CC2541

Part: CC2541 — Texas Instruments

Type: 2.4-GHz Bluetooth Low Energy and Proprietary System-on-Chip

Description: A power-optimized SoC solution for Bluetooth low energy and proprietary 2.4GHz applications, combining an enhanced 8051 MCU, in-system programmable Flash (128 or 256 KB), 8-KB RAM, and various peripherals, suitable for ultra-low power consumption systems.

Operating Conditions:

• Supply voltage: 2–3.6 V
• Operating temperature: -40 to 85 °C
• RF frequency range: 2379–2496 MHz

Absolute Maximum Ratings:

• Max supply voltage: 3.9 V
• Max input RF level: 10 dBm
• Max storage temperature: 125 °C

Key Specs:

• Microcontroller: High-performance and low-power 8051 core
• Flash memory: 128 or 256 KB
• RAM: 8 KB with retention in all power modes
• RX current consumption: 17.9 mA (standard mode, no peripherals, low MCU activity, VDD=3V)
• TX current consumption: 18.2 mA (0 dBm output power, no peripherals, low MCU activity, VDD=3V)
• Power mode 3 current consumption: 0.5 μA (digital regulator off, no clocks, POR active, RAM and register retention)
• Receiver sensitivity: -94 dBm (1 Mbps, GFSK, 250-kHz deviation, Bluetooth low energy Mode, high-gain mode)
• Output power: Programmable up to 0 dBm

Features:

• Bluetooth v4.0 protocol compliant stack for single-mode Bluetooth Low Energy (BLE) solutions
• 5-channel Direct Memory Access (DMA)
• 12-bit Analog-to-Digital Converter (ADC) with 8 channels
• Advanced Encryption Standard (AES) security coprocessor
• 2 Universal Asynchronous Receiver/Transmitters (UARTs)
• I²C interface
• 23 General-Purpose I/O pins (21 × 4 mA, 2 × 20 mA)

Applications:

• 2.4-GHz Bluetooth low energy systems
• Proprietary 2.4-GHz systems
• Human Interface Devices (keyboards, mice, remote controls)
• Sports and leisure equipment
• Mobile phone accessories
• Consumer electronics

Package:

• 6-mm × 6-mm Quad Flat No-lead (QFN)-40 package

• Bluetooth v4.0 compliant stack for single-mode Bluetooth Low Energy (BLE) solutions
• -Fully power-optimized stack, including controller and host
• -GAP central, peripheral, or broadcaster (including combined roles)
• -Attribute Protocol (ATT) / Generic Attribute Profile (GATT) client and server
• -Symmetric Multi-Processing (SMP) - AES-128 encryption and decryption
• -L2CAP
• -Example applications and profiles
• -General applications for GAP central and peripheral roles
• -Proximity, accelerometer, simple key, and battery GATT services
• -More applications supported within the BLE software stack
• -Multiple configuration options
• -Single-chip configuration, allowing the application to run on the CC2541
• -Network processor interface for running on an external microprocessor
• -BTool Windows PC application for evaluation, development, and testing

• 2.4-GHz Bluetooth low energy systems
• Proprietary 2.4-GHz systems
• Human Interface Devices (keyboards, mice, remote controls)
• Sports and leisure equipment
• Mobile phone accessories
• Consumer electronics

The CC2541 pinout is shown in Figure 8 and a short description of the pins follows.

NOTE: The exposed ground pad must be connected to a solid ground plane, as this is the ground connection for the chip.

Figure 8. Pinout Top View

Measured on Texas Instruments CC2541 EM reference design with TA = 25°C and VDD = 3 V,

over operating free-air temperature range (unless otherwise noted)

over operating free-air temperature range (unless otherwise noted)

Few external components are required for the operation of the CC2541. A typical application circuit is shown in Figure 22.

(1)

NOTE: Different antenna alternatives will be provided as reference designs.

Figure 22. CC2541 Application Circuit

Table 3. Overview of External Components (Excluding Supply Decoupling Capacitors)