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W25Q128JVCJQ

Serial Flash Memory

The W25Q128JVCJQ is a serial flash memory from Winbond Electronics. View the full W25Q128JVCJQ datasheet below including electrical characteristics, absolute maximum ratings.

Manufacturer

Winbond Electronics

Category

Memory ICs

Overview

Part: W25Q128JV

Type: Serial Flash Memory

Description: 128M-bit (16M-byte) serial flash memory with Standard, Dual, and Quad SPI interfaces, supporting up to 133MHz clock frequency and operating from a 2.7V to 3.6V supply.

Operating Conditions:

  • Supply voltage: 2.7V to 3.6V
  • Operating temperature: -40°C to +85°C (Industrial Grade), -40°C to +105°C (Industrial Plus Grade)
  • Max SPI clock frequency: 133MHz (Single, Dual/Quad SPI)
  • Equivalent Dual/Quad SPI clock: 266MHz (Dual I/O), 532MHz (Quad I/O)

Absolute Maximum Ratings:

  • Max supply voltage: 4.0V
  • Max input/output voltage: VCC+0.4V (max 4.0V)
  • Max storage temperature: +150°C

Key Specs:

  • Capacity: 128M-bit / 16M-byte
  • Page size: 256-bytes
  • Sector erase size: 4KB
  • Program-Erase cycles: Min. 100K per sector
  • Data retention: More than 20-year
  • Power-down current: <1μA (typ.)
  • Continuous data transfer rate: 66MB/S

Features:

  • New Family of SpiFlash Memories
  • Flexible Architecture with 4KB sectors
  • Standard, Dual, Quad SPI interfaces
  • Software & Hardware Reset
  • Highest Performance Serial Flash (133MHz clock, 266/532MHz equivalent Dual/Quad SPI)
  • Efficient 'Continuous Read' with 8/16/32/64-Byte Wrap
  • Low Power (<1μA Power-down)
  • Uniform Sector/Block Erase (4K/32K/64K-Byte)
  • Erase/Program Suspend & Resume
  • Advanced Security Features (Write-Protect, OTP, Unique ID, Security Registers)

Applications:

  • Code shadowing to RAM
  • Executing code directly from Dual/Quad SPI (XIP)
  • Storing voice, text and data

Package:

  • 8-Pin SOIC 208-mil (Package Code S)
  • 8-Pad WSON 6x5-mm (Package Code P)
  • 8-Pad WSON 8x6-mm (Package Code E)
  • 24-Ball TFBGA 8x6-mm (5x5-1 ball array, Package Code B)
  • 24-Ball TFBGA 8x6-mm (6x4 ball array, Package Code C)
  • 24-Ball WLCSP (Package Code Y)

Features

  • New Family of SpiFlash Memories  Flexible Architecture with 4KB sectors
  • W25Q128JV: 128M-bit / 16M-byte
  • Standard SPI: CLK, /CS, DI, DO
  • Dual SPI: CLK, /CS, IO0, IO1
  • Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3
  • Software & Hardware Reset (1)
  •  Highest Performance Serial Flash
  • 133MHz Single, Dual/Quad SPI clocks
  • 266/532MHz equivalent Dual/Quad SPI
  • 66MB/S continuous data transfer rate
  • Min. 100K Program-Erase cycles per sector
  • More than 20-year data retention
  •  Efficient 'Continuous Read'
  • Continuous Read with 8/16/32/64-Byte Wrap
  • As few as 8 clocks to address memory
  • Allows true XIP (execute in place) operation
  •  Low Power, Wide Temperature Range
  • Single 2.7 to 3.6V supply
  • <1μA Power-down (typ.)
  • -40°C to +85°C operating range
  • -40°C to +105°C operating range
  • Uniform Sector/Block Erase (4K/32K/64K-Byte)
  • Program 1 to 256 byte per programmable page
  • Erase/Program Suspend & Resume
  •  Advanced Security Features
  • Software and Hardware Write-Protect
  • Power Supply Lock-Down
  • Special OTP protection
  • Top/Bottom, Complement array protection
  • Individual Block/Sector array protection
  • 64-Bit Unique ID for each device
  • Discoverable Parameters (SFDP) Register
  • 3X256-Bytes Security Registers with OTP locks
  • Volatile & Non-volatile Status Register Bits
  •  Space Efficient Packaging
  • 8-pin SOIC 208-mil
  • 16-pin SOIC 300-mil (additional /RESET pin)
  • 8-pad WSON 6x5-mm / 8x6-mm
  • 24-ball TFBGA 8x6-mm (6x4/5x5 ball array)
  • 24-ball WLCSP
  • Contact Winbond for KGD and other options

Note: 1. Hardware /RESET pin is only available on TFBGA or SOIC16 packages

  • 4 - Revision F

Pin Configuration

Figure 1a. W25Q128JV Pin Assignments, 8-pin SOIC 208-mil (Package Code S)

Figure 1a. W25Q128JV Pin Assignments, 8-pin SOIC 208-mil (Package Code S)

Electrical Characteristics

PARAMETERSYMBOLCONDITIONSSPECSPECSPECUNIT
PARAMETERSYMBOLCONDITIONSMINTYPMAXUNIT
Input CapacitanceCIN (1)VIN = 0V (1)6pF
Output CapacitanceCout (1)VOUT = 0V (1)8pF
Input LeakageI LI±2μA
I/O LeakageILO±2μA
Standby CurrentICC1/CS = VCC, VIN = GND or VCC1060μA
Power-down CurrentICC2/CS = VCC, VIN = GND or VCC120μA
Current Read Data / Dual /Quad 50MHz (2)ICC3C = 0.1 VCC / 0.9 VCC DO = Open815mA
Current Read Data / Dual /Quad 80MHz (2)ICC3C = 0.1 VCC / 0.9 VCC DO = Open1018mA
Current Read Data / Dual /Quad 104MHz (2)ICC3C = 0.1 VCC / 0.9 VCC DO = Open1220mA
Current Write Status RegisterICC4/CS = VCC2025mA
Current Page ProgramICC5/CS = VCC2025mA
Current Sector/Block EraseICC6/CS = VCC2025mA
Current Chip EraseICC7/CS = VCC2025mA
Input Low VoltageVIL-0.5VCC x 0.3V
Input High VoltageVIHVCC x 0.7VCC + 0.4V
Output Low VoltageVOLIOL = 100 μA0.2V
Output High VoltageVOHIOH = -100 μAVCC - 0.2V

Absolute Maximum Ratings

PARAMETERSSYMBOLCONDITIONSRANGEUNIT
Supply VoltageVCC-0.6 to 4.6V
Voltage Applied to Any PinVIORelative to Ground-0.6 to VCC+0.4V
Transient Voltage on any PinVIOT<20nS Transient Relative to Ground-2.0V to VCC+2.0VV
Storage TemperatureTSTG-65 to +150° C
Lead TemperatureTLEADSee Note (2)° C
Electrostatic Discharge VoltageVESDHuman Body Model (3)-2000 to +2000V

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