TXS0102

TXS0102 2-Bit Bidirectional Voltage-Level Translator for Open-Drain and Push-Pull Applications

Manufacturer

Overview

Part: TXS0102, Texas Instruments

Type: 2-Bit Bidirectional Voltage-Level Translator for Open-Drain and Push-Pull Applications

Key Specs:

Maximum data rate (push pull): 24Mbps
Maximum data rate (open drain): 2Mbps
A port voltage range: 1.65V to 3.6V
B port voltage range: 2.3V to 5.5V
A port HBM ESD protection: 2500V
B port HBM ESD protection: 8000V
A port CDM ESD protection: 1500V
B port CDM ESD protection: 1500V

Features:

No direction-control signal needed
VCC isolation feature
No power-supply sequencing required
Ioff supports partial-power-down mode operation
Latch-up performance exceeds 100mA per JESD 78, Class II
ESD protection exceeds JESD 22
Available in the Texas Instruments NanoStar™ integrated circuit package

Applications:

I2C / SMBus
UART
GPIO

Package:

DCT (SSOP, 8): 2.95mm × 4mm
DCU (VSSOP, 8): 2mm × 3.1mm
DQE (X2SON, 8): 1.4mm × 1mm
DQM (SON, 8): 1.8mm × 1.2mm
YZP (DSBGA, 8): 1.9mm x 0.9mm
DTT (DSBGA, 8): 1.95mm × 1mm

Features

No direction-control signal needed
Maximum data rates:
- 24Mbps (push pull)
- 2Mbps (open drain)
Available in the Texas Instruments NanoStar™ integrated circuit package
1.65V to 3.6V on A port and 2.3V to 5.5V on B port (VCCA ≤ VCCB)
VCC isolation feature: if either VCC input is at GND, both ports are in the High-Impedance state
No power-supply sequencing required: either VCCA or VCCB can be ramped first
Ioff supports partial-power-down mode operation
Latch-up performance exceeds 100mA per JESD 78, Class II
ESD protection exceeds JESD 22:
- A port:
  - 2500V Human-Body Model (A114-B)
  - 250V Machine Model (A115-A)
  - 1500V Charged-Device Model (C101)
- B port:
  - 8kV Human-Body Model (A114-B)
  - 250V Machine Model (A115-A)
  - 1500V Charged-Device Model (C101)

Pin Configuration

Figure 4-1. YZP Package, 8-Pin DSBGA (Bottom View)

Figure 4-2. DCT or DCU Package, 8-Pin SSOP and VSSOP (Top View)

V_CCA	[[]	1 8	V _CCE
Α1	2 1	1_7_	B1
A2	3_1	ı 6	B2
GND	_4_1	1_5_	OE

Figure 4-3. DQE or DQM Package, 8-Pin X2SON (Top View)

B2 (1) (8) B1 GND (2) (7) V_CCB V_CCA (3) (6) OE A2 (4) (5) A1

Figure 4-4. DTT Package, 8-Pin SOP (Top View)

Table 4-1. Pin Functions

		PIN
		NO.
NAME	DCT, DCU, DTT	DQE, DQM
A1	5	2
A2	4	3
B1	8	7
B2	1	6
GND	2	4
OE	6	5
V _CCA	3	1
V _CCB	7	8
⁽¹⁾ I = input, O = output, I/O = input and output, P = power

Electrical Characteristics

over operating free-air temperature range (unless otherwise noted)(1) (2) (3)

					Ope	erating f	free-ai	r tempera	ature (T	A)
P	PARAMETER	TEST CONDITIONS	V _CCA	V _CCB		25°C		-40°	C to 85	°C
					MIN	TYP	MAX	MIN	TYP	MAX
V _OHA	Port A output high voltage	I_OH = -20uA V_IB ≥ V_CCB - 0.4V	1.65V to 3.6V	2.3V to 5.5V				V _CCA x 0.67
V _OLA	Port A output low voltage	I_OL = 1mA V_IB ≤ 0.15V	1.65V to 3.6V	2.3V to 5.5V						0.4
V _OHB	Port B output high voltage	I_OH = -20uA V_IB ≥ V_CCB - 0.4V	1.65V to 3.6V	2.3V to 5.5V				V _CCB x 0.67
V _OLB	Port B output low voltage	I_OL = 1mA V_IB ≤ 0.15V	1.65V to 3.6V	2.3V to 5.5V						0.4
I	Input leakage current	OE V _I = V _CC or GND	1.65V to 3.6V	2.3V to 5.5V			±1			±2
	Partial power down current	A port	0V	0V to 5.5V			±1			±2
I _off	Partial power down current	B port	0V to 3.6V	0V			±1			±2
l _OZ	Tri-state output current	A or B Port: V₁ = V_CC1 or GND V₀ = V_CCO or GND OE = GND	1.65V to 3.6V	2.3V to 5.5V	-1		1	-2		2
I _CCA	V _CCA supply current	V_I = V_CCI or GND I_O = 0	1.65V to V _CCB	2.3V to 5.5V						2.4
I _CCA	V _CCA supply current	V_I = V_CCI or GND I_O = 0	3.6V	0V						2.2
I _CCA	V _CCA supply current	V_I = V_CCI or GND I_O = 0	0V	5.5V				-2
I _CCB	V _CCB supply current	V_I = V_CCI or GND I_O = 0	1.65V to V _CCB	2.3V to 5.5V						12
I _CCB	V _CCB supply current	V_I = V_CCI or GND I_O = 0	3.6V	0V				-1
I _CCB	V _CCB supply current	V_I = V_CCI or GND I_O = 0	0V	5.5V						3
I _CCA + I _CCB	Combined supply current	V_I = V_CCI or GND I_O = 0	1.65V to V _CCB	2.3V to 5.5V						14.4
C _i	Input Capacitance	OE	3.3V	3.3V		2.5				3.5
C _io	Input-to-output internal capacitance	A or B port	3.3V	3.3V		10
C _io	Input-to-output internal capacitance	A port	3.3V	3.3V		5			6
C _io	Input-to-output internal capacitance	B port	3.3V	3.3V		6			7.5

begin{array}{ll} hbox{(1)} & V_CCI is the V_CC associated with the input port hbox{(2)} & V_CCA must be less than or equal to V_CCB, and V_CCA must not exceed 3.6V.

⁽³⁾ V_CCO is the V_CC associated with the output port

Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)

			MIN	MAX	UNIT
VCCA	Supply voltage A		–0.5	4.6	V
VCCB	Supply voltage B		–0.5	6.5	V
	Input Voltage(2)	A Port	–0.5	4.6
VI		B Port	–0.5	6.5	V
	Voltage applied to any output in the high-impedance or power-off	A Port	–0.5	4.6
VO	state(2)	B Port	–0.5	6.5	V
		A Port		–0.5 VCCA + 0.5
VO	Voltage applied to any output in the high or low state(2) (3)	B Port		–0.5 VCCB + 0.5	V
IIK	Input clamp current	VI < 0		–50	mA
IOK	Output clamp current	VO < 0		–50	mA
IO	Continuous output current			±50	mA
	Continuous current through VCC or GND			±100	mA
Tj	Junction Temperature			150	°C
Tstg	Storage temperature		–65	150	°C

⁽¹⁾ Stresses beyond those listed under Section 5.1 may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Section 5.3 Exposure beyond the limits listed in Section 5.3 may affect device reliability.

Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted) (1) (2) (3) (4) (5)

			V _CCA	V _CCB	MIN	MAX	UNIT
V _CCA	Supply voltage A		·	•	1.65	3.6	V
V _CCB	Supply voltage B				2.3	5.5	V
		A-port I/O's	1.65V to 1.95V		V _CCI - 0.2	V _CCI
	High level input voltage		2.3V to 3.6V	2.3V to 5.5V	V _CCI - 0.4	V _CCI	V
V _IH	High-level input voltage	B-port I/O's	1.65V to 3.6V	2.30 10 5.50	V _CCI - 0.4	V _CCI	V
		OE Input	1.65V to 3.6V		V _CCA x 0.65	5.5
		A-port I/O's			0	0.15
V _IL	Low-level input voltage	B-port I/O's	1.65V to 3.6V	2.3V to 5.5V	0	0.15	V
, IL	_on ison input isings	OE Input			0	V _CCA x 0.35	•
		A-port I/O's				10	ns/V
Δt/Δν	Input transition rise and fall time	B-port I/O's	1.65V to 3.6V	2.3V to 5.5V		10	ns/V
		OE Input				10	ns/V
T _A	Operating free-air temperature	•		•	-40	85	°C

(1) V_CCI is the V_CC associated with the input port.
(2) V_CCO is the V_CC associated with the output port. (3) The maximum V_IL value is provided to ensure that a valid V_OL is maintaned. The V_OL value is V_IL plus the voltage drop across the pass-gate transistor.
(4) V_CCA must be less than or equal to V_CCB , and V_CCA must not exceed 3.6V.
(5) All unused inputs of the device must be held at V_CC or GND to ensure proper device operation. Refer to the TI application note, Implications of Slow or Floating CMOS Inputs

5.4 Thermal Information

					TXS0102
T	HERMAL METRIC(1)	DCU	DQE	DCT	DTT
		8 PINS	8 PINS	8 PINS	8 PINS
R_{θ JA}	Junction-to-ambient thermal resistance	239.8	229.6	168.5	219.8
R _θJC(top)	Junction-to-case (top) thermal resistance	88.5	89.1	84.6	139.0
R _θJB	Junction-to-board thermal resistance	151.6	128.0	96.1	122.3
Y _JT	Junction-to-top characterization parameter	30.9	2.8	15.1	17.5
Y _JB	Junction-to-board characterization parameter	150.5	127.7	94.7	122.2
R _θ JC(bottom)	Junction-to-case (bottom) thermal resistance	N/A	N/A	N/A	N/A

⁽¹⁾ For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application note.

5.5 Electrical Characteristics

over operating free-air temperature range (unless otherwise noted)(1) (2) (3)

					Ope	erating f	free-ai	r tempera	ature (T	A)
P	PARAMETER	TEST CONDITIONS	V _CCA	V _CCB		25°C		-40°	C to 85	°C
					MIN	TYP	MAX	MIN	TYP	MAX
V _OHA	Port A output high voltage	I_OH = -20uA V_IB ≥ V_CCB - 0.4V	1.65V to 3.6V	2.3V to 5.5V				V _CCA x 0.67
V _OLA	Port A output low voltage	I_OL = 1mA V_IB ≤ 0.15V	1.65V to 3.6V	2.3V to 5.5V						0.4
V _OHB	Port B output high voltage	I_OH = -20uA V_IB ≥ V_CCB - 0.4V	1.65V to 3.6V	2.3V to 5.5V				V _CCB x 0.67
V _OLB	Port B output low voltage	I_OL = 1mA V_IB ≤ 0.15V	1.65V to 3.6V	2.3V to 5.5V						0.4
I	Input leakage current	OE V _I = V _CC or GND	1.65V to 3.6V	2.3V to 5.5V			±1			±2
	Partial power down current	A port	0V	0V to 5.5V			±1			±2
I _off	Partial power down current	B port	0V to 3.6V	0V			±1			±2
l _OZ	Tri-state output current	A or B Port: V₁ = V_CC1 or GND V₀ = V_CCO or GND OE = GND	1.65V to 3.6V	2.3V to 5.5V	-1		1	-2		2
I _CCA	V _CCA supply current	V_I = V_CCI or GND I_O = 0	1.65V to V _CCB	2.3V to 5.5V						2.4
I _CCA	V _CCA supply current	V_I = V_CCI or GND I_O = 0	3.6V	0V						2.2
I _CCA	V _CCA supply current	V_I = V_CCI or GND I_O = 0	0V	5.5V				-2
I _CCB	V _CCB supply current	V_I = V_CCI or GND I_O = 0	1.65V to V _CCB	2.3V to 5.5V						12
I _CCB	V _CCB supply current	V_I = V_CCI or GND I_O = 0	3.6V	0V				-1
I _CCB	V _CCB supply current	V_I = V_CCI or GND I_O = 0	0V	5.5V						3
I _CCA + I _CCB	Combined supply current	V_I = V_CCI or GND I_O = 0	1.65V to V _CCB	2.3V to 5.5V						14.4
C _i	Input Capacitance	OE	3.3V	3.3V		2.5				3.5
C _io	Input-to-output internal capacitance	A or B port	3.3V	3.3V		10
C _io	Input-to-output internal capacitance	A port	3.3V	3.3V		5			6
C _io	Input-to-output internal capacitance	B port	3.3V	3.3V		6			7.5

begin{array}{ll} hbox{(1)} & V_CCI is the V_CC associated with the input port hbox{(2)} & V_CCA must be less than or equal to V_CCB, and V_CCA must not exceed 3.6V.

⁽³⁾ V_CCO is the V_CC associated with the output port

Thermal Information

					TXS0102
T	HERMAL METRIC(1)	DCU	DQE	DCT	DTT
		8 PINS	8 PINS	8 PINS	8 PINS
R_{θ JA}	Junction-to-ambient thermal resistance	239.8	229.6	168.5	219.8
R _θJC(top)	Junction-to-case (top) thermal resistance	88.5	89.1	84.6	139.0
R _θJB	Junction-to-board thermal resistance	151.6	128.0	96.1	122.3
Y _JT	Junction-to-top characterization parameter	30.9	2.8	15.1	17.5
Y _JB	Junction-to-board characterization parameter	150.5	127.7	94.7	122.2
R _θ JC(bottom)	Junction-to-case (bottom) thermal resistance	N/A	N/A	N/A	N/A

⁽¹⁾ For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application note.

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