TPS5430/31

Part: TPS543x (TPS5430, TPS5431) from Texas Instruments

Type: Synchronous Buck Converter

Key Specs:

• Input Voltage Range (TPS5430): 5.5 V to 36 V
• Input Voltage Range (TPS5431): 5.5 V to 23 V
• Continuous Output Current: Up to 3 A
• Peak Output Current: 4 A
• Efficiency: Up to 95%
• Output Voltage Range: Adjustable Down to 1.22 V
• Output Voltage Initial Accuracy: 1.5%
• Switching Frequency: Fixed 500 kHz
• Operating Junction Temperature Range: –40°C to 125°C
• Integrated MOSFET Resistance: 110 mΩ
• Shutdown Supply Current: 18 μA (typically)

Features:

• Wide Input Voltage Range
• High Efficiency up to 95%
• Integrated 110 mΩ High-Side N-channel MOSFET
• Up to 3-A Continuous (4-A Peak) Output Current
• Wide Output Voltage Range: Adjustable Down to 1.22 V with 1.5% Initial Accuracy
• Internal Compensation Minimizes External Parts Count
• Fixed 500 kHz Switching Frequency for Small Filter Size
• Improved Line Regulation and Transient Response by Input Voltage Feed Forward
• System Protected by Overcurrent Limiting
• Overvoltage Protection
• Thermal Shutdown
• Active-high enable
• Undervoltage lockout circuit
• Internally set slow-start circuit
• Shutdown supply current reduced to 18 μA typically
• Available in Small Thermally Enhanced 8-Pin SO PowerPAD™ Package
• –40°C to 125°C Operating Junction Temperature Range

Applications:

• Consumer: Set-top Box, DVD, LCD Displays
• Industrial and Car Audio Power Supplies
• Battery Chargers, High Power LED Supply
• 12-V/24-V Distributed Power Systems

Package:

• HSOP (8)
• 8-pin SOIC PowerPAD™ package

The TPS543x is a high-output-current PWM converter that integrates a low-resistance, high-side N-channel – TPS5430: 5.5 ^V to ^{36 V} MOSFET. Included on the substrate with the listed – TPS5431: 5.5 V to 23 V features are a high-performance voltage error • Up to 3-A Continuous (4-A Peak) Output Current amplifier that provides tight voltage regulation accuracy under transient conditions; an undervoltage lockout circuit to prevent start-up until the input Integrated MOSFET Switch voltage reaches 5.5 V; an internally set slow-start • Wide Output Voltage Range: Adjustable Down to circuit to limit inrush currents; and a voltage feed-1.22 V with 1.5% Initial Accuracy forward circuit to improve the transient response. Using the ENA pin, shutdown supply current is • Internal Compensation Minimizes External Parts Count reduced to 18 μA typically. Other features include an active-high enable, overcurrent limiting, over-voltage • Fixed 500 kHz Switching Frequency for Small protection and thermal shutdown. To reduce design Filter Size complexity and external component count, the • Improved Line Regulation and Transient TPS543x feedback loop is internally compensated. Response by Input Voltage Feed Forward The TPS5431 is intended to operate from power rails up to 23 V. The TPS5430 regulates a wide variety of • System Protected by Overcurrent Limiting,

• –40°C to 125°C Operating Junction Temperature The TPS5430x device is available in a thermally Range enhanced, easy to use 8-pin SOIC PowerPAD™ package. TI provides evaluation modules and the • Available in Small Thermally Enhanced 8-Pin SO Designer software tool to aid in quickly achieving PowerPAD™ Package high-performance power supply designs to meet aggressive equipment development cycles.

Device Information(1)

Simplified Schematic Efficiency vs Output Current

An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA.

VIN VOUT

BOOT

PH TPS5430/31

1

• Consumer: Set-top Box, DVD, LCD Displays
• Battery Chargers, High Power LED Supply HSOP (8)

VIN

NC NC ENA GND VSENSE

• 12-V/24-V Distributed Power Systems

Pin Functions

T^J = –40°C to 125°C, VIN = 12 V (unless otherwise noted)

6 Submit Documentation Feedback Copyright © 2006–2014, Texas Instruments Incorporated

over operating free-air temperature range (unless otherwise noted) (1)(2)

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2) All voltage values are with respect to network ground terminal.

(3) Approaching the absolute maximum rating for the VIN pin may cause the voltage on the PH pin to exceed the absolute maximum rating.

4 Submit Documentation Feedback Copyright © 2006–2014, Texas Instruments Incorporated

6.4 Thermal Information

(2) Maximum power dissipation may be limited by overcurrent protection

(3) Power rating at a specific ambient temperature T^A should be determined with a junction temperature of 125°C. This is the point where distortion starts to substantially increase. Thermal management of the final PCB should strive to keep the junction temperature at or below 125°C for best performance and long-term reliability. See Thermal Calculations in applications section of this data sheet for more information.

(4) Test boards conditions:

(a) 3 in x 3 in, 2 layers, thickness: 0.062 inch.

(b) 2 oz. copper traces located on the top and bottom of the PCB.

(c) 6 thermal vias in the PowerPAD area under the device package.

(5) Test board conditions:

(a) 3 in x 3 in, 4 layers, thickness: 0.062 inch.

(b) 2 oz. copper traces located on the top and bottom of the PCB.

• (c) 2 oz. copper ground planes on the 2 internal layers.
• (d) 6 thermal vias in the PowerPAD area under the device package.

SLVS632F –JANUARY 2006–REVISED DECEMBER 2014 www.ti.com

6.5 Electrical Characteristics

T^J = –40°C to 125°C, VIN = 12 V (unless otherwise noted)

6 Submit Documentation Feedback Copyright © 2006–2014, Texas Instruments Incorporated

6.6 Typical Characteristics

SLVS632F –JANUARY 2006–REVISED DECEMBER 2014 www.ti.com

Typical Characteristics (continued)

(2) Maximum power dissipation may be limited by overcurrent protection

(3) Power rating at a specific ambient temperature T^A should be determined with a junction temperature of 125°C. This is the point where distortion starts to substantially increase. Thermal management of the final PCB should strive to keep the junction temperature at or below 125°C for best performance and long-term reliability. See Thermal Calculations in applications section of this data sheet for more information.

(4) Test boards conditions:

(a) 3 in x 3 in, 2 layers, thickness: 0.062 inch.

(b) 2 oz. copper traces located on the top and bottom of the PCB.

(c) 6 thermal vias in the PowerPAD area under the device package.

(5) Test board conditions:

(a) 3 in x 3 in, 4 layers, thickness: 0.062 inch.

(b) 2 oz. copper traces located on the top and bottom of the PCB.

• (c) 2 oz. copper ground planes on the 2 internal layers.
• (d) 6 thermal vias in the PowerPAD area under the device package.

SLVS632F –JANUARY 2006–REVISED DECEMBER 2014 www.ti.com

6.5 Electrical Characteristics

T^J = –40°C to 125°C, VIN = 12 V (unless otherwise noted)

6 Submit Documentation Feedback Copyright © 2006–2014, Texas Instruments Incorporated