ST25DV64KC

Part: ST25DV04KC / ST25DV16KC / ST25DV64KC (ST25DV04KC-IE6S3, TSSOP8 package) — STMicroelectronics

Type: Dynamic NFC/RFID Tag IC with EEPROM

Description: Dynamic NFC Forum Type 5 / ISO/IEC 15693 tag IC with 4-Kbit, 16-Kbit or 64-Kbit EEPROM, a 1 MHz I²C interface (1.8–5.5 V supply), a 256-byte fast transfer mode buffer and an energy harvesting analog output.

Operating Conditions:

• Supply voltage (VCC, I²C side): 1.8–5.5 V
• Operating temperature: -40 to 85 °C (Range 6); Range 8 on TSSOP8 and SO8N is -40 to 125 °C, with 105 °C max on the RF interface
• I²C clock: up to 1 MHz
• RF mode: ISO/IEC 15693, fast read up to 53 kbit/s

Absolute Maximum Ratings:

Key Specs:

• Memory: 4 Kbit (512 bytes), 16 Kbit (2048 bytes) or 64 Kbit (8192 bytes) depending on version
• Internal tuning capacitance: 28.5 pF
• Write time: typically 5 ms for 1 to 16 bytes via I²C, or 1 block via RF
• Data retention: 40 years
• Write endurance: 1 million cycles at 25 °C, 600k at 85 °C, 500k at 105 °C, 400k at 125 °C
• I²C multi-byte write: up to 256 bytes
• Fast transfer mode buffer: 256 bytes, half-duplex
• GPO: open drain on 8-pin packages, requires pull-up > 4.7 kΩ
• VCC rise time: no faster than 1 V/μs

Features:

• NFC Forum Type 5 tag certified
• Based on ISO/IEC 15693
• Configurable I²C slave address
• Fast transfer mode between I²C and RF interfaces
• Energy harvesting analog output (V_EH)
• Configurable GPO interrupt pin (RF field change, memory write, activity, fast transfer end, and others)
• 1 to 4 configurable user memory areas with 64-bit password protection (three RF passwords and one I²C password for user areas)
• RF command interpreter can be enabled or disabled from the I²C host
• I²C priority: immediate RF switch off
• ECOPACK2 (RoHS compliant)

Applications:

• NFC/RFID tagging with an I²C host controller
• Contactless data transfer between RF reader and host MCU
• Low-power wake-up via the GPO interrupt

Package:

• TSSOP8 (8-pin, open drain GPO)
• SO8N (8-pin, open drain GPO)
• UFDFPN8 (8-pin, open drain GPO)
• UFDFPN12 (12-pin, CMOS GPO, with LPD and VDCG pins)

• A fast transfer mode (FTM), to achieve a fast link between RF and contact worlds, via a 256 byte buffer called Mailbox. This mailbox dynamic buffer of 256 byte can be filled or emptied via either RF or I 2 C.
• A GPO pin, which indicates incoming events to the contact side, like RF events (RF field changes, Rf activity, Rf writing completion or mailbox message availability) or I 2 C events (I 2 C write completion, RF switch off from I 2 C).
• An Energy Harvesting element to deliver μW of power when external conditions make it possible.
• RF management, which allows ST25DVxxKC to ignore RF requests.

All these features can be programmed by setting static and/or dynamic registers of the ST25DVxxKC. ST25DVxxKC can be partially customized using configuration registers located in the system area.

These registers are:

• dedicated to Data Memory organization and protection ENDA i , I2CSS, RFAiSS, LOCK_CCFILE.
• dedicated to fast transfer mode FTM
• dedicated to observation, GPO, IT_TIME
• dedicated to RF , RF_MNGT, EH_MODE
• dedicated the device's structure LOCK_CFG
• dedicated to I 2 C configuration, I2C_CFG

A set of additional registers allows to identify and customize the product (DSFID, AFI, IC_REF, etc.).

I2C DC and AC parameters

• Symbol Parameter Test condition Min. Typ. Max. Unit
• V CC = 1.8 V 0.75 V CC - V CC + 1
• V IH Input high voltage (SDA, SCL) V CC = 3.3 V 0.75 V CC - V CC + 1 V
• V CC = 5.5 V 0.75 V CC - V CC + 1
• V CC = 1.8 V 0.85 V CC - V CC + 1
• V IH_LPD Input high voltage (LPD) V CC = 3.3 V 0.85 V CC - V CC + 1 V
• V CC = 5.5 V 0.85 V CC - V CC + 1
• I OL = 1 mA, V CC = 1.8 V - 0.05 0.4
• V OL_SDA Output low voltage SDA (1 MHz) I OL = 2.1 mA, V CC = 3.3 V - 0.075 0.4 V
• I OL = 3 mA, V CC = 5.5 V - 0.09 0.4
• V CC_Power_up Device Select Acknowledge f C = 100 KHz (2) - 1.48 1.7 V

Table 249. I 2 C DC characteristics up to 125 °C

Table 249. I 2 C DC characteristics up to 125 °C

I2C DC and AC parameters

Table 257. Thermal characteristics

1. Jedec JESD51-7 2s2p board

2. Exposed pad soldered to board

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com . ECOPACK is an ST trademark.