SI7021-A10-YM0
TABLE OF CONTENTS
Overview
Part 1: Markdown Summary
Part: Si7021
Type: I2C Humidity and Temperature Sensor
Key Specs:
- Relative Humidity Sensor Accuracy: ± 3% RH (max), 0–80% RH
- Temperature Sensor Accuracy: ±0.4 °C (max), –10 to 85 °C
- Operating RH Range: 0 to 100% RH
- Operating Temperature Range: –40 to +125 °C
- Operating Voltage: 1.9 to 3.6 V
- Active Current: 150 μA
- Standby Current: 60 nA
Features:
- Precision Relative Humidity Sensor
- High Accuracy Temperature Sensor
- Factory-calibrated
- I2C Interface
- Integrated on-chip heater
- 3x3 mm DFN Package
- Excellent long term stability
- Optional factory-installed cover
Applications:
- HVAC/R
- Thermostats/humidistats
- Respiratory therapy
- White goods
- Indoor weather stations
- Micro-environments/data centers
- Automotive climate control and defogging
- Asset and goods tracking
- Mobile phones and tablets
Package:
- DFN Package: 3x3 mm
Features
-
Precision Relative Humidity Sensor
- ± 3% RH (max), 0–80% RH
-
High Accuracy Temperature Sensor
- ±0.4 °C (max), –10 to 85 °C
-
0 to 100% RH operating range
-
Up to –40 to +125 °C operating range
-
Wide operating voltage (1.9 to 3.6 V)
-
Low Power Consumption
- 150 μA active current
- 60 nA standby current
-
Factory-calibrated
-
I 2C Interface
-
Integrated on-chip heater
-
3x3 mm DFN Package
-
Excellent long term stability
-
Optional factory-installed cover
- Low-profile
- Protection during reflow
- Excludes liquids and particulates
Applications
- HVAC/R
- Thermostats/humidistats
- Respiratory therapy
- White goods
- Indoor weather stations
- Micro-environments/data centers
- Automotive climate control and defogging
- Asset and goods tracking
- Mobile phones and tablets
Pin Configuration
| Pin Name | Pin # | Pin Description |
|---|---|---|
| SDA | 1 | I2C data |
| GND | 2 | Ground. This pin is connected to ground on the circuit board through a trace. Do not connect directly to GND plane. |
| VDD | 5 | Power. This pin is connected to power on the circuit board. |
| SCL | 6 | I2C clock |
| DNC | 3,4 | These pins should be soldered to pads on the PCB for mechanical stability; they can be electrically floating or tied to VDD (do not tie to GND). |
| TGND | Paddle | This pad is connected to GND internally. This pad is the main thermal input to the on chip temperature sensor. The paddle should be soldered to a floating pad. |
Electrical Characteristics
Unless otherwise specified, all min/max specifications apply over the recommended operating conditions.
Table 1. Recommended Operating Conditions
| Parameter | Symbol | Test Condition | Min | Typ | Max | Unit |
|---|---|---|---|---|---|---|
| Power Supply | VDD | 1.9 | 3.6 | V | ||
| Operating Temperature | TA | I and Y grade | -40 | _ | +125 | °C |
| Operating Temperature | TA | G grade | -40 | _ | +85 | °C |
Table 2. General Specifications
1.9 ≤ VDD ≤ 3.6 V; TA = -40 to 85 °C (G grade) or -40 to 125 °C (I/Y grade); default conversion time unless otherwise noted.
| Parameter | Symbol | Test Condition | Min | Typ | Max | Unit |
|---|---|---|---|---|---|---|
| Input Voltage High | V IH | SCL, SDA pins | 0.7xVDD | _ | _ | V |
| Input Voltage Low | VIL | SCL, SDA pins | _ | _ | 0.3xVDD | V |
| Input Voltage Range | VIN | SCL, SDA pins with respect to GND | 0.0 | _ | VDD | V |
| Input Leakage | IIL | SCL, SDA pins | _ | _ | 1 | μA |
| Output Voltage Low | Vol | SDA pin; IoL = 2.5 mA; VDD = 3.3 V | _ | _ | 0.6 | V |
| SDA pin; IoL = 1.2 mA; VDD = 1.9 V | _ | 0.4 | V | |||
| Current | IDD | RH conversion in progress | _ | 150 | 180 | μΑ |
| Consumption | Temperature conversion in progress | _ | 90 | 120 | μA | |
| Standby, –40 to +85 °C 2 | _ | 0.06 | 0.62 | μA | ||
| Standby, –40 to +125 °C 2 | _ | 0.06 | 3.8 | μΑ | ||
| Peak IDD during powerup 3 | _ | 3.5 | 4.0 | mA | ||
| Peak IDD during I 2 C operations 4 | _ | 3.5 | 4.0 | mA | ||
| After writing to user registers 5 | _ | 20 | _ | μΑ | ||
| Heater Current 6 | I HEAT | _ | 3.1 | _ | mA |
Notes:
- Initiating a RH measurement will also automatically initiate a temperature measurement. The total conversion time will be tCONV(RH) + tCQNV(T).
- 2. No conversion or I2C transaction in progress. Typical values measured at 25 °C.
- 3. Occurs once during powerup. Duration is <5 msec.
- Occurs during I2C commands for Reset, Read/Write User Registers, Read EID, and Read Firmware Version. Duration is <100 μs when I2C clock speed is >100 kHz (>200 kHz for 2-byte commands).
- 5. IDD after a user register write. Initiating any other subsequent I2C transaction on the same bus (such as the user register read, starting an RH measurement, or traffic directed at other I2C devices) will transition the device to standby mode.
-
- Additional current consumption when HTRE bit enabled. See section "5.5. Heater" for more information
Table 2. General Specifications (Continued)
1.9 ≤ VDD ≤ 3.6 V ; TA = -40 to 85 °C (G grade) or -40 to 125 °C (I/Y grade); default conversion time unless otherwise noted.
| Parameter | Symbol | Test Condition | Min | Typ | Max | Unit |
|---|---|---|---|---|---|---|
| Conversion Time 1 | t CONV | 12-bit RH | _ | 10 | 12 | |
| 11-bit RH | _ | 5.8 | 7 | |||
| 10-bit RH | _ | 3.7 | 4.5 | |||
| 8-bit RH | _ | 2.6 | 3.1 | ma | ||
| 14-bit temperature | _ | 7 | 10.8 | ms | ||
| 13-bit temperature | _ | 4 | 6.2 | |||
| 12-bit temperature | _ | 2.4 | 3.8 | |||
| 11-bit temperature | _ | 1.5 | 2.4 | |||
| Powerup Time | t PU | From VDD ≥ 1.9 V to ready for a conversion, 25 °C | _ | 18 | 25 | |
| From VDD ≥ 1.9 V to ready for a conversion, full temperature range | _ | _ | 80 | ms | ||
| After issuing a software reset command | _ | 5 | 15 |
Notes:
-
- Initiating a RH measurement will also automatically initiate a temperature measurement. The total conversion time will be tCONV(RH) + tCONV(T) .
-
- No conversion or I2C transaction in progress. Typical values measured at 25 °C.
-
- Occurs once during powerup. Duration is <5 msec.
- 4. Occurs during I2C commands for Reset, Read/Write User Registers, Read EID, and Read Firmware Version. Duration is <100 μs when I2C clock speed is >100 kHz (>200 kHz for 2-byte commands).
-
- IDD after a user register write. Initiating any other subsequent I2C transaction on the same bus (such as the user register read, starting an RH measurement, or traffic directed at other I2C devices) will transition the device to standby mode.
-
- Additional current consumption when HTRE bit enabled. See section "5.5. Heater" for more information
Absolute Maximum Ratings
| Parameter | Symbol | Test Condition | Min | Typ | Max | Unit |
|---|---|---|---|---|---|---|
| Ambient temperature under bias | –55 | — | 125 | °C | ||
| Storage Temperature2 | –65 | — | 150 | °C | ||
| Voltage on I/O pins | –0.3 | — | VDD+0.3V | V | ||
| Voltage on VDD with respect to GND | –0.3 | 4.2 | V | |||
| ESD Tolerance | HBM | — | — | 2 | kV | |
| CDM | — | — | 1.25 | kV | ||
| MM | — | — | 250 | V |
Notes:
- 1. Absolute maximum ratings are stress ratings only, operation at or beyond these conditions is not implied and may shorten the life of the device or alter its performance.
- 2. Special handling considerations apply; see application note, "AN607: Si70xx Humidity Sensor Designer's Guide".
Related Variants
The following components are covered by the same datasheet.
| Part Number | Manufacturer | Package |
|---|---|---|
| Si7021 | — | — |
| SI7021-A10 | — | — |
| SI7021-A10-GM | — | — |
| SI7021-A10-GM1 | — | — |
| SI7021-A10-GM1R | — | — |
| SI7021-A10-GMR | — | — |
| SI7021-A10-IM | — | — |
| SI7021-A10-IM1 | — | — |
| SI7021-A10-IM1R | — | — |
| SI7021-A10-IMR | — | — |
| SI7021-A10-YM0R | — | — |
| SI7021-A10-YM1 | — | — |
| SI7021-A10-YM1R | — | — |
| SI7021-EB | — | — |
| SI7021S | — | — |
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