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ADM3053BRWZ

Signal and Power Isolated CAN Transceiver

The ADM3053BRWZ is a signal and power isolated can transceiver from Analog Devices. View the full ADM3053BRWZ datasheet below including key specifications, absolute maximum ratings.

ADM3053BRWZ shares its datasheet with ADM3053, whose page lists every part number it covers.

Official ADM3053BRWZ datasheet (PDF) — the source this page was extracted from.

Manufacturer

Analog Devices

ADM3053BRWZ Key Specifications

ParameterValue
Thermal Shutdown150°C trip, 140°C re-enable
Isolation Voltage2.5 kV rms (2500 V rms for 1 minute per UL 1577)
Maximum Bus Nodes110 or more
Maximum Data Rate1 Mbps
VCC Supply Voltage4.5V to 5.5V
Standards ComplianceISO 11898
VIO Logic Supply Voltage3.0V to 5.5V
Operating Temperature Range-40°C to +85°C
Common-Mode Transient Immunity>25 kV/µs
Logic Side Supply Current (1 Mbps)139 mA typ, 170 mA max
Working Insulation Voltage (VIORM)560 V peak
Logic Side Supply Current (Dominant)195 mA typ, 232 mA max
Logic Side Supply Current (Recessive)29 mA typ, 36 mA max

ADM3053BRWZ Overview

Part: ADM3053 — Analog Devices

Type: Isolated CAN Transceiver with Integrated isoPower DC-to-DC Converter

Description: 2.5 kV rms signal and power isolated ISO 11898 CAN transceiver with integrated isolated dc-to-dc converter, powered from a single 5 V supply and supporting data rates up to 1 Mbps.

Operating Conditions:

  • Supply voltage: VCC 4.5–5.5 V; VIO 3.0–5.5 V
  • Operating temperature: -40 to +85 °C
  • Data rate: up to 1 Mbps

Absolute Maximum Ratings:

  • Max supply voltage: VCC -0.5 to +6 V; VIO -0.5 to +6 V
  • CANH, CANL: -36 V to +36 V
  • Max junction temperature: 130 °C
  • Storage temperature: -55 to +150 °C
  • ESD (HBM): 3 kV

Key Specs:

  • Logic-side isoPower supply current (VCC = 5 V, RL = 60 Ω): 29 mA typ / 36 mA max recessive; 195 mA typ / 232 mA max dominant; 139 mA typ / 170 mA max at 1 Mbps
  • Logic-side iCoupler current at 1 Mbps: 1.6 mA typ, 2.5 mA max
  • Driver differential output voltage: 1.5–3.0 V (TxD low, RL = 45 Ω)
  • Receiver differential input: recessive -1.0 to +0.5 V, dominant 0.9 to 5.0 V (-7 V < VCANL, VCANH < +12 V)
  • Receiver input hysteresis: 150 mV typ
  • Driver propagation delay: tonTxD 90 ns max, toffTxD 120 ns max (RS = 0 Ω, RL = 60 Ω, CL = 100 pF)
  • Common-mode transient immunity: 25 kV/μs min (VCM = 1 kV)
  • Reference output VREF: 2.025–3.025 V (|IREF| = 50 μA)
  • Rated dielectric insulation voltage: 2500 V rms for 1 minute

Features:

  • Signal and power isolated CAN transceiver with integrated isoPower dc-to-dc converter
  • 5 V operation on VCC; 5 V or 3.3 V operation on VIO
  • Complies with ISO 11898
  • Unpowered nodes do not disturb the bus; 110 or more nodes on the bus
  • Slope control for reduced EMI
  • Current limiting and thermal shutdown protection
  • Safety approvals: UL 1577 (2500 V rms), CSA Component Acceptance Notice 5A, VDE 0884 Part 2 (VIORM = 560 V peak)

Applications:

  • CAN data buses
  • Industrial field networks

Package:

  • 20-lead wide-body SOIC

ADM3053BRWZ Features

2.5 kV rms signal and power isolated CAN transceiver iso Power integrated isolated dc-to-dc converter 5 V operation on VCC 5 V or 3.3 V operation on VIO Complies with ISO 11898 standard High speed data rates of up to 1 Mbps Unpowered nodes do not disturb the bus Connect 110 or more nodes on the bus Slope control for reduced EMI Thermal shutdown protection High common-mode transient immunity: >25 kV/μs Safety and regulatory approvals UL recognition 2500 V rms for 1 minute per UL 1577 CSA Component Acceptance Notice 5A VDE Certificate of Conformity DIN EN 60747-5-2 (VDE 0884 Part 2): 2003-01 VIORM = 560 V peak Industrial operating temperature range (-40°C to +85°C)

Available in wide-body, 20-lead SOIC package

ADM3053BRWZ Applications

The ADM3053 signal and power isolated CAN transceiver contains an iso Power integrated dc-to-dc converter, requiring no external interface circuitry for the logic interfaces. Power supply bypassing is required at the input and output supply pins (see Figure 28). The power supply section of the ADM3053 uses a 180 MHz oscillator frequency to pass power efficiently through its chipscale transformers. In addition, the normal operation of the data section of the i Coupler introduces switching transients on the power supply pins.

Bypass capacitors are required for several operating frequencies. Noise suppression requires a low inductance, high frequency capacitor, whereas ripple suppression and proper regulation require a large value capacitor. These capacitors are connected between GND1 and Pin 6 (VIO) for VIO. It is recommended that a combination of 100 nF and 10 nF be placed as shown in Figure 28 (C6 and C4). It is recommended that a combination of two capacitors, with values of 100 nF and 10 μF, are placed between Pin 8 (VCC) and Pin 9 (GND1) for VCC as shown in Figure 28 (C2 and C1). The VISOIN and VISOOUT capacitors are connected between Pin 11 (GND2) and Pin 12 (VISOOUT) with recommended values of 100 nF and 10 μF as shown in Figure 28 (C5 and C8). Two capacitors are recommended to be fitted Pin 19 (VISOIN) and Pin 20 (GND2) with values of 100nF and 10nF as shown in Figure 28 (C9 and C7). The best practice recommended is to use a very low inductance ceramic capacitor, or its equivalent, for the smaller value. The total lead length between both ends of the capacitor and the input power supply pin must not exceed 10 mm.

Figure 28. Recommended PCB Layout

In applications involving high common-mode transients, ensure that board coupling across the isolation barrier is minimized. Furthermore, design the board layout such that any coupling that does occur equally affects all pins on a given component side.

Failure to ensure this can cause voltage differentials between pins exceeding the absolute maximum ratings for the device, thereby leading to latch-up and/or permanent damage.

The ADM3053 dissipates approximately 650 mW of power when fully loaded. Because it is not possible to apply a heat sink to an isolation device, the devices primarily depend on heat dissipation into the PCB through the GND pins. If the devices are used at high ambient temperatures, provide a thermal path from the GND pins to the PCB ground plane. The board layout in Figure 28 shows enlarged pads for Pin 1, Pin 3, Pin 9, Pin 10, Pin 11, Pin 14, Pin 16, and Pin 20. Implement multiple vias from the pad to the ground plane to reduce the temperature inside the chip significantly. The dimensions of the expanded pads are at the discretion of the designer and dependent on the available board space.

ADM3053BRWZ Pin Configuration

Figure 4. Pin Configuration

Figure 4. Pin Configuration

Table 8. Pin Function Descriptions

Pin No.MnemonicDescription
1GND1Ground, Logic Side.
2NCNo Connect. Do not connect to this pin.
3GND1Ground, Logic Side.
4RxDReceiver Output Data.
5TxDDriver Input Data.
6V IOi Coupler Power Supply. It is recommended that a 0.1 μF and a 0.01 μF decoupling capacitor be fitted between Pin 6 and GND1. See Figure 28 for layout recommendations.
7GND1Ground, Logic Side.
8V CCiso Power Power Supply. It is recommended that a 0.1 μF and a 10 μF decoupling capacitor be fitted between Pin 8 and Pin 9.
9GND1Ground, Logic Side.
10GND1Ground, Logic Side.
11GND2Ground, Bus Side.
12V ISOOUTIsolated Power Supply Output. This pin must be connected externally toV ISOIN . It is recommended that a reservoir capacitor of 10 μF and a decoupling capacitor of 0.1 μF be fitted between Pin 12 and Pin 11.
13GND2Ground (Bus Side).
14V REFReference Voltage Output.
15CANLLow-Level CANVoltage Input/Output.
16GND2Ground (Bus Side).
17CANHHigh-Level CANVoltage Input/Output.
18R SSlope Resistor Input.
19V ISOINIsolated Power Supply Input. This pin must be connected externally toV ISOOUT . It is recommended that a 0.1 μF and a 0.01 μF decoupling capacitor be fitted between Pin 19 and Pin 20.
20GND2Ground (Bus Side).

ADM3053BRWZ Absolute Maximum Ratings

TA = 25°C, unless otherwise noted. All voltages are relative to their respective ground.

ADM3053BRWZ Thermal Information

The ADM3053 contains thermal shutdown circuitry that protects the part from excessive power dissipation during fault conditions. Shorting the driver outputs to a low impedance source can result in high driver currents. The thermal sensing circuitry detects the increase in die temperature under this condition and disables the driver outputs. This circuitry is designed to disable the driver outputs when a die temperature of 150°C is reached. As the device cools, the drivers are reenabled at a temperature of 140°C.

ADM3053BRWZ Typical Application

Figure 32 is an example circuit diagram using the ADM3053.

Figure 32. Example Circuit Diagram Using the ADM3053

09293-016

Variants on the same datasheet

These parts have exact links to the same datasheet. They are candidates to compare, not verified drop-in replacements; check package, pinout and electrical limits.

Part NumberManufacturerPackage
ADM3053Analog Devices20-lead wide-body SOIC
ADM3053BRWZ-REEL7Analog Devices—

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