STM32U575ZG/I

Part: STM32U575xx from STMicroelectronics

Type: Ultra-low-power Arm Cortex-M33 32-bit MCU+TrustZone+FPU

Description: Ultra-low-power Arm Cortex-M33 32-bit MCU with TrustZone and FPU, featuring up to 2 MB Flash memory, 786 KB SRAM, and operating at up to 160 MHz (240 DMIPS).

Operating Conditions:

• Supply voltage: 1.71 V to 3.6 V
• Operating temperature: -40 °C to +125 °C
• Max CPU frequency: 160 MHz

Absolute Maximum Ratings:

• Max supply voltage: null
• Max continuous current: null
• Max junction/storage temperature: null

Key Specs:

• Core: Arm 32-bit Cortex-M33 CPU with TrustZone, MPU, DSP, and FPU
• Flash Memory: 2 Mbyte with ECC, 2 banks read-while-write
• SRAM: 786 Kbyte with ECC OFF or 722 Kbyte with ECC ON
• Run mode current: 19.5 μA/MHz @ 3.3 V
• Shutdown mode current: 160 nA (24 wake-up pins)
• ADC: 14-bit 2.5-Msps with hardware oversampling, 12-bit 2.5-Msps
• I/Os: Up to 136 fast I/Os, most 5V-tolerant
• DMIPS: 240 DMIPS (up to 160 MHz)

Features:

• Arm TrustZone and securable I/Os, memories, and peripherals
• FlexPowerControl with various low-power modes (Shutdown, Standby, Stop 2, Stop 3)
• ART Accelerator with 8-Kbyte instruction cache and 4-Kbyte data cache
• Embedded regulator (LDO) and SMPS step-down converter
• Rich analog peripherals: ADCs, DACs, operational amplifiers, comparators
• Multiple communication interfaces: USB Type-C/PD, USB OTG 2.0 FS, SAIs, I2C, U(S)ART, SPI, CAN FD, SDMMC

Applications:

• null

Package:

• LQFP48 (7 x 7 mm)
• LQFP64 (10 x 10 mm)
• LQFP100 (14 x 14 mm)
• LQFP144 (20 x 20 mm)
• UFQFPN48 (7 x 7 mm)
• WLCSP90 (4.2 x 3.95 mm)
• UFBGA132 (7 x 7 mm)
• UFBGA169 (7 x 7 mm)

• Chrom-ART Accelerator (DMA2D) for enhanced graphic content creation
• 1 digital camera interface

Table 25. Legend/abbreviations used in the pinout table

Table 25. Legend/abbreviations used in the pinout table

149

The definition and values of output AC characteristics are given in Figure 37: Output AC characteristics definition and in the table below respectively.

Unless otherwise specified, the parameters given are derived from tests performed under the ambient temperature and supply voltage conditions summarized in Table 32 .

Table 96. Output AC characteristics, HSLV OFF (all I/Os except FT_c, FT_t in V BAT mode and FT_o I/Os (1) ) (2)(3)(4)

Table 96. Output AC characteristics, HSLV OFF (all I/Os except FT_c, FT_t in V BAT mode and FT_o I/Os (1) ) (2)(3)(4)

305

Stresses above the absolute maximum ratings listed in Table 29 , Table 30 and Table 31 may cause permanent damage to the device. These are stress ratings only and the functional operation of the device at these conditions is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. Device mission profile (application conditions) is compliant with JEDEC JESD47 qualification standard, extended mission profiles are available on demand.

305

Table 29. Voltage characteristics (1)(2)

1. The I/O structure options listed in this table can be a concatenation of options including the option explicitly listed. For instance TT_a refers to any TT I/O with _a option. TT_xx refers to any TT I/O and FT_xx refers to any FT I/O.
2. VDDIO1 or V DDIO2 or V SW , V DDIO1 = V DD .
3. VIN maximum must always be respected. Refer to Table 30 for the maximum allowed injected current values.
4. To sustain a voltage higher than 4 V, the internal pull-up/pull-down resistors must be disabled.
5. This formula has to be applied only on the power supplies related to the I/O structure described in the pin definition table.
6. Including VREF- pin.

Table 30. Current characteristics

Table 30. Current characteristics

1. This current consumption must be correctly distributed over all I/Os and control pins. The total output current must not be sunk/sourced between two consecutive power supply pins, referring to high pin count QFP packages.
2. Positive injection (when V IN > V DDIOx ) is not possible on these I/Os and does not occur for input voltages lower than the specified maximum value.
3. A negative injection is induced by V IN < V SS . I INJ(PIN) must never be exceeded. Refer also to Table 29 for the minimum allowed input voltage values.
4. When several inputs are submitted to a current injection, the maximum ∑ |I INJ(PIN) is the absolute sum of the negative injected currents (instantaneous values).

Table 31. Thermal characteristics

Table 31. Thermal characteristics

305

The maximum chip-junction temperature, T J max, in degrees Celsius, can be calculated using the following equation:T _ { J } max = T _ { A } max + ( P _ { D } max × Θ _ { J A } )$

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com . ECOPACK is an ST trademark.