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DAC8562

Digital-to-Analog Converter (DAC)

The DAC8562 is a digital-to-analog converter (dac) from Texas Instruments. View the full DAC8562 datasheet below including key specifications, electrical characteristics, absolute maximum ratings.

Official DAC8562 datasheet (PDF) — the source this page was extracted from.

Manufacturer

Texas Instruments

Category

ADC / DAC

Package

20-Pin Plastic DIP, 20-Lead SOIC, Dice

DAC8562 Key Specifications

ParameterValue
Resolution12 bits
Settling Time16 µs (to 0.01%)
Lsb Resolution1 mV/LSB
Operating Current3 mA (typical)
Power Consumption3 mW (typical)
Output Current Drive±5 mA
Output Voltage Range0V to 4.095V
Supply Voltage Range4.75V to 5.25V
Communication InterfaceParallel
Internal Reference Voltage2.5 V
Operating Temperature Range–40°C to +85°C

DAC8562 Overview

Part: DAC8562 — Texas Instruments

Type: Dual 16-Bit Voltage-Output Digital-to-Analog Converter

Description: Low-power, dual-channel, 16-bit buffered voltage-output DAC operating from 2.7 V to 5.5 V with an integrated 2.5 V, 4-ppm/°C internal reference and 50-MHz SPI interface.

Operating Conditions:

  • Supply voltage: 2.7 to 5.5 V
  • Operating temperature: -40 to 125 °C
  • Digital input voltage: 0 to AVDD V
  • Reference input voltage: 0 to AVDD V

Absolute Maximum Ratings:

  • Max supply voltage: 6 V (AVDD to GND)
  • Max junction/storage temperature: 150 °C

Key Specs:

  • Resolution: 16 bits
  • Relative accuracy (INL): ±4 LSB typ, ±12 LSB max (using line passing through codes 512 and 65,024)
  • Differential nonlinearity (DNL): ±0.2 LSB typ, ±1 LSB max (16-bit monotonic)
  • Internal reference output voltage: 2.5 V (2.495 V min, 2.505 V max at TA = 25 °C)
  • Reference temperature drift: 4 ppm/°C typ, 10 ppm/°C max
  • Output voltage settling time: 7 μs typ (DACs unloaded), 10 μs typ (RL = 1 MΩ)
  • Slew rate: 0.75 V/μs typ (measured between 20%–80% of full-scale transition)
  • Glitch impulse: 0.1 nV-s typ (1-LSB change around major carry)
  • Reference output drive capability: ±20 mA

Features:

  • Integrated 2.5-V, 4-ppm/°C internal reference with ±5-mV initial accuracy
  • Power-on reset to zero scale
  • Rail-to-rail output buffer
  • 50-MHz 3-wire SPI interface with Schmitt-triggered inputs
  • LDAC pin for simultaneous DAC channel updates and CLR pin for asynchronous clear
  • Low power consumption: 4 mW typ (at 5-V AVDD including internal reference current)
  • Power-down mode with 550 nA typ current consumption at 5 V

Applications:

  • Portable Instrumentation
  • PLC Analog Output Module
  • Closed-Loop Servo Control
  • Voltage Controlled Oscillator Tuning
  • Data Acquisition Systems
  • Programmable Gain and Offset Adjustment

Package:

  • VSSOP-10 (3.00 mm × 3.00 mm body size)
  • WSON-10 (3.00 mm × 3.00 mm body size)

DAC8562 Applications

  • Portable Instrumentation
  • PLC Analog Output Module
  • Closed-Loop Servo Control
  • Voltage Controlled Oscillator Tuning
  • Data Acquisition Systems
  • Programmable Gain and Offset Adjustment

The DAC756x, DAC816x, and DAC856x devices are low-power, voltage-output, dual-channel, 16-, 14-, and 12-bit digital-to-analog converters (DACs), respectively. These devices include a 2.5-V, 4-ppm/°C internal reference, giving a full-scale output voltage range of 2.5 V or 5 V. The internal reference has an initial accuracy of ±5 mV and can source or sink up to 20 mA at the VREFIN/VREFOUT pin.

These devices are monotonic, providing excellent linearity and minimizing undesired code-to-code transient voltages (glitch). They use a versatile threewire serial interface that operates at clock rates up to 50 MHz. The interface is compatible with standard SPI™, QSPI™, Microwire, and digital signal processor (DSP) interfaces. The DACxx62 devices incorporate a power-on-reset circuit that ensures the DAC output powers up and remains at zero scale until a valid code is written to the device, whereas the DACxx63 devices similarly power up at mid-scale. These devices contain a power-down feature that reduces current consumption to typically 550 nA at 5 V. The low power consumption, internal reference, and small footprint make these devices ideal for portable, battery-operated equipment.

The DACxx62 devices are drop-in and functioncompatible with each other, as are the DACxx63 devices. The entire family is available in MSOP-10 and SON-10 packages.

DAC8562 Pin Configuration

  • (1) TI recommends connecting the thermal pad to the ground plane for better thermal dissipation.

DAC8562 Electrical Characteristics

At AVDD = 2.7 V to 5.5 V and TA = -40°C to 125°C (unless otherwise noted).

PARAMETERPARAMETERTEST CONDITIONSMINTYPMAXUNIT
STATIC PERFORMANCE (1)STATIC PERFORMANCE (1)
Resolution
STATIC PERFORMANCE (1)STATIC PERFORMANCE (1)
16
STATIC PERFORMANCE (1)STATIC PERFORMANCE (1)STATIC PERFORMANCE (1)
Bits
Relative accuracyUsing line passing through codes 512 and 65,024±4±12LSB
Differential nonlinearity
Resolution
16-bit monotonic14±0.2±1LSB
Bits
Relative accuracyUsing line passing through codes 128 and 16,256±1±3LSB
Differential nonlinearity
Resolution
14-bit monotonic12±0.1±0.5LSB
Bits
Relative accuracyUsing line passing through codes 32 and 4,064±0.3±0.75LSB
Differential nonlinearity12-bit monotonic±0.05±0.25LSB
Offset errorOffset errorExtrapolated from two-point line (1) , unloaded±1±4mV
Offset error driftOffset error drift±2μV/°C
Full-scale errorFull-scale errorDAC register loaded with all 1s±0.03±0.2% FSR
Zero-code errorZero-code errorDAC register loaded with all 0s14mV
Zero-code error driftZero-code error drift±2μV/°C
Gain errorGain errorExtrapolated from two-point line (1) , unloaded±0.01±0.15% FSR
Gain temperature coefficientGain temperature coefficient±1ppm FSR/°C
OUTPUT CHARACTERISTICS (2)OUTPUT CHARACTERISTICS (2)OUTPUT CHARACTERISTICS (2)OUTPUT CHARACTERISTICS (2)OUTPUT CHARACTERISTICS (2)OUTPUT CHARACTERISTICS (2)OUTPUT CHARACTERISTICS (2)
Output voltage rangeOutput voltage range0AV DDV
(3)DACs unloaded7μs
Output voltage settling timeOutput voltage settling timeR L = 1 M Ω10
Slew rateSlew rateMeasured between 20%-80% of a full-scale transition
R L = ∞
0.75
1
V/μs
nF
Capacitive load stabilityCapacitive load stabilityR L = 2 k Ω 1-LSB change around major carry3 0.1nV-s
Code-change glitch impulseCode-change glitch impulsehigh0.1
Digital feedthroughDigital feedthroughSCLK toggling, SYNCnV-s
Power-on glitch impulsePower-on glitch impulseR L = 2 k Ω , C L = 470 pF, AV DD = 5.5 V Full-scale swing on adjacent channel,40mV
Channel-to-channel dc crosstalkChannel-to-channel dc crosstalkExternal reference Full-scale swing on adjacent channel,5 15μV
DC output impedanceDC output impedanceInternal reference5Ω
currentAt mid-scale input DAC outputs at full-scale, DAC outputs shorted to
GND Coming out of power-down mode
40
50
mA
μs
Power-up time, including settling time AC PERFORMANCE (2)Power-up time, including settling time AC PERFORMANCE (2)Power-up time, including settling time AC PERFORMANCE (2)Power-up time, including settling time AC PERFORMANCE (2)Power-up time, including settling time AC PERFORMANCE (2)Power-up time, including settling time AC PERFORMANCE (2)Power-up time, including settling time AC PERFORMANCE (2)
DAC output noise densityDAC output noise densityT A = 25°C, at mid-scale input, f OUT = 1 kHz90nV/ √ Hz
DAC output noiseDAC output noiseT A = 25°C, at mid-scale input, 0.1 Hz to 10 Hz2.6μV PP

DAC8562 Absolute Maximum Ratings

Over operating ambient temperature range (unless otherwise noted).

MINMAXUNIT
AV DD to GND-0.36V
CLR, D IN , LDAC, SCLK and SYNC input voltage to GND-0.3AV DD + 0.3V
V OUT [A, B] to GND-0.3AV DD + 0.3V
V REFIN /V REFOUT to GND-0.3AV DD + 0.3V
Operating temperature range-40125°C
Junction temperature, T J150°C
Storage temperature, T stg-65150°C

over operating ambient temperature range (unless otherwise noted)

MINNOMMAXUNIT
POWER SUPPLY
Supply voltageAV DD to GND2.75.5V
DIGITAL INPUTS
Digital input voltageCLR, D IN , LDAC, SCLK and SYNC0AV DDV
REFERENCE INPUT
V REFINReference input voltage0AV DDV
TEMPERATURE RANGE
T AOperating ambient temperature-40125°C

DAC8562 Thermal Information

THERMALMETRICDAC756x, DAC816x, DAC856x - DSC (WSON) - 10 PINSDAC756x, DAC816x, DAC856x - DGS (VSSOP) - 10 PINSUNIT
R θ JAJunction-to-ambient thermal resistance62.8173.8°C/W
R θ JC(top)Junction-to-case (top) thermal resistance44.348.5°C/W
R θ JBJunction-to-board thermal resistance26.579.9°C/W
ψ JTJunction-to-top characterization parameter0.41.7°C/W
ψ JBJunction-to-board characterization parameter25.568.4°C/W
R θ JC(bot)Junction-to-case (bottom) thermal resistance46.2N/A°C/W

DAC8562 Typical Application

$$V_{\text{OUT}} = \frac{R_{\text{G}}}{2} \times \left( \frac{V_{\text{DAC}} - V_{\text{REF}}}{R_{\text{SET}}} \right)$$

When configured for current mode, the XTR300 routes the internal output of its current copy circuitry to the SET pin. This provides feedback for the internal OPA driver based on 1 / 10th of the output current, resulting in a voltage-to-current transfer function. Generating bipolar current outputs from the single-ended DAC output voltage, VDAC, requires the application of an offset to the XTR300 SET pin. Connect the RSET resistor from the SET pin to VREF to apply the offset and obtain the transfer function shown in Equation 6.

$$I_{\mathrm{OUT}} = 10 \times \left(\frac{V_{\mathrm{DAC}} - V_{\mathrm{REF}}}{R_{\mathrm{SET}}}\right)$$

The desired output ranges for VDAC and VREF voltages determine the RSET and RG resistor values, calculated using Equation 7 and Equation 8. The system design requires a VDAC voltage range of 0.04 V to 4.96 V in order to operate the DAC8563 in the specified linear output range from codes 512 to 65 024.

$${\mathrm{R}}{\mathrm{SET}}=10\times\left(\frac{\mathrm{V}{\mathrm{DAC}}-\mathrm{V}{\mathrm{REF}}}{\mathrm{I}{\mathrm{OUT}}}\right)=10\times\left(\frac{4.96\text{ V}-2.5\text{ V}}{0.024\text{ A}}\right)=1025\ \Omega$$

$$R_{\text{G}} = \frac{2 \times V_{\text{OUT_MAX}} \times R_{\text{SET}}}{V_{\text{DAC}} - V_{\text{REF}}} = \frac{2 \times 10\text{ V} \times 1020\ \Omega}{4.96\text{ V} - 2.5\text{ V}} = 8292\ \Omega$$

IMON and IAOUT accomplish load monitoring. The sizing of RIMON and RIA determine the monitoring output voltage across the resistors. Size the resistors according to Equation 9 and Equation 10 and the expected output load current IDRV.

$$R_{\mathrm{IMON}} = \frac{10 \times V_{\mathrm{IMON}}}{I_{\mathrm{DRV}}}$$

$$R_{IA} = \frac{10 \times V_{IA}}{I_{IA}}$$

For more detailed information about the design procedure of this circuit and how to isolate it, see Two-Channel Source/Sink Combined Voltage & Current Output, Isolated, EMC/EMI Tested Reference Design (TIDU434).

Variants on the same datasheet

These parts have exact links to the same datasheet. They are candidates to compare, not verified drop-in replacements; check package, pinout and electrical limits.

Part NumberManufacturerPackage
DAC8562-Q1Analog Devices—
DAC8562SDGSRAnalog DevicesVSSOP-10
DAC8562SDGSR.AAnalog DevicesVSSOP-10
DAC8562SDGSTAnalog DevicesVSSOP-10
DAC8562SDGST.AAnalog DevicesVSSOP-10
DAC8562SDSCRAnalog DevicesWSON-10 3x3mm
DAC8562SDSCR.AAnalog DevicesWSON-10
DAC8562SDSCTAnalog DevicesWSON-10
DAC8562SDSCT.AAnalog DevicesWSON-10 3x3mm

Other ADC / DAC

  • ADS1115 – Texas Instruments, Analog-to-Digital Converter
  • PCM1865DBTR – Texas Instruments, Audio ADC
  • AD5065 – Analog Devices, Digital-to-Analog Converter
  • AD5671R – Analog Devices, Digital-to-Analog Converter (DAC)
  • AD5675R – Analog Devices, Digital-to-Analog Converter (DAC)
  • AD5675RACPZ-REEL7 – Analog Devices, Digital-to-Analog Converter (DAC)
  • AD5675RACPZ-RL – Analog Devices, Digital-to-Analog Converter (DAC)
  • AD5675RARUZ – Analog Devices, Digital-to-Analog Converter (DAC)

All ADC / DAC datasheetsAll Texas Instruments datasheets (2,442)

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