Part: ADM3053 — Analog Devices

Type: Signal and Power Isolated CAN Transceiver with Integrated Isolated DC-to-DC Converter

Description: The ADM3053 is a 2.5 kV rms signal and power isolated CAN transceiver with an integrated isolated dc-to-dc converter, complying with ISO 11898 standard and supporting high-speed data rates up to 1 Mbps.

Operating Conditions:

• Supply voltage: 4.5 V ≤ VCC ≤ 5.5 V, 3.0 V ≤ VIO ≤ 5.5 V
• Operating temperature: -40°C to +85°C
• Data rate: Up to 1 Mbps

Absolute Maximum Ratings:

• Max supply voltage (VCC, VIO): +6 V
• Max CANH, CANL voltage: -36 V to +36 V
• Max junction temperature: 130°C
• Max storage temperature: -55°C to +150°C

Key Specs:

• Logic Side isoPower Current (Dominant State): 195 mA (typ) at R L = 60 Ω, R S = low
• Logic Side iCoupler Current (1 Mbps): 1.6 mA (typ)
• Differential Output Voltage (Dominant): 1.5 V (min) to 3.0 V (max) at R L = 45 Ω
• Differential Input Voltage Recessive: -1.0 V (min) to +0.5 V (max)
• CANH, CANL Input Resistance: 5 kΩ (min) to 25 kΩ (max)
• Common-Mode Transient Immunity: 25 kV/μs (min)
• Rated Dielectric Insulation Voltage: 2500 V rms (1-minute duration)
• Propagation Delay from TxD On to Bus Active: 90 ns (max)

Features:

• 2.5 kV rms signal and power isolation
• Integrated isolated dc-to-dc converter (isoPower)
• 5 V operation on VCC, 5 V or 3.3 V operation on VIO
• Complies with ISO 11898 standard
• High speed data rates of up to 1 Mbps
• Unpowered nodes do not disturb the bus
• Connect 110 or more nodes on the bus
• Slope control for reduced EMI
• Thermal shutdown protection
• High common-mode transient immunity: >25 kV/μs
• UL, CSA, VDE safety and regulatory approvals

Applications:

• CAN data buses
• Industrial field networks

Package:

• 20-lead SOIC (wide-body)

2.5 kV rms signal and power isolated CAN transceiver iso Power integrated isolated dc-to-dc converter 5 V operation on VCC 5 V or 3.3 V operation on VIO Complies with ISO 11898 standard High speed data rates of up to 1 Mbps Unpowered nodes do not disturb the bus Connect 110 or more nodes on the bus Slope control for reduced EMI Thermal shutdown protection High common-mode transient immunity: >25 kV/μs Safety and regulatory approvals UL recognition 2500 V rms for 1 minute per UL 1577 CSA Component Acceptance Notice 5A VDE Certificate of Conformity DIN EN 60747-5-2 (VDE 0884 Part 2): 2003-01 VIORM = 560 V peak Industrial operating temperature range (-40°C to +85°C)

Available in wide-body, 20-lead SOIC package

The ADM3053 signal and power isolated CAN transceiver contains an iso Power integrated dc-to-dc converter, requiring no external interface circuitry for the logic interfaces. Power supply bypassing is required at the input and output supply pins (see Figure 28). The power supply section of the ADM3053 uses a 180 MHz oscillator frequency to pass power efficiently through its chipscale transformers. In addition, the normal operation of the data section of the i Coupler introduces switching transients on the power supply pins.

Bypass capacitors are required for several operating frequencies. Noise suppression requires a low inductance, high frequency capacitor, whereas ripple suppression and proper regulation require a large value capacitor. These capacitors are connected between GND1 and Pin 6 (VIO) for VIO. It is recommended that a combination of 100 nF and 10 nF be placed as shown in Figure 28 (C6 and C4). It is recommended that a combination of two capacitors, with values of 100 nF and 10 μF, are placed between Pin 8 (VCC) and Pin 9 (GND1) for VCC as shown in Figure 28 (C2 and C1). The VISOIN and VISOOUT capacitors are connected between Pin 11 (GND2) and Pin 12 (VISOOUT) with recommended values of 100 nF and 10 μF as shown in Figure 28 (C5 and C8). Two capacitors are recommended to be fitted Pin 19 (VISOIN) and Pin 20 (GND2) with values of 100nF and 10nF as shown in Figure 28 (C9 and C7). The best practice recommended is to use a very low inductance ceramic capacitor, or its equivalent, for the smaller value. The total lead length between both ends of the capacitor and the input power supply pin must not exceed 10 mm.

Figure 28. Recommended PCB Layout

In applications involving high common-mode transients, ensure that board coupling across the isolation barrier is minimized. Furthermore, design the board layout such that any coupling that does occur equally affects all pins on a given component side.

Failure to ensure this can cause voltage differentials between pins exceeding the absolute maximum ratings for the device, thereby leading to latch-up and/or permanent damage.

The ADM3053 dissipates approximately 650 mW of power when fully loaded. Because it is not possible to apply a heat sink to an isolation device, the devices primarily depend on heat dissipation into the PCB through the GND pins. If the devices are used at high ambient temperatures, provide a thermal path from the GND pins to the PCB ground plane. The board layout in Figure 28 shows enlarged pads for Pin 1, Pin 3, Pin 9, Pin 10, Pin 11, Pin 14, Pin 16, and Pin 20. Implement multiple vias from the pad to the ground plane to reduce the temperature inside the chip significantly. The dimensions of the expanded pads are at the discretion of the designer and dependent on the available board space.

ADM3053 Pinout

Package: 20-lead wide-body SOIC

Notes

• Pin 2 (NC): Do not connect to this pin.
• Pins 12 and 19: Must be connected externally to each other (V_ISOOUT to V_ISOIN).
• Logic side (GND1): Pins 1, 3, 7, 9, 10
• Bus side (GND2): Pins 11, 13, 16, 20
• Pin diagram confirms all pin numbers and names match the text table exactly.

TA = 25°C, unless otherwise noted. All voltages are relative to their respective ground.

The ADM3053 contains thermal shutdown circuitry that protects the part from excessive power dissipation during fault conditions. Shorting the driver outputs to a low impedance source can result in high driver currents. The thermal sensing circuitry detects the increase in die temperature under this condition and disables the driver outputs. This circuitry is designed to disable the driver outputs when a die temperature of 150°C is reached. As the device cools, the drivers are reenabled at a temperature of 140°C.

Figure 32 is an example circuit diagram using the ADM3053.

Figure 32. Example Circuit Diagram Using the ADM3053

09293-016

No ordering information table or variants found in the provided text.