SI7021S

TABLE OF CONTENTS

Overview

Part 1: Markdown Summary

Part: Si7021

Type: I2C Humidity and Temperature Sensor

Key Specs:

  • Relative Humidity Sensor Accuracy: ± 3% RH (max), 0–80% RH
  • Temperature Sensor Accuracy: ±0.4 °C (max), –10 to 85 °C
  • Operating RH Range: 0 to 100% RH
  • Operating Temperature Range: –40 to +125 °C
  • Operating Voltage: 1.9 to 3.6 V
  • Active Current: 150 μA
  • Standby Current: 60 nA

Features:

  • Precision Relative Humidity Sensor
  • High Accuracy Temperature Sensor
  • Factory-calibrated
  • I2C Interface
  • Integrated on-chip heater
  • 3x3 mm DFN Package
  • Excellent long term stability
  • Optional factory-installed cover

Applications:

  • HVAC/R
  • Thermostats/humidistats
  • Respiratory therapy
  • White goods
  • Indoor weather stations
  • Micro-environments/data centers
  • Automotive climate control and defogging
  • Asset and goods tracking
  • Mobile phones and tablets

Package:

  • DFN Package: 3x3 mm

Features

  • Precision Relative Humidity Sensor

    • ± 3% RH (max), 0–80% RH
  • High Accuracy Temperature Sensor

    • ±0.4 °C (max), –10 to 85 °C
  • 0 to 100% RH operating range

  • Up to –40 to +125 °C operating range

  • Wide operating voltage (1.9 to 3.6 V)

  • Low Power Consumption

    • 150 μA active current
    • 60 nA standby current
  • Factory-calibrated

  • I 2C Interface

  • Integrated on-chip heater

  • 3x3 mm DFN Package

  • Excellent long term stability

  • Optional factory-installed cover

    • Low-profile
    • Protection during reflow
    • Excludes liquids and particulates

Applications

  • HVAC/R
  • Thermostats/humidistats
  • Respiratory therapy
  • White goods
  • Indoor weather stations
  • Micro-environments/data centers
  • Automotive climate control and defogging
  • Asset and goods tracking
  • Mobile phones and tablets

Pin Configuration

Pin NamePin #Pin Description
SDA1I2C data
GND2Ground. This pin is connected to ground on the circuit board through a trace. Do not
connect directly to GND plane.
VDD5Power. This pin is connected to power on the circuit board.
SCL6I2C clock
DNC3,4These pins should be soldered to pads on the PCB for mechanical stability; they can be
electrically floating or tied to VDD (do not tie to GND).
TGNDPaddleThis pad is connected to GND internally. This pad is the main thermal input to the on
chip temperature sensor. The paddle should be soldered to a floating pad.

Electrical Characteristics

Unless otherwise specified, all min/max specifications apply over the recommended operating conditions.

Table 1. Recommended Operating Conditions

ParameterSymbolTest ConditionMinTypMaxUnit
Power SupplyVDD1.93.6V
Operating TemperatureTAI and Y grade-40_+125°C
Operating TemperatureTAG grade-40_+85°C

Table 2. General Specifications

1.9 ≤ VDD ≤ 3.6 V; TA = -40 to 85 °C (G grade) or -40 to 125 °C (I/Y grade); default conversion time unless otherwise noted.

ParameterSymbolTest ConditionMinTypMaxUnit
Input Voltage HighV IHSCL, SDA pins0.7xVDD__V
Input Voltage LowVILSCL, SDA pins__0.3xVDDV
Input Voltage RangeVINSCL, SDA pins with respect to GND0.0_VDDV
Input LeakageIILSCL, SDA pins__1μA
Output Voltage LowVolSDA pin; IoL = 2.5 mA; VDD = 3.3 V__0.6V
SDA pin; IoL = 1.2 mA;
VDD = 1.9 V
_0.4V
CurrentIDDRH conversion in progress_150180μΑ
ConsumptionTemperature conversion in progress_90120μA
Standby, –40 to +85 °C 2_0.060.62μA
Standby, –40 to +125 °C 2_0.063.8μΑ
Peak IDD during powerup 3_3.54.0mA
Peak IDD during I 2 C operations 4_3.54.0mA
After writing to user registers 5_20_μΑ
Heater Current 6I HEAT_3.1_mA

Notes:

  • Initiating a RH measurement will also automatically initiate a temperature measurement. The total conversion time will be tCONV(RH) + tCQNV(T).
  • 2. No conversion or I2C transaction in progress. Typical values measured at 25 °C.
  • 3. Occurs once during powerup. Duration is <5 msec.
  • Occurs during I2C commands for Reset, Read/Write User Registers, Read EID, and Read Firmware Version. Duration is <100 μs when I2C clock speed is >100 kHz (>200 kHz for 2-byte commands).
  • 5. IDD after a user register write. Initiating any other subsequent I2C transaction on the same bus (such as the user register read, starting an RH measurement, or traffic directed at other I2C devices) will transition the device to standby mode.
    1. Additional current consumption when HTRE bit enabled. See section "5.5. Heater" for more information

Table 2. General Specifications (Continued)

1.9 ≤ VDD ≤ 3.6 V ; TA = -40 to 85 °C (G grade) or -40 to 125 °C (I/Y grade); default conversion time unless otherwise noted.

ParameterSymbolTest ConditionMinTypMaxUnit
Conversion Time 1t CONV12-bit RH_1012
11-bit RH_5.87
10-bit RH_3.74.5
8-bit RH_2.63.1ma
14-bit temperature_710.8ms
13-bit temperature_46.2
12-bit temperature_2.43.8
11-bit temperature_1.52.4
Powerup Timet PUFrom VDD ≥ 1.9 V to ready for a conversion, 25 °C_1825
From VDD ≥ 1.9 V to ready for a conversion, full temperature range__80ms
After issuing a software reset command_515

Notes:

    1. Initiating a RH measurement will also automatically initiate a temperature measurement. The total conversion time will be tCONV(RH) + tCONV(T) .
    1. No conversion or I2C transaction in progress. Typical values measured at 25 °C.
    1. Occurs once during powerup. Duration is <5 msec.
  • 4. Occurs during I2C commands for Reset, Read/Write User Registers, Read EID, and Read Firmware Version. Duration is <100 μs when I2C clock speed is >100 kHz (>200 kHz for 2-byte commands).
    1. IDD after a user register write. Initiating any other subsequent I2C transaction on the same bus (such as the user register read, starting an RH measurement, or traffic directed at other I2C devices) will transition the device to standby mode.
    1. Additional current consumption when HTRE bit enabled. See section "5.5. Heater" for more information

Absolute Maximum Ratings

ParameterSymbolTest ConditionMinTypMaxUnit
Ambient temperature
under bias
–55125°C
Storage Temperature2–65150°C
Voltage on I/O pins–0.3VDD+0.3VV
Voltage on VDD with
respect to GND
–0.34.2V
ESD ToleranceHBM2kV
CDM1.25kV
MM250V

Notes:

  • 1. Absolute maximum ratings are stress ratings only, operation at or beyond these conditions is not implied and may shorten the life of the device or alter its performance.
  • 2. Special handling considerations apply; see application note, "AN607: Si70xx Humidity Sensor Designer's Guide".

Related Variants

The following components are covered by the same datasheet.

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