, and heat cost allocators
- -Grid communications - wireless communications - Long-range sensor applications
CC2652R1FRGZT Electrical Characteristics
| PARAMETER | TEST CONDITIONS | MIN | TYP | MAX | UNIT |
|---|---|---|---|---|---|
| T A = 25 °C, V DDS = 1.8 V | |||||
| GPIO VOH at 8 mA load | IOCURR = 2, high-drive GPIOs only | 1.56 | V | ||
| GPIO VOL at 8 mA load | IOCURR = 2, high-drive GPIOs only | 0.24 | V | ||
| GPIO VOH at 4 mA load | IOCURR = 1 | 1.59 | V | ||
| GPIO VOL at 4 mA load | IOCURR = 1 | 0.21 | V | ||
| GPIO pullup current | Input mode, pullup enabled, Vpad = 0 V | 73 | μA | ||
| GPIO pulldown current | Input mode, pulldown enabled, Vpad = VDDS | 19 | μA | ||
| GPIO low-to-high input transition, with hysteresis | IH = 1, transition voltage for input read as0→1 | 1.08 | V | ||
| GPIO high-to-low input transition, with hysteresis | IH = 1, transition voltage for input read as1→0 | 0.73 | V | ||
| GPIO input hysteresis | IH = 1, difference between0→1 and 1 →0points | 0.35 | V | ||
| T A = 25 °C, V DDS = 3.0 V | |||||
| GPIO VOH at 8 mA load | IOCURR = 2, high-drive GPIOs only | 2.59 | V | ||
| GPIO VOL at 8 mA load | IOCURR = 2, high-drive GPIOs only | 0.42 | V | ||
| GPIO VOH at 4 mA load | IOCURR = 1 | 2.63 | V | ||
| GPIO VOL at 4 mA load | IOCURR = 1 | 0.40 | V | ||
| T A = 25 °C, V DDS = 3.8 V | |||||
| GPIO pullup current | Input mode, pullup enabled, Vpad = 0 V | 282 | μA | ||
| GPIO pulldown current | Input mode, pulldown enabled, Vpad = VDDS | 110 | μA | ||
| GPIO low-to-high input transition, with hysteresis | IH = 1, transition voltage for input read as0→1 | 1.97 | V | ||
| GPIO high-to-low input transition, with hysteresis | IH = 1, transition voltage for input read as1→0 | 1.55 | V | ||
| GPIO input hysteresis | IH = 1, difference between0→1 and 1 →0points | 0.42 | V | ||
| T A = 25 °C | |||||
| VIH | Lowest GPIO input voltage reliably interpreted as a High | 0.8*V DDS | V | ||
| VIL | Highest GPIO input voltage reliably interpreted as a Low | 0.2*V DDS | V |
CC2652R1FRGZT Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1) (2)
| MIN | MAX | UNIT | |||
|---|---|---|---|---|---|
| VDDS (3) | Supply voltage | Supply voltage | -0.3 | 4.1 | V |
| Voltage on any digital pin (4) (5) | Voltage on any digital pin (4) (5) | -0.3 | VDDS + 0.3, max 4.1 | V | |
| Voltage on crystal oscillator pins, X32K_Q1, X32K_Q2, X48M_N and X48M_P | Voltage on crystal oscillator pins, X32K_Q1, X32K_Q2, X48M_N and X48M_P | -0.3 | VDDR + 0.3, max 2.25 | V | |
| V in | Voltage on ADC input | Voltage scaling enabled | -0.3 | VDDS | V |
| Voltage scaling disabled, internal reference | -0.3 | 1.49 | V | ||
| Voltage scaling disabled, VDDS as reference | -0.3 | VDDS / 2.9 | V | ||
| Input level, RF pins | Input level, RF pins | 5 | dBm | ||
| T stg | Storage temperature | Storage temperature | -40 | 150 | °C |
- (2) All voltage values are with respect to ground, unless otherwise noted.
- (3) VDDS_DCDC, VDDS2 and VDDS3 must be at the same potential as VDDS.
- (4) Including analog capable DIOs.
- (5) Injection current is not supported on any GPIO pin
CC2652R1FRGZT Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
| MIN | MAX | UNIT | |
|---|---|---|---|
| Operating junction temperature (2) | -40 | 105 | °C |
| Operating supply voltage (VDDS) | 1.8 | 3.8 | V |
| Rising supply voltage slew rate | 0 | 100 | mV/μs |
| Falling supply voltage slew rate (1) | 0 | 20 | mV/μs |
CC2652R1FRGZT Thermal Information
| THERMAL METRIC (1) | PACKAGE RGZ (VQFN) - 48 PINS | UNIT | |
|---|---|---|---|
| R θJA | Junction-to-ambient thermal resistance | 23.4 | °C/W (2) |
| R θJC(top) | Junction-to-case (top) thermal resistance | 13.3 | °C/W (2) |
| R θJB | Junction-to-board thermal resistance | 8.0 | °C/W (2) |
| ψ JT | Junction-to-top characterization parameter | 0.1 | °C/W (2) |
| ψ JB | Junction-to-board characterization parameter | 7.9 | °C/W (2) |
| R θJC(bot) | Junction-to-case (bottom) thermal resistance | 1.7 | °C/W (2) |
- (2) °C/W = degrees Celsius per watt.
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All RF / Wireless datasheetsAll Texas Instruments datasheets (2,418)
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