Part: 25LC256 — Microchip Technology Inc.

Type: 256-Kbit Serial Electrically Erasable PROM (SPI EEPROM)

Description: A 256-Kbit (32,768 x 8-bit) Serial EEPROM with SPI interface, supporting up to 10 MHz clock speed, 64-byte page writes, and low power consumption with 1 μA standby current.

Operating Conditions:

• Supply voltage: 2.5V-5.5V
• Operating temperature: -40°C to +85°C (Industrial grade)
• Max clock frequency: 10 MHz (at 4.5V ≤ VCC ≤ 5.5V)

Absolute Maximum Ratings:

• Max supply voltage: 6.5V
• Max junction/storage temperature: +150°C

Key Specs:

• Read current: 6 mA (max, at 5.5V, 10 MHz)
• Write current: 5 mA (max, at 5.5V, 10 MHz)
• Standby current: 1 μA (max, at 5.5V, +85°C)
• Internal Write Cycle Time: 5 ms (max)
• Endurance: 1,000,000 E/W Cycles
• Data retention: > 200 years
• ESD protection: > 4 kV (all pins)

Features:

• 32,768 x 8-Bit Organization
• 64-Byte Page
• Self-Timed Erase and Write Cycles
• Block Write Protection (none, 1/4, 1/2 or all of array)
• Built-In Write Protection (Power-on/off data protection, Write enable latch, Write-protect pin)
• Sequential Read
• RoHS Compliant
• Automotive AEC-Q100 Qualified

Applications:

Package:

• 8-Lead DFN-S
• 8-Lead PDIP
• 8-Lead SOIC
• 8-Lead SOIJ
• 8-Lead TSSOP

• Maximum Clock 10 MHz

• Low-Power CMOS Technology:

• -Maximum Write current: 5 mA at 5.5V, 10 MHz

• -Read current: 6 mA at 5.5V, 10 MHz

• -Standby current: 1 μA at 5.5V

• 32,768 x 8-Bit Organization

• 64-Byte Page

• Self-Timed Erase and Write Cycles (5 ms maximum)

• Block Write Protection:

• -Protect none, 1/4, 1/2 or all of array

• Built-In Write Protection:

• -Power-on/off data protection circuitry

• -Write enable latch

• -Write-protect pin

• Sequential Read

• High Reliability:

• -Endurance: 1,000,000 erase/write cycles

• -Data retention: > 200 years

• -ESD protection: > 4000V

• Temperature Ranges Supported:

• RoHS Compliant

• Automotive AEC-Q100 Qualified

• Industrial (I):

-40 C to +85 C

• Extended (E):

-40°C to +125°C

25LC256 – 8-Lead DFN-S Pinout

Pin Number	Pin Name	Type	Description
?	CS	I	Chip Select Input
?	SO	O	Serial Data Output
?	WP	I	Write-Protect
?	VSS	P	Ground
?	SI	I	Serial Data Input
?	SCK	I	Serial Clock Input
?	HOLD	I	Hold Input
?	VCC	P	Supply Voltage

Notes

Pin numbering could not be determined from the provided source material. The text table lists pin names and functions but does not include a Pin Number column, and no pin diagram image was attached. To obtain the correct pin assignments for the 25LC256 8-Lead DFN-S package, consult the package diagram or pinout diagram in the full datasheet. The pin names and functions listed above are accurate for the 25LC256 variant.

DC CHARACTERISTICS	DC CHARACTERISTICS	DC CHARACTERISTICS	Industrial (I): TA = -40°C to +85°C VCC = 1.8V to 5.5V Extended (E): TA = -40°C to +125°C VCC = 1.8V to 5.5V	Industrial (I): TA = -40°C to +85°C VCC = 1.8V to 5.5V Extended (E): TA = -40°C to +125°C VCC = 1.8V to 5.5V	Industrial (I): TA = -40°C to +85°C VCC = 1.8V to 5.5V Extended (E): TA = -40°C to +125°C VCC = 1.8V to 5.5V	Industrial (I): TA = -40°C to +85°C VCC = 1.8V to 5.5V Extended (E): TA = -40°C to +125°C VCC = 1.8V to 5.5V
Param. No.	Symbol	Characteristic	Minimum	Maximum	Units	Test Conditions
D001	VIH	High-Level Input Voltage	0.7 VCC	VCC +1	V
D002	VIL	Low-Level Input Voltage	-0.3	0.3 VCC	V	VCC 2.5V
D003	VIL	Low-Level Input Voltage	-0.3	0.2 VCC	V	VCC < 2.5V
D004	VOL	Low-Level Output	-	0.4	V	I OL = 2.1 mA, VCC = 4.5V
D005	VOL	Voltage	-	0.2	V	I OL = 1.0 mA, VCC = 2.5V
D006	VOH	High-Level Output Voltage	VCC -0.5	-	V	IOH = -400 μA
D007	I LI	Input Leakage Current	-	±1	μA	CS = VCC, VIN = VSS or VCC
D008	I LO	Output Leakage Current	-	±1	μA	CS = VCC, VOUT = VSS or VCC
D009	CINT	Internal Capacitance (All Inputs and Outputs)	-	7	pF	TA = 25°C, FCLK = 1.0 MHz, VCC = 5.0V (Note 2)
D010	ICC Read	Operating Current	-	6	mA	VCC = 5.5V; FCLK = 10.0 MHz; SO = Open
D010	ICC Read	Operating Current	-	2.5	mA	VCC = 2.5V; FCLK = 5.0 MHz; SO = Open
D011	ICC Write	Operating Current	-	5	mA	VCC = 5.5V
D011	ICC Write	Operating Current	-	3	mA	VCC = 2.5V
D012	ICCS	Standby Current	-	5	μA	CS = VCC = 5.5V, Inputs tied to VCC or VSS, +125°C
D012	ICCS	Standby Current	-	1	μA	CS = VCC = 5.5V, Inputs tied to VCC or VSS, +85°C

Note 1: Typical measurements taken at room temperature (+25°C).

2: This parameter is periodically sampled and not 100% tested.

TABLE 1-2: AC CHARACTERISTICS

AC CHARACTERISTICS	AC CHARACTERISTICS	AC CHARACTERISTICS	Industrial (I): TA = -40°C to +85°C Extended (E): TA = -40°C to +125°C	Industrial (I): TA = -40°C to +85°C Extended (E): TA = -40°C to +125°C	Industrial (I): TA = -40°C to +85°C Extended (E): TA = -40°C to +125°C	Industrial (I): TA = -40°C to +85°C Extended (E): TA = -40°C to +125°C
Param. No.	Symbol	Characteristic	Minimum	Maximum	Units	Test Conditions
1			-	10	MHz	4.5V Vcc 5.5V
1		Clock Frequency	-	5	MHz	2.5V Vcc 4.5V
	FCLK		-	3	MHz	1.8V Vcc 2.5V
			50	-	ns	4.5V Vcc 5.5V
2	TCSS	CS Setup Time	100	-	ns	2.5V Vcc 4.5V
			150	-	ns	1.8V Vcc 2.5V
3			100	-	ns	4.5V Vcc 5.5V
3	TCSH	CS Hold Time	200	-	ns	2.5V Vcc 4.5V
3			250	-	ns	1.8V Vcc 2.5V
4	TCSD	CS Disable Time	50	-	ns
			10	-	ns	4.5V Vcc 5.5V
5	TSU	Data Setup Time	20	-	ns	2.5V Vcc 4.5V
5	TSU	Data Setup Time	30	-	ns	1.8V Vcc 2.5V
			20	-	ns	4.5V Vcc 5.5V
6	THD	Data Hold Time	40	-	ns	2.5V Vcc 4.5V
			50	-	ns	1.8V Vcc 2.5V
7	TR	CLK Rise Time	-	100	ns	Note 1
8	TF	CLK Fall Time	-	100	ns	Note 1
			50	-	ns	4.5V Vcc 5.5V
9	THI	Clock High Time	100	-	ns	2.5V Vcc 4.5V
9	THI	Clock High Time	150	-	ns	1.8V Vcc 2.5V
			50	-	ns	4.5V Vcc 5.5V
10	TLO	Clock Low Time	100	-	ns	2.5V Vcc 4.5V
			150	-	ns	1.8V Vcc 2.5V
11	TCLD	Clock Delay Time	50	-	ns
12	TCLE	Clock Enable Time	50	-	ns
			-	50	ns	4.5V Vcc 5.5V
13	TV	Output Valid from Clock Low	-	100	ns	2.5V Vcc 4.5V
			-	160	ns	1.8V Vcc 2.5V
14	THO	Output Hold Time	0	-	ns	Note 1
			-	40	ns	4.5V Vcc 5.5V (Note 1)
15	TDIS	Output Disable Time	-	80	ns	2.5V Vcc 4.5V (Note 1)
			-	160	ns	1.8V Vcc 2.5V (Note 1)
			20	-	ns	4.5V Vcc 5.5V
16	THS	HOLD Setup Time	40	-	ns	2.5V Vcc 4.5V
			80	-	ns	1.8V Vcc 2.5V

Note 1: This parameter is periodically sampled and not 100% tested.

2: TWC begins on the rising edge of CS after a valid write sequence and ends when the internal write cycle is complete.

3: This parameter is not tested but ensured by characterization.

TABLE 1-2: AC CHARACTERISTICS (CONTINUED)

AC CHARACTERISTICS	AC CHARACTERISTICS	AC CHARACTERISTICS	Industrial (I): TA = -40°C to +85°C VCC = 1.8V to 5.5V Extended (E): TA = -40°C to +125°C VCC = 1.8V to 5.5V	Industrial (I): TA = -40°C to +85°C VCC = 1.8V to 5.5V Extended (E): TA = -40°C to +125°C VCC = 1.8V to 5.5V	Industrial (I): TA = -40°C to +85°C VCC = 1.8V to 5.5V Extended (E): TA = -40°C to +125°C VCC = 1.8V to 5.5V	Industrial (I): TA = -40°C to +85°C VCC = 1.8V to 5.5V Extended (E): TA = -40°C to +125°C VCC = 1.8V to 5.5V
Param. No.	Symbol	Characteristic	Minimum	Maximum	Units	Test Conditions
17	THH	HOLD Hold Time	20	-	ns	4.5V Vcc 5.5V
17	THH	HOLD Hold Time	40	-	ns	2.5V Vcc 4.5V
17	THH	HOLD Hold Time	80	-	ns	1.8V Vcc 2.5V
18	THZ	HOLD Low to Output High-Z	-	30	ns	4.5V Vcc 5.5V (Note 1)
18	THZ	HOLD Low to Output High-Z	-	60	ns	2.5V Vcc 4.5V (Note 1)
18	THZ	HOLD Low to Output High-Z	-	160	ns	1.8V Vcc 2.5V (Note 1)
19	THV	HOLD High to Output Valid	-	30	ns	4.5V Vcc 5.5V
19	THV	HOLD High to Output Valid	-	60	ns	2.5V Vcc 4.5V
19	THV	HOLD High to Output Valid	-	160	ns	1.8V Vcc 2.5V
20	TWC	Internal Write Cycle Time	-	5	ms	Note 2
21		Endurance	1M	-	E/W Cycles	+25°C, VCC = 5.5V (Note 3)

Note 1: This parameter is periodically sampled and not 100% tested.

• 2: TWC begins on the rising edge of CS after a valid write sequence and ends when the internal write cycle is complete.
• 3: This parameter is not tested but ensured by characterization.

TABLE 1-3: AC TEST CONDITIONS

• VLO = 0.2V
• VHI = VCC - 0.2V
• VHI = 4.0V
• CL = 50 pF
• Timing Measurement Reference Level
• Input
• Output

Note 1: For VCC 4.0V

2: For VCC > 4.0V

Parameter	Limit
VCC	6.5V
All inputs and outputs w.r.t. VSS	-0.6V to VCC +1.0V
Storage temperature	-65°C to +150°C
Ambient temperature under bias	-40°C to +125°C
ESD protection on all pins	4 kV

† NOTICE: Stresses above those listed under 'Absolute Maximum Ratings' may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for an extended period of time may affect device reliability.

	Units	MILLIMETERS	MILLIMETERS	MILLIMETERS
Dimension Limits	Dimension Limits	MIN	NOM	MAX
Contact Pitch	E		1.27 BSC
Contact Pad Spacing	C		5.40
Contact Pad Width (X8)	X1			0.60
Contact Pad Length (X8)	Y1			1.55

• Dimensioning and tolerancing per ASME Y14.5M 1.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Microchip Technology Drawing C04-2057-SN Rev F

Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging

Note:

For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging

Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging

MPN	Package	Temperature Range	Packing
25LC256-I/MF	8-Lead DFN-S	Industrial (-40°C to +85°C)	null
25LC256-E/MF	8-Lead DFN-S	Extended (-40°C to +125°C)	null
25LC256-I/P	8-Lead PDIP	Industrial (-40°C to +85°C