MIC5209YM

Part: MIC5209 — Microchip Technology

Type: Low-Noise LDO Linear Voltage Regulator

Description: 500 mA low-noise LDO regulator with 2.5–16 V input, 1.8–15 V output range, 1% output accuracy and a maximum dropout of 500 mV at full load.

Operating Conditions:

• Supply voltage: 2.5 to 16 V
• Operating junction temperature: -40 to +125 °C (2.5 V ≤ VOUT ≤ 15 V); 0 to +125 °C for 1.8 V ≤ VOUT < 2.5 V
• Adjustable output voltage range: 1.8 to 15 V

Absolute Maximum Ratings:

• Supply voltage (VIN): -20 to +20 V
• Power dissipation: internally limited
• Storage temperature: -65 to +150 °C
• Lead temperature: +260 °C (soldering, 5 s)
• ESD (HBM/MM): SOT-223 2 kV/300 V; DFN and SOIC-8 5 kV/100 V

Key Specs:

• Output voltage accuracy: ±1% (±2% over temperature), VIN = VOUT + 1 V, IL = 100 μA
• Dropout voltage: 10 mV typ at 100 μA; 350 mV typ, 500 mV max at 500 mA
• Ground pin current: 80 μA typ at 100 μA load; 8 mA typ, 20 mA max at 500 mA load
• Shutdown quiescent current: 0.05 μA typ, 3 μA max (VEN ≤ 0.4 V)
• Current limit: 700 mA typ, 900 mA max (VOUT = 0 V)
• Line regulation: 0.009% typ, 0.05% max (VIN = VOUT + 1 V to 16 V)
• Load regulation: 0.05% typ, 0.5% max (IL = 100 μA to 500 mA)
• PSRR: 75 dB typ at 120 Hz
• Output noise: 500 nV/√Hz typ (CBYP = 0); 300 nV/√Hz typ (CBYP = 470 pF), IOUT = 50 mA, COUT = 2.2 μF
• Enable thresholds: logic-low ≤ 0.4 V, logic-high ≥ 2.0 V

Features:

• Output voltage range 1.8–15 V, adjustable or fixed versions
• Meets Intel Slot 1 and Slot 2 requirements
• Guaranteed 500 mA output over the full operating temperature range
• Current limiting and thermal limiting
• Reversed-battery protection
• No-load stability
• Ultra-low-noise capability with bypass capacitor (SOIC-8 and DDPAK)
• Enable/shutdown pin (SOIC-8, DDPAK, DFN)
• Low temperature coefficient (40 ppm/°C typ)

Applications:

• Pentium II Slot 1 and Slot 2 support circuits
• Laptop, notebook and palmtop computers
• Cellular telephones
• Consumer and personal electronics
• SMPS post-regulator and DC/DC modules
• High-efficiency linear power supplies

Package:

• SOT-223
• SOIC-8
• DDPAK
• 3 mm × 3 mm 8-pin DFN

• Output Voltage Range: 1.8V - 15V
• Meets Intel ® Slot 1 and Slot 2 Requirements
• Guaranteed 500 mA Output Over the Full Operating Temperature Range
• Low 500 mV Maximum Dropout Voltage at Full Load
• Extremely Tight Load and Line Regulation
• Thermally Efficient Surface-Mount Package
• Low Temperature Coefficient
• Current and Thermal Limiting
• Reversed-Battery Protection
• No-Load Stability
• 1% Output Accuracy
• Ultra-Low-Noise Capability in SOIC-8 and DDPAK
• Ultra-Small 3 mm × 3 mm DFN Package

• Pentium II Slot 1 and Slot 2 Support Circuits
• Laptop, Notebook, and Palmtop Computers
• Cellular Telephones
• Consumer and Personal Electronics
• SMPS Post-Regulator and DC/DC Modules
• High-Efficiency Linear Power Supplies

The descriptions of the pins are listed in Table 3-1.

TABLE 3-1: PIN FUNCTION TABLE

Electrical Characteristics: V IN = V OUT + 1V; I L = 100 μ A; T J = +25°C, bold values indicate -40°C ≤ T J ≤ +125°C except 0°C ≤ T J ≤ +125°C for 1.8V ≤ V OUT ≤ 2.5V, unless noted.

† Notice: Stresses above those listed under 'Absolute Maximum Ratings' may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational sections of this specification is not intended. Exposure to maximum rating conditions for extended periods may affect device reliability.

‡ Notice: The device is not guaranteed to function outside its operating ratings.

Note 1: The maximum allowable power dissipation at any T A (ambient temperature) is P D(max) = (T J(max) - T A ) x θ JA . Exceeding the maximum allowable power dissipation will cause excessive die temperature, and the regulator will go into thermal shutdown. See Table 4-1 and the Thermal Considerations sub-section in Applications Information for details.

TABLE 1-1: ELECTRICAL CHARACTERISTICS (Note 1)

Electrical Characteristics: V IN = V OUT + 1V; I L = 100 μ A; T J = +25°C, bold values indicate -40°C ≤ T J ≤ +125°C except 0°C ≤ T J ≤ +125°C for 1.8V ≤ V OUT ≤ 2.5V, unless noted.

The SOT-223 has a ground tab that allows it to dissipate more power than the SOIC-8 (refer to the Slot-1 Power Supply sub-section for details). At +25°C ambient, it will operate reliably at 1.6W dissipation with 'worst-case' mounting (no ground plane, minimum trace widths, and FR4 printed circuit board).

Thermal resistance values for the SOIC-8 represent typical mounting on a 1'-square, copper-clad, FR4 circuit board. For greater power dissipation, SOIC-8 versions of the MIC5209 feature a fused internal lead frame and die bonding arrangement that reduces thermal resistance when compared to standard SOIC-8 packages.