TPS65988

Part: TPS65988 from Texas Instruments

Type: Dual Port USB Type-C and USB PD Controller

Key Specs:

• Ability to source and sink up to 20 V/5 A
• Integrated two 5-20 V, 5-A, 25-mΩ bidirectional switches
• 13 configurable GPIOs
• USB PD 3.0 certified
• USB Type-C specification certified

Features:

• Alternate mode support (DisplayPort)
• Control for external DC/DC supplies, high speed data muxes, and other peripheral devices
• GUI tool for configuration
• Power supply from 3.3 V or VBUS source
• 3.3-V LDO output for dead battery support
• Integrated robust power path protection (reverse current, undervoltage, overvoltage, slew rate control, current limiting for inrush current)
• BC1.2 charging support
• Cable attach and orientation detection
• Integrated VCONN switch
• Physical layer and policy engine
• 1 I2C primary or secondary port
• 1 I2C primary only port
• 1 I2C secondary only port

Applications:

• Single board computer
• Power tools, power banks, retail automation and payment
• Wireless speakers, headphones
• Other personal electronics and industrial applications
• Docking station
• Flat panel monitor

Package:

• QFN (RSH56): 7.00 mm x 7.00 mm

• This device is certified by the USB-IF for PD3.0

  • PD3.0 silicon is required for certification of new USB PD designs
    • TID#: 1099
  • Article on PD2.0 vs. PD3.0

• TPS65988 is a fully configurable dual port USB PD device controller

  • Ability to source and sink up to 20 V/5 A
  • Alternate mode support
    • DisplayPort
  • Control for external DC/DC supplies, high speed data muxes, and other peripheral devices through either GPIO or I2C
    • Ex: TPS65988EVM
  • GUI tool to easily configure TPS65988 for various applications TPS65988X-CONFIG
  • Power management
    • Power supply from 3.3 V or VBUS source
    • 3.3-V LDO output for dead battery support
  • For a more extensive selection guide and getting started information, please refer to www.ti.com/usb-c and E2E guide

• Integrated fully managed power paths:

  • Integrated two 5-20 V, 5-A, 25-mΩ bidirectional switches
  • UL2367 cert #: 20190107-E169910
  • IEC62368-1 cert #: US-34617-UL

• Integrated robust power path protection

  • Integrated reverse current protection, undervoltage protection, overvoltage protection, and slew rate control for both 20-V/5-A power paths when configured to Sink
  • Integrated undervoltage protection, overvoltage protection, and current limiting for inrush current protection for both 20-V/5-A power paths when configured to Source

• USB Type-C® power delivery (PD) controller

  • 13 configurable GPIOs
  • BC1.2 charging support
  • USB PD 3.0 certified
  • USB Type-C specification certified
  • Cable attach and orientation detection
  • Integrated VCONN switch
  • Physical layer and policy engine
  • 3.3-V LDO output for dead battery support
  • Power supply from 3.3 V or VBUS source
  • 1 I2C primary or secondary port
  • 1 I2C primary only port

• 1 I2C secondary only port

• Single board computer
• Power tools, power banks, retail automation and payment
• Wireless speakers, headphones
• Other personal electronics and industrial applications
• Docking station
• Flat panel monitor

Figure 5-1. RSH Package 56-Pin QFN Top View

Table 5-1. Pin Functions

• NAME
• GPIO13
• GPIO14 (PWM)
• GPIO15 (PWM)
• GPIO16 (PP_EXT1)
• GPIO17 (PP_EXT2)
• HRESET
• I2C1_IRQ
• I2C1_SCL
• I2C1_SDA
• I2C2_IRQ
• I2C2_SCL
• I2C2_SDA
• LDO_1V8
• LDO_3V3
• PP1_CABLE
• PP2_CABLE
• PP_HV1
• PP_HV2
• SPI_CLK
• SPI_POCI

Table 5-1. Pin Functions (continued)

• NAME
• SPI_PICO
• SPI_CS
• VBUS1
• VBUS2
• VIN_3V3
• Thermal Pad (PPAD)

⁽¹⁾ Reset State indicates the state of a given pin immediately following power application, prior to any configuration from firmware.

⁽²⁾ I = input, O = output, I/O = bidirectional, GND = ground, PWR = power, NC = no connect

over operating free-air temperature range (unless otherwise noted)(1)

⁽¹⁾ Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

⁽²⁾ All voltage values are with respect to underside power pad. The underside power pad should be directly connected to the ground plane of the board.

⁽³⁾ Not to exceed 3.6V

⁽²⁾ JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

⁽¹⁾ For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.