MURA1XX,

Part: ON Semiconductor MURA115T3G, MURA120T3G, SURA8120T3G

Type: Ultrafast Power Rectifier

Key Specs:

• Low Forward Voltage Drop: 0.71 V Max @ 1.0 A, T_J = 150°C
• Peak Repetitive Reverse Voltage (MURA115T3G): 150 V
• Peak Repetitive Reverse Voltage (MURA120T3G/SURA8120T3G): 200 V
• Average Rectified Forward Current: 1.0 A @ T_L = 155°C
• Average Rectified Forward Current: 2.0 A @ T_L = 135°C
• Non-Repetitive Peak Surge Current: 40 A
• Operating Junction Temperature Range: -65 to +175 °C
• Maximum Reverse Recovery Time: 35 ns

Features:

• Small Compact Surface Mountable Package with J-Bend Leads
• Rectangular Package for Automated Handling
• High Temperature Glass Passivated Junction
• Low Forward Voltage Drop (0.71 V Max @ 1.0 A, T_J = 150°C)
• AEC-Q101 Qualified and PPAP Capable
• SURA8 Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements
• All Packages are Pb-Free
• ESD Protection: Human Body Model > 4000 V (Class 3)
• ESD Protection: Machine Model > 400 V (Class C)

Applications:

• High voltage, high frequency rectification
• Free wheeling and protection diodes in surface mount applications where compact size and weight are critical
• Automotive and other applications requiring unique site and control change requirements

Package:

• SMA (CASE 403D PLASTIC): HE (Overall Length) 4.83 mm MIN / 5.59 mm MAX, E (Body Length) 4.06 mm MIN / 4.57 mm MAX, D (Body Width) 2.29 mm MIN / 2.92 mm MAX

• Small Compact Surface Mountable Package with J-Bend Leads
• Rectangular Package for Automated Handling
• High Temperature Glass Passivated Junction
• Low Forward Voltage Drop (0.71 V Max @ 1.0 A, T_J = 150°C)
• AEC-Q101 Qualified and PPAP Capable
• SURA8 Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements
• All Packages are Pb-Free*

^3. Pulse Test: Pulse Width = 300 μ s, Duty Cycle ≤ 2.0%.

^2. In compliance with JEDEC 51, these values (historically represented by R_{θ JL} ) are now referenced as Psi_JL .

Figure 1. Typical Reverse Current

Figure 2. Maximum Reverse Current

Figure 3. Typical Forward Voltage

Figure 4. Maximum Forward Voltage

Figure 5. Typical Capacitance

Figure 6. Maximum Capacitance

Figure 7. Current Derating, Lead

Figure 8. Current Derating, Ambient (FR-4 Board with Minimum Pad)

Figure 9. Power Dissipation

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.