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TPS5430X

Synchronous Buck Converter

The TPS5430X is a synchronous buck converter from Texas Instruments. View the full TPS5430X datasheet below including electrical characteristics, absolute maximum ratings.

Manufacturer

Texas Instruments

Overview

Part: TPS5430, TPS5431 — Texas Instruments

Type: Synchronous Buck Converter

Description: The TPS543x is a high-output-current PWM converter that integrates a low-resistance, high-side N-channel MOSFET, offering up to 3-A continuous output current, adjustable down to 1.22 V with 1.5% initial accuracy, and a fixed 500 kHz switching frequency.

Operating Conditions:

  • Supply voltage: 5.5–36 V (TPS5430), 5.5–23 V (TPS5431)
  • Operating temperature: -40 to 125 °C
  • Switching frequency: 500 kHz (typical)

Absolute Maximum Ratings:

  • Max supply voltage: 40 V (TPS5430), 25 V (TPS5431)
  • Max junction temperature: 150 °C
  • Max storage temperature: 150 °C

Key Specs:

  • Quiescent current (not switching): 3 mA (typ)
  • Shutdown current: 18 μA (typ)
  • Voltage reference accuracy (TJ = 25°C): 1.221 V (typ), 1.202 V (min), 1.239 V (max)
  • Internally set free-running frequency: 500 kHz (typ), 400 kHz (min), 600 kHz (max)
  • Current limit: 5 A (typ), 4 A (min), 6 A (max)
  • Thermal shutdown trip point: 162 °C (typ), 135 °C (min)
  • High-side power MOSFET switch rDS(on): 110 mΩ (typ), 230 mΩ (max)

Features:

  • Up to 3-A Continuous (4-A Peak) Output Current
  • High Efficiency up to 95%
  • Adjustable Output Voltage Down to 1.22 V with 1.5% Initial Accuracy
  • Internal Compensation Minimizes External Parts Count
  • Fixed 500 kHz Switching Frequency
  • Improved Line Regulation and Transient Response by Input Voltage Feed Forward
  • Overcurrent Limiting, Overvoltage Protection and Thermal Shutdown
  • -40°C to 125°C Operating Junction Temperature Range

Applications:

  • Consumer: Set-top Box, DVD, LCD Displays
  • Industrial and Car Audio Power Supplies
  • Battery Chargers, High Power LED Supply
  • 12-V/24-V Distributed Power Systems

Package:

  • 8-Pin SO PowerPAD™ Package (HSOP)

Features

  • 1 · Wide Input Voltage Range:

  • Up to 3-A Continuous (4-A Peak) Output Current

  • High Efficiency up to 95% Enabled by 110 m Ω Integrated MOSFET Switch

  • Wide Output Voltage Range: Adjustable Down to 1.22 V with 1.5% Initial Accuracy

  • Internal Compensation Minimizes External Parts Count

  • Fixed 500 kHz Switching Frequency for Small Filter Size

  • Improved Line Regulation and Transient Response by Input Voltage Feed Forward

  • System Protected by Overcurrent Limiting, Overvoltage Protection and Thermal Shutdown

  • -40°C to 125°C Operating Junction Temperature Range

  • Available in Small Thermally Enhanced 8-Pin SO PowerPAD™ Package

  • TPS5430: 5.5 V to 36 V

  • TPS5431: 5.5 V to 23 V

Applications

  • Consumer: Set-top Box, DVD, LCD Displays
  • Industrial and Car Audio Power Supplies
  • Battery Chargers, High Power LED Supply
  • 12-V/24-V Distributed Power Systems

Pin Configuration

PINPINI/ODESCRIPTION
NAMENO.I/ODESCRIPTION
BOOT1OBoost capacitor for the high-side FET gate driver. Connect 0.01 μ F low ESR capacitor from BOOT pin to PH pin.
NC2, 3-Not connected internally.
VSENSE4IFeedback voltage for the regulator. Connect to output voltage divider.
ENA5IOn/off control. Below 0.5 V, the device stops switching. Float the pin to enable.
GND6-Ground. Connect to PowerPAD.
VIN7-Input supply voltage. Bypass VIN pin to GND pin close to device package with a high quality, low ESR ceramic capacitor.
PH8ISource of the high side power MOSFET. Connected to external inductor and diode.
PowerPAD9-GND pin must be connected to the exposed pad for proper operation.

Electrical Characteristics

TJ = -40°C to 125°C, VIN = 12 V (unless otherwise noted)

PARAMETERTEST CONDITIONSMINTYPMAXUNIT
SUPPLY VOLTAGE (VIN PIN)
I Q Quiescent currentVSENSE = 2 V, Not switching, PH pin open34.4mA
Shutdown, ENA = 0 V1850μ A
UNDERVOLTAGE LOCK OUT (UVLO)
Start threshold voltage, UVLO5.35.5V
Hysteresis voltage, UVLO330mV
VOLTAGE REFERENCE
Voltage reference accuracyT J = 25°C1.2021.2211.239V
Voltage reference accuracyI O = 0 A - 3 A1.1961.2211.245V
OSCILLATOR
Internally set free-running frequency400500600kHz
Minimum controllable on time150200ns
Maximum duty cycle87%89%
ENABLE (ENA PIN)
Start threshold voltage, ENA1.3V
Stop threshold voltage, ENA0.5V
Hysteresis voltage, ENA450mV
Internal slow-start time (0~100%)6.6810ms
CURRENT LIMIT
Current limit456A
Current limit hiccup time131620ms
THERMAL SHUTDOWN
Thermal shutdown trip point135162°C
Thermal shutdown hysteresis14°C
OUTPUT MOSFET
r DS(on) High-side power MOSFET switchVIN = 5.5 V150m Ω
110230m Ω

Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted) (1)(2)

MINMAXUNIT
TPS5430VIN-0.340 (3)V
TPS5430PH (steady-state)-0.640 (3)V
V ITPS5431VIN-0.325V
V IPH (steady-state)-0.625V
ENA-0.37V
BOOT-PH-0.310V
VSENSE
PH (transient < 10 ns)
-0.3
-1.2
3V
V
I OSource currentSource currentPHInternally LimitedV
I lkgLeakage currentLeakage currentPH10μ A
T JOperating virtual junction temperature rangeOperating virtual junction temperature rangeOperating virtual junction temperature range-40150°C
T stgStorage temperature rangeStorage temperature rangeStorage temperature range-65150°C

Recommended Operating Conditions

MINMAXUNIT
VINInput voltage rangeTPS54305.536V
TPS54315.523V
T JOperating junction temperature-40125°C

Thermal Information

THERMAL METRIC (1)(2)(3)TPS5430 TPS5431 DDAUNIT
8 PINS
R θ JAJunction-to-ambient thermal resistance (2-layer custom board) (4)33°C/W
R θ JAJunction-to-ambient thermal resistance (4-layer custom board) (5)26°C/W
R θ JAJunction-to-ambient thermal resistance (standard board)42.3°C/W
ψ JTJunction-to-top characterization parameter4.9°C/W
ψ JBJunction-to-board characterization parameter20.7°C/W
R θ JC(top)Junction-to-case(top) thermal resistance46.4°C/W
R θ JC(bottom)Junction-to-case(bottom) thermal resistance0.8°C/W
R θ JBJunction-to-board thermal resistance20.8°C/W
  • (4) Test boards conditions:
  1. (a) 3 in x 3 in, 2 layers, thickness: 0.062 inch.
  2. (b) 2 oz. copper traces located on the top and bottom of the PCB.
  3. (c) 6 thermal vias in the PowerPAD area under the device package.
  • (5) Test board conditions:
  1. (a) 3 in x 3 in, 4 layers, thickness: 0.062 inch.
  2. (b) 2 oz. copper traces located on the top and bottom of the PCB.
  3. (c) 2 oz. copper ground planes on the 2 internal layers.
  4. (d) 6 thermal vias in the PowerPAD area under the device package.

Typical Application

The TPS543x is a 3-A, step down regulator with an integrated high side MOSFET. This device is typically used to convert a higher DC voltage to a lower DC voltage with a maximum available output current of 3 A. Example applications are: High Density Point-of-Load Regulators for Set-top Box, DVD, LCD and Plasma Displays, High Power LED Supply, Car Audio, Battery Chargers, and other 12-V and 24-V Distributed Power Systems. Use the following design procedure to select component values for the TPS543x. This procedure illustrates the design of a high frequency switching regulator. Alternatively, use the WEBENCH software to generate a complete design. The WEBENCH software uses an iterative design procedure and accesses a comprehensive database of components when generating a design.

To begin the design process a few parameters must be decided upon. The designer needs to know the following:

  • Input voltage range
  • Output voltage
  • Input ripple voltage
  • Output ripple voltage
  • Output current rating
  • Operating frequency

Related Variants

The following components are covered by the same datasheet.

Part NumberManufacturerPackage
TPS5430Texas Instruments
TPS5430-EPTexas Instruments
TPS5430-Q1Texas Instruments
TPS5430/31Texas Instruments
TPS5430DDATexas Instruments8-PowerSOIC (0.154", 3.90mm Width)
TPS5430DDAG4Texas Instruments
TPS5430DDARTexas InstrumentsSOIC-8-EP
TPS5431Texas InstrumentsThermally Enhanced 8-Pin SOIC PowerPAD™ (DDA)
TPS543XTexas Instruments
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