AT24C256C

Part: AT24C256C — Microchip Type: I²C-Compatible (2-Wire) Serial EEPROM Description: 256-Kbit (32,768 x 8) I²C-compatible serial EEPROM with 1.7V to 5.5V operation, supporting 1 MHz Fast Mode Plus, and featuring a write-protect pin.

Operating Conditions:

• Supply voltage: 1.7V to 5.5V
• Operating temperature: -40°C to +85°C
• Clock frequency: up to 1 MHz (2.5V to 5.5V)

Absolute Maximum Ratings:

• Max supply voltage: 6.25V
• Max DC output current: 5.0 mA
• Max storage temperature: +150°C

Key Specs:

• Memory organization: 32,768 x 8 bits (256 Kbit)
• Max write cycle time: 5 ms
• Max active supply current (write): 3.0 mA (VCC = 5.0V, 400 kHz)
• Max standby current: 6.0 μA (VCC = 5.0V)
• Write endurance: 1,000,000 write cycles
• Data retention: 100 years
• Input/Output Capacitance (SDA): 8 pF
• Input Capacitance (A0, A1, A2, SCL): 6 pF

Features:

• Low-Voltage and Standard-Voltage Operation
• I²C-Compatible (2-Wire) Serial Interface (100 kHz, 400 kHz, 1 MHz)
• Schmitt Trigger, Filtered Inputs for Noise Suppression
• Write-Protect Pin for Full Array Hardware Data Protection
• 64-Byte Page Write Mode
• Random and Sequential Read Modes
• ESD Protection > 4,000V

Applications:

• Industrial applications
• Commercial applications

Package:

• 8-Lead SOIC
• 8-Lead TSSOP
• 8-Pad UDFN
• 8-Ball VFBGA

• Low-Voltage and Standard-Voltage Operation:
• -VCC = 1.7V to 5.5V
• Internally Organized as 32,768 x 8 (256K)
• Industrial Temperature Range: -40°C to +85°C
• I 2 C-Compatible (2-Wire) Serial Interface:
• -100 kHz Standard mode, 1.7V to 5.5V
• -400 kHz Fast mode, 1.7V to 5.5V
• -1 MHz Fast Mode Plus (FM+), 2.5V to 5.5V
• Schmitt Trigger, Filtered Inputs for Noise Suppression
• Bidirectional Data Transfer Protocol
• Write -Protect Pin for Full Array Hardware Data Protection
• Ultra Low Active Current (3 mA maximum) and Standby Current (6 μA maximum)
• 64-Byte Page Write Mode:
• -Partial page writes allowed
• Random and Sequential Read Modes
• Self -Timed Write Cycle within 5 ms Maximum
• ESD Protection > 4,000V
• High Reliability:
• -Endurance: 1,000,000 write cycles
• -Data retention: 100 years
• Green Package Options (Lead-free/Halide-free/RoHS compliant)
• Die Sale Options: Wafer Form and Bumped Wafers

The descriptions of the pins are listed in Table 2-1.

Table 2-1. Pin Function Table

1. The exposed pad on this package can be connected to GND or left floating.
2. If the A0, A1, A2 or WP pins are not driven, they are internally pulled down to GND. In order to operate in a wide variety of application environments, the pull -down mechanism is intentionally designed to be somewhat strong. Once these pins are biased above the CMOS input buffer's trip point (~0.5 x V CC ), the pull -down mechanism disengages. Microchip recommends connecting these pins to a known state whenever possible.

1. Typical values characterized at T A = +25°C unless otherwise noted.
2. This parameter is characterized but is not 100% tested in production.

Temperature under bias

-55°C to +125°C

Storage temperature

-65°C to +150°C

VCC

6.25V

Voltage on any pin with respect to ground

-1.0V to +7.0V

DC output current

5.0 mA

ESD protection

4 kV

Note: Stresses above those listed under 'Absolute Maximum Ratings' may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operation listings of this specification are not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.

• Dimensioning and tolerancing per ASME Y14.5M 1.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Microchip Technology Drawing C04-2057-SN Rev B

© 2017 Microchip Technology Inc.

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