W25Q128JVEIM
Serial Flash MemoryThe W25Q128JVEIM is a serial flash memory from Winbond Electronics. View the full W25Q128JVEIM datasheet below including electrical characteristics, absolute maximum ratings.
Manufacturer
Winbond Electronics
Category
Memory ICsOverview
Part: W25Q128JV
Type: Serial Flash Memory
Description: 128M-bit (16M-byte) serial flash memory with Standard, Dual, and Quad SPI interfaces, supporting up to 133MHz clock frequency and operating from a 2.7V to 3.6V supply.
Operating Conditions:
- Supply voltage: 2.7V to 3.6V
- Operating temperature: -40°C to +85°C (Industrial Grade), -40°C to +105°C (Industrial Plus Grade)
- Max SPI clock frequency: 133MHz (Single, Dual/Quad SPI)
- Equivalent Dual/Quad SPI clock: 266MHz (Dual I/O), 532MHz (Quad I/O)
Absolute Maximum Ratings:
- Max supply voltage: 4.0V
- Max input/output voltage: VCC+0.4V (max 4.0V)
- Max storage temperature: +150°C
Key Specs:
- Capacity: 128M-bit / 16M-byte
- Page size: 256-bytes
- Sector erase size: 4KB
- Program-Erase cycles: Min. 100K per sector
- Data retention: More than 20-year
- Power-down current: <1μA (typ.)
- Continuous data transfer rate: 66MB/S
Features:
- New Family of SpiFlash Memories
- Flexible Architecture with 4KB sectors
- Standard, Dual, Quad SPI interfaces
- Software & Hardware Reset
- Highest Performance Serial Flash (133MHz clock, 266/532MHz equivalent Dual/Quad SPI)
- Efficient 'Continuous Read' with 8/16/32/64-Byte Wrap
- Low Power (<1μA Power-down)
- Uniform Sector/Block Erase (4K/32K/64K-Byte)
- Erase/Program Suspend & Resume
- Advanced Security Features (Write-Protect, OTP, Unique ID, Security Registers)
Applications:
- Code shadowing to RAM
- Executing code directly from Dual/Quad SPI (XIP)
- Storing voice, text and data
Package:
- 8-Pin SOIC 208-mil (Package Code S)
- 8-Pad WSON 6x5-mm (Package Code P)
- 8-Pad WSON 8x6-mm (Package Code E)
- 24-Ball TFBGA 8x6-mm (5x5-1 ball array, Package Code B)
- 24-Ball TFBGA 8x6-mm (6x4 ball array, Package Code C)
- 24-Ball WLCSP (Package Code Y)
Features
-
- New Family of SpiFlash Memories Flexible Architecture with 4KB sectors
- W25Q128JV: 128M-bit / 16M-byte
- Standard SPI: CLK, /CS, DI, DO
- Dual SPI: CLK, /CS, IO0, IO1
- Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3
- Software & Hardware Reset (1)
- Highest Performance Serial Flash
- 133MHz Single, Dual/Quad SPI clocks
- 266/532MHz equivalent Dual/Quad SPI
- 66MB/S continuous data transfer rate
- Min. 100K Program-Erase cycles per sector
- More than 20-year data retention
- Efficient 'Continuous Read'
- Continuous Read with 8/16/32/64-Byte Wrap
- As few as 8 clocks to address memory
- Allows true XIP (execute in place) operation
- Low Power, Wide Temperature Range
- Single 2.7 to 3.6V supply
- <1μA Power-down (typ.)
- -40°C to +85°C operating range
- -40°C to +105°C operating range
- Uniform Sector/Block Erase (4K/32K/64K-Byte)
- Program 1 to 256 byte per programmable page
- Erase/Program Suspend & Resume
- Advanced Security Features
- Software and Hardware Write-Protect
- Power Supply Lock-Down
- Special OTP protection
- Top/Bottom, Complement array protection
- Individual Block/Sector array protection
- 64-Bit Unique ID for each device
- Discoverable Parameters (SFDP) Register
- 3X256-Bytes Security Registers with OTP locks
- Volatile & Non-volatile Status Register Bits
- Space Efficient Packaging
- 8-pin SOIC 208-mil
- 16-pin SOIC 300-mil (additional /RESET pin)
- 8-pad WSON 6x5-mm / 8x6-mm
- 24-ball TFBGA 8x6-mm (6x4/5x5 ball array)
- 24-ball WLCSP
- Contact Winbond for KGD and other options
Note: 1. Hardware /RESET pin is only available on TFBGA or SOIC16 packages
- 4 - Revision F
Pin Configuration
Figure 1a. W25Q128JV Pin Assignments, 8-pin SOIC 208-mil (Package Code S)
Figure 1a. W25Q128JV Pin Assignments, 8-pin SOIC 208-mil (Package Code S)
Electrical Characteristics
| PARAMETER | SYMBOL | CONDITIONS | SPEC | SPEC | SPEC | UNIT |
|---|---|---|---|---|---|---|
| PARAMETER | SYMBOL | CONDITIONS | MIN | TYP | MAX | UNIT |
| Input Capacitance | CIN (1) | VIN = 0V (1) | 6 | pF | ||
| Output Capacitance | Cout (1) | VOUT = 0V (1) | 8 | pF | ||
| Input Leakage | I LI | ±2 | μA | |||
| I/O Leakage | ILO | ±2 | μA | |||
| Standby Current | ICC1 | /CS = VCC, VIN = GND or VCC | 10 | 60 | μA | |
| Power-down Current | ICC2 | /CS = VCC, VIN = GND or VCC | 1 | 20 | μA | |
| Current Read Data / Dual /Quad 50MHz (2) | ICC3 | C = 0.1 VCC / 0.9 VCC DO = Open | 8 | 15 | mA | |
| Current Read Data / Dual /Quad 80MHz (2) | ICC3 | C = 0.1 VCC / 0.9 VCC DO = Open | 10 | 18 | mA | |
| Current Read Data / Dual /Quad 104MHz (2) | ICC3 | C = 0.1 VCC / 0.9 VCC DO = Open | 12 | 20 | mA | |
| Current Write Status Register | ICC4 | /CS = VCC | 20 | 25 | mA | |
| Current Page Program | ICC5 | /CS = VCC | 20 | 25 | mA | |
| Current Sector/Block Erase | ICC6 | /CS = VCC | 20 | 25 | mA | |
| Current Chip Erase | ICC7 | /CS = VCC | 20 | 25 | mA | |
| Input Low Voltage | VIL | -0.5 | VCC x 0.3 | V | ||
| Input High Voltage | VIH | VCC x 0.7 | VCC + 0.4 | V | ||
| Output Low Voltage | VOL | IOL = 100 μA | 0.2 | V | ||
| Output High Voltage | VOH | IOH = -100 μA | VCC - 0.2 | V |
Absolute Maximum Ratings
| PARAMETERS | SYMBOL | CONDITIONS | RANGE | UNIT |
|---|---|---|---|---|
| Supply Voltage | VCC | -0.6 to 4.6 | V | |
| Voltage Applied to Any Pin | VIO | Relative to Ground | -0.6 to VCC+0.4 | V |
| Transient Voltage on any Pin | VIOT | <20nS Transient Relative to Ground | -2.0V to VCC+2.0V | V |
| Storage Temperature | TSTG | -65 to +150 | ° C | |
| Lead Temperature | TLEAD | See Note (2) | ° C | |
| Electrostatic Discharge Voltage | VESD | Human Body Model (3) | -2000 to +2000 | V |
Related Variants
The following components are covered by the same datasheet.
| Part Number | Manufacturer | Package |
|---|---|---|
| W25Q128JV | Winbond Electronics | 8-pin SOIC 208 |
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